세계의 반도체 전기도금 시스템(도금 장비) 시장(2024년)

The global Semiconductor Electroplating Systems (Plating Equipment) market was valued at US$ 559 million in 2023 and is anticipated to reach US$ 854 million by 2030, witnessing a CAGR of 6.02% during the forecast period 2024-2030.

North American market for Semiconductor Electroplating Systems (Plating Equipment) is estimated to increase from $ 63 million in 2023 to reach $ 90 million by 2030, at a CAGR of 4.54 % during the forecast period of 2024 through 2030.

Asia-Pacific market for Semiconductor Electroplating Systems (Plating Equipment) is estimated to increase from $ 465 million in 2023 to reach $ 724 million by 2030, at a CAGR of 6.33% during the forecast period of 2024 through 2030.

The major global manufacturers of Semiconductor Electroplating Systems (Plating Equipment) include Lam Research, Applied Materials, ACM Research, ASMPT, TKC, Besi, ClassOne Technology, TANAKA Precious Metals, and RENA Technologies, etc. In 2023, the world's top three vendors accounted for approximately 54% of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Semiconductor Electroplating Systems (Plating Equipment), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Electroplating Systems (Plating Equipment).

The Semiconductor Electroplating Systems (Plating Equipment) market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Electroplating Systems (Plating Equipment) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor Electroplating Systems (Plating Equipment) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

• Lam Research
• Applied Materials
• ACM Research
• ASMPT
• TKC
• Besi
• ClassOne Technology
• TANAKA Precious Metals
• RENA Technologies
• Ramgraber GmbH
• Suzhou Zhicheng
• Technic
• Shanghai Sinyang
• Amerimade
• Guangzhou Great Chieftain Electronics

by Type

• Full-automatic
• Semi-automatic
• Manual

by Application

• Front Copper Plating
• Back-end Advanced Packaging

Production by Region

• US
• Europe
• Others

Consumption by Region

• North America
• U.S.
• Canada
• Asia-Pacific
• China
• Japan
• South Korea
• China Taiwan
• Southeast Asia
• Europe
• Germany
• France
• U.K.
• Italy
• Netherlands
• Rest of Europe

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Semiconductor Electroplating Systems (Plating Equipment) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Semiconductor Electroplating Systems (Plating Equipment) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Semiconductor Electroplating Systems (Plating Equipment) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: The main points and conclusions of the report.

Table of Contents

1 Semiconductor Electroplating Systems (Plating Equipment) Market Overview

• 1.1 Product Definition
  • 1.1.1 Semiconductor Electroless Plating
• 1.2 Semiconductor Electroplating Systems (Plating Equipment) by Type
  • 1.2.1 Global Semiconductor Electroplating Systems (Plating Equipment) Market Value Growth Rate Analysis by Type: 2023 VS 2030
  • 1.2.2 Full-automatic
  • 1.2.3 Semi-automatic
  • 1.2.4 Manual
• 1.3 Semiconductor Electroplating Systems (Plating Equipment) by Application
  • 1.3.1 Global Semiconductor Electroplating Systems (Plating Equipment) Market Value Growth Rate Analysis by Application: 2023 VS 2030
  • 1.3.2 Front Copper Plating
  • 1.3.3 Back-end Advanced Packaging
• 1.4 Global Market Growth Prospects
  • 1.4.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value Estimates and Forecasts (2019-2030)
  • 1.4.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Estimates and Forecasts (2019-2030)
  • 1.4.3 Global Semiconductor Electroplating Systems (Plating Equipment) Market Average Price Estimates and Forecasts (2019-2030)
• 1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

• 2.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Market Share by Manufacturers (2019-2024)
• 2.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value Market Share by Manufacturers (2019-2024)
• 2.3 Global Key Players of Semiconductor Electroplating Systems (Plating Equipment), Industry Ranking, 2022 VS 2023
• 2.4 Global Semiconductor Electroplating Systems (Plating Equipment) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 2.5 Global Semiconductor Electroplating Systems (Plating Equipment) Average Price by Manufacturers (2019-2024)
• 2.6 Global Semiconductor Electroplating Systems (Plating Equipment) Market Competitive Situation and Trends
  • 2.6.1 Global Semiconductor Electroplating Systems (Plating Equipment) Market Concentration Rate
  • 2.6.2 Global 5 and 10 Largest Semiconductor Electroplating Systems (Plating Equipment) Players Market Share by Revenue

3 Semiconductor Electroplating Systems (Plating Equipment) Production by Region

• 3.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
• 3.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Region (2019-2030)
  • 3.2.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value Market Share by Region (2019-2024)
  • 3.2.2 Global Forecasted Production Value of Semiconductor Electroplating Systems (Plating Equipment) by Region (2025-2030)
• 3.3 Global Semiconductor Electroplating Systems (Plating Equipment) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
• 3.4 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Region (2019-2030)
  • 3.4.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Market Share by Region (2019-2024)
  • 3.4.2 Global Forecasted Production of Semiconductor Electroplating Systems (Plating Equipment) by Region (2025-2030)
• 3.5 Global Semiconductor Electroplating Systems (Plating Equipment) Market Price Analysis by Region (2019-2024)
• 3.6 Global Semiconductor Electroplating Systems (Plating Equipment) Production and Value, Year-over-Year Growth
  • 3.6.1 US Semiconductor Electroplating Systems (Plating Equipment) Production Value Estimates and Forecasts (2019-2030)
  • 3.6.2 Europe Semiconductor Electroplating Systems (Plating Equipment) Production Value Estimates and Forecasts (2019-2030)
  • 3.6.3 Others Semiconductor Electroplating Systems (Plating Equipment) Production Value Estimates and Forecasts (2019-2030)

4 Semiconductor Electroplating Systems (Plating Equipment) Consumption by Region

• 4.1 Global Semiconductor Electroplating Systems (Plating Equipment) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
• 4.2 Global Semiconductor Electroplating Systems (Plating Equipment) Consumption by Region (2019-2030)
  • 4.2.1 Global Semiconductor Electroplating Systems (Plating Equipment) Consumption by Region (2019-2030)
  • 4.2.2 Global Semiconductor Electroplating Systems (Plating Equipment) Forecasted Consumption by Region (2025-2030)
• 4.3 North America
  • 4.3.1 North America Semiconductor Electroplating Systems (Plating Equipment) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
  • 4.3.2 North America Semiconductor Electroplating Systems (Plating Equipment) Consumption by Country (2019-2030)
  • 4.3.3 U.S.
  • 4.3.4 Canada
• 4.4 Europe
  • 4.4.1 Europe Semiconductor Electroplating Systems (Plating Equipment) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
  • 4.4.2 Europe Semiconductor Electroplating Systems (Plating Equipment) Consumption by Country (2019-2030)
• 4.5 Asia Pacific
  • 4.5.1 Asia Pacific Semiconductor Electroplating Systems (Plating Equipment) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
  • 4.5.2 Asia Pacific Semiconductor Electroplating Systems (Plating Equipment) Consumption by Region (2019-2030)
  • 4.5.3 China
  • 4.5.4 Japan
  • 4.5.5 South Korea
  • 4.5.6 China Taiwan

5 Segment by Type

• 5.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Type (2019-2030)
  • 5.1.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Type (2019-2024)
  • 5.1.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Type (2025-2030)
  • 5.1.3 Global Semiconductor Electroplating Systems (Plating Equipment) Production Market Share by Type (2019-2030)
• 5.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Type (2019-2030)
  • 5.2.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Type (2019-2024)
  • 5.2.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Type (2025-2030)
  • 5.2.3 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value Market Share by Type (2019-2030)
• 5.3 Global Semiconductor Electroplating Systems (Plating Equipment) Price by Type (2019-2030)

6 Segment by Application

• 6.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Application (2019-2030)
  • 6.1.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Application (2019-2024)
  • 6.1.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production by Application (2025-2030)
  • 6.1.3 Global Semiconductor Electroplating Systems (Plating Equipment) Production Market Share by Application (2019-2030)
• 6.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Application (2019-2030)
  • 6.2.1 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Application (2019-2024)
  • 6.2.2 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value by Application (2025-2030)
  • 6.2.3 Global Semiconductor Electroplating Systems (Plating Equipment) Production Value Market Share by Application (2019-2030)
• 6.3 Global Semiconductor Electroplating Systems (Plating Equipment) Price by Application (2019-2030)

7 Key Companies Profiled

• 7.1 Lam Research
  • 7.1.1 Lam Research Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.1.2 Lam Research Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.1.3 Lam Research Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.1.4 Lam Research Main Business and Markets Served
  • 7.1.5 Lam Research Recent Developments/Updates
• 7.2 Applied Materials
  • 7.2.1 Applied Materials Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.2.2 Applied Materials Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.2.3 Applied Materials Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.2.4 Applied Materials Main Business and Markets Served
  • 7.2.5 Applied Materials Recent Developments/Updates
• 7.3 ACM Research
  • 7.3.1 ACM Research Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.3.2 ACM Research Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.3.3 ACM Research Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.3.4 ACM Research Main Business and Markets Served
• 7.4 ASMPT
  • 7.4.1 ASMPT Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.4.2 ASMPT Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.4.3 ASMPT Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.4.4 ASMPT Main Business and Markets Served
• 7.5 TKC
  • 7.5.1 TKC Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.5.2 TKC Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.5.3 TKC Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.5.4 TKC Main Business and Markets Served
• 7.6 Besi
  • 7.6.1 Besi Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.6.2 Besi Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.6.3 Besi Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.6.4 Besi Main Business and Markets Served
• 7.7 ClassOne Technology
  • 7.7.1 ClassOne Technology Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.7.2 ClassOne Technology Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.7.3 ClassOne Technology Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.7.4 ClassOne Technology Main Business and Markets Served
  • 7.7.5 ClassOne Technology Recent Developments/Updates
• 7.8 TANAKA Precious Metals
  • 7.8.1 TANAKA Precious Metals Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.8.2 TANAKA Precious Metals Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.8.3 TANAKA Precious Metals Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.8.4 TANAKA Precious Metals Main Business and Markets Served
  • 7.8.5 TANAKA Precious Metals Recent Developments/Updates
• 7.9 RENA Technologies
  • 7.9.1 RENA Technologies Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.9.2 RENA Technologies Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.9.3 RENA Technologies Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.9.4 RENA Technologies Main Business and Markets Served
  • 7.9.5 RENA Technologies Recent Developments/Updates
• 7.10 Ramgraber GmbH
  • 7.10.1 Ramgraber GmbH Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.10.2 Ramgraber GmbH Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.10.3 Ramgraber GmbH Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.10.4 Ramgraber GmbH Main Business and Markets Served
• 7.11 Suzhou Zhicheng Semiconductor Technology
  • 7.11.1 Suzhou Zhicheng Semiconductor Technology Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.11.2 Suzhou Zhicheng Semiconductor Technology Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.11.3 Suzhou Zhicheng Semiconductor Technology Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.11.4 Suzhou Zhicheng Semiconductor Technology Main Business and Markets Served
• 7.12 Technic
  • 7.12.1 Technic Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.12.2 Technic Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.12.3 Technic Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.12.4 Technic Main Business and Markets Served
• 7.13 Shanghai Sinyang
  • 7.13.1 Shanghai Sinyang Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.13.2 Shanghai Sinyang Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.13.3 Shanghai Sinyang Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.13.4 Shanghai Sinyang Main Business and Markets Served
• 7.14 Amerimade
  • 7.14.1 Amerimade Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.14.2 Amerimade Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.14.3 Amerimade Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.14.4 Amerimade Main Business and Markets Served
• 7.15 Guangzhou Great Chieftain Electronics Machinery
  • 7.15.1 Guangzhou Great Chieftain Electronics Machinery Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.15.2 Guangzhou Great Chieftain Electronics Machinery Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.15.3 Guangzhou Great Chieftain Electronics Machinery Semiconductor Electroplating Systems (Plating Equipment) Production, Value, Price and Gross Margin (2019-2024)
  • 7.15.4 Guangzhou Great Chieftain Electronics Machinery Main Business and Markets Served
• 7.16 EBARA
  • 7.16.1 EBARA Semiconductor Electroplating Systems (Plating Equipment) Company Information
  • 7.16.2 EBARA Semiconductor Electroplating Systems (Plating Equipment) Product Portfolio
  • 7.16.3 EBARA Main Business and Markets Served

8 Industry Chain and Sales Channels Analysis

• 8.1 Semiconductor Electroplating Systems (Plating Equipment) Industry Chain Analysis
• 8.2 Semiconductor Electroplating Systems (Plating Equipment) Key Raw Materials
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers (Part)
  • 8.2.3 Semiconductor Electroplating Solution Key Suppliers
• 8.3 Semiconductor Electroplating Systems (Plating Equipment) Production Mode & Process
• 8.4 Semiconductor Electroplating Systems (Plating Equipment) Sales and Marketing
  • 8.4.1 Semiconductor Electroplating Systems (Plating Equipment) Sales Channels
  • 8.4.2 Semiconductor Electroplating Systems (Plating Equipment) Distributors
• 8.5 Semiconductor Electroplating Systems (Plating Equipment) Customers

9 Semiconductor Electroplating Systems (Plating Equipment) Market Dynamics

• 9.1 Semiconductor Electroplating Systems (Plating Equipment) Industry Trends
• 9.2 Semiconductor Electroplating Systems (Plating Equipment) Market Drivers
• 9.3 Semiconductor Electroplating Systems (Plating Equipment) Market Challenges and Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

• 11.1 Methodology/Research Approach
  • 11.1.1 Research Programs/Design
  • 11.1.2 Market Size Estimation
  • 11.1.3 Market Breakdown and Data Triangulation
• 11.2 Data Source
  • 11.2.1 Secondary Sources
  • 11.2.2 Primary Sources
• 11.3 Author List
• 11.4 Disclaimer