½ÃÀ庸°í¼­
»óǰÄÚµå
1664557

¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå Àü¸Á(2025³â)

Global Aluminum Nitride Substrates Market Outlook 2025

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: QYResearch | ÆäÀÌÁö Á¤º¸: ¿µ¹® | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

¼¼°èÀÇ AlN ¼¼¶ó¹Í ±âÆÇ ½ÃÀå ±Ô¸ð´Â 2024³â¿¡ ¾à 1¾ï 7,000¸¸ ´Þ·¯·Î, 2031³â±îÁö 2¾ï 7,740¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, 2025-2031³â¿¡ CAGR·Î 6.63%ÀÇ ¼ºÀåÀÌ Àü¸ÁµË´Ï´Ù.

2024³â, Áß±¹ÀÌ ÀϺ»À» Á¦Ä¡°í ¼¼°è ÃÖ´ëÀÇ AlN ¼¼¶ó¹Í ±âÆÇ »ý»ê±¹ÀÌ µÇ¾úÀ¸¸ç, »ý»ê ±Ý¾×Àº Áß±¹ÀÌ 49.0%, ÀϺ»ÀÌ 42.9%¸¦ Â÷ÁöÇÕ´Ï´Ù. ÀϺ»¿¡¼­´Â Maruwa, Kyocera, Toshiba Materials, TD Power Materials, DenkaµîÀÌ ÁÖ¿ä Á¦Á¶¾÷ü¿©, Áß±¹ º»Åä¿¡¼­´Â Fujian Huaqing Electronic Material Technology, Wuxi Hygood New Technology, Zhuzhou Ascendus New Material Technology, Shengda Tech, Shandong Sinocera Functional Material µîÀÌ ÁÖ¿ä Á¦Á¶¾÷üÀÔ´Ï´Ù.

2024³â, ¼¼°è »óÀ§ 8»çÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå Á¡À¯À²Àº 81.8%ÀÔ´Ï´Ù. ÃÖ±Ù, Áß±¹ ½ÃÀåÀº ¸Å¿ì Ȱ¹ßÇϸç, Ningxia Ascendus, Shengda Tech, Sinoceram Technology(zhengzhou) Co., Ltd, Zhejiang Zhengtian New Materials, Hexagold Electronic Technology, Fujian ZINGIN New Material Technology, Shandong Sinocera Functional Material, Chengdu Xuci New Material, Hebei Sinopack Electronic Technology µî ¸¹Àº ½Å±Ô Âü¿© ±â¾÷ÀÌ ÀÌ »ê¾÷¿¡ Âü¿©Çϰí ÀÖ½À´Ï´Ù.

¾Æ½Ã¾ÆÅÂÆò¾çÀº ÃÖ´ë ½ÃÀåÀ̸ç, Á¡À¯À²Àº ¾à 83.6%ÀÔ´Ï´Ù. ÁÖ¿ä ¼Òºñ±¹Àº ÀϺ», Áß±¹ º»Åä, Çѱ¹, ´ë¸¸À̸ç, À̰ÍÀº DPC ¼¼¶ó¹Í ±âÆÇ, DBC ¼¼¶ó¹Í ±âÆÇ, AMB ¼¼¶ó¹Í ±âÆÇÀÇ ¿Õ¼ºÇÑ ¼ö¿ä¿¡ ÀÇÇÑ °ÍÀÔ´Ï´Ù. Áß±¹Àº DPC, DBC, AMB ¼¼¶ó¹Í ±âÆÇÀÇ ÃÖ´ë »ý»ê±¹ÀÔ´Ï´Ù. Áß±¹ ´ë¸¸Àº DPC ¼¼¶ó¹Í ±âÆÇÀÇ 2À§ »ý»ê±¹À̸ç, À¯·´°ú ÀϺ»Àº DBC/AMB ¼¼¶ó¹Í ±âÆÇÀÇ ÁÖ¿ä »ý»êÁöÀÔ´Ï´Ù.

¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå¿¡ ´ëÇØ Á¶»çºÐ¼®ÇßÀ¸¸ç, °¢ Áö¿ªÀÇ ½ÃÀå ±Ô¸ð¿Í ¿¹Ãø, °æÀï ±¸µµ, ÁÖ¿ä ±â¾÷ÀÇ °³¿ä, ±â¼ú µ¿Çâ, ½ÅÁ¦Ç° °³¹ß µîÀÇ Á¤º¸¸¦ Á¦°øÇϰí ÀÖ½À´Ï´Ù.

¸ñÂ÷

Á¦1Àå ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå °³¿ä

  • Á¦Ç° Á¤ÀÇ
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ : ¿­ÀüµµÀ²(25¡É)º°
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå ±Ý¾× ¼ºÀå·ü ºÐ¼® : ¿­ÀüµµÀ²(25¡É)º°(2024³â¡¤2031³â)
    • AlN-170
    • AlN-200
    • ±âŸ(AlN-230, 150, 180W/mK µî)
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ : ¿ëµµº°
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå ±Ý¾× ¼ºÀå·ü ºÐ¼® : ¿ëµµº°(2024³â¡¤2031³â)
    • ÆÄ¿ö ¸ðµâ
    • LED
    • ±¤Åë½Å, ·¹ÀÌÀú, TEC(¿­ÀüÄð·¯)
    • Ç×°ø¿ìÁÖ¡¤±º
    • ±âŸ
  • ¼¼°è ½ÃÀåÀÇ ¼ºÀå Àü¸Á
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê Ãß»ê°ú ¿¹Ãø(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå Æò±Õ °¡°Ý Ãß»ê°ú ¿¹Ãø(2020-2031³â)
  • ÀüÁ¦Á¶°Ç°ú Á¦ÇÑ

Á¦2Àå °¢ Á¦Á¶¾÷ü ½ÃÀå °æÀï

  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ½ÃÀå Á¡À¯À² : Á¦Á¶¾÷üº°(2020-2025³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× ½ÃÀå Á¡À¯À² : Á¦Á¶¾÷üº°(2020-2025³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå Á¡À¯À² : ±â¾÷ À¯Çüº°(Tier 1¡¤Tier 2¡¤Tier 3)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ Æò±Õ °¡°Ý : Á¦Á¶¾÷üº°(2020-2025³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇÀÇ ÁÖ¿ä Á¦Á¶¾÷ü, Á¦Á¶ ±â¹Ý, º»»ç
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇÀÇ ÁÖ¿ä Á¦Á¶¾÷ü, Á¦Ç° À¯Çü, ¿ëµµ
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀåÀÇ °æÀï ±¸µµ¿Í µ¿Çâ
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå ÁýÁßµµ
    • ¼¼°èÀÇ 3´ë¡¤5´ë ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ Á¦Á¶¾÷ü ¸ÅÃâ ½ÃÀå Á¡À¯À²
  • ÇÕº´°ú Àμö, È®´ë
  • ¸ÞÅ»¶óÀÌÁîµå AlN ¼¼¶ó¹Í ±âÆÇ

Á¦3Àå ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : Áö¿ªº°

  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø : Áö¿ªº°(2020³â¡¤2024³â¡¤2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : Áö¿ªº°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× ½ÃÀå Á¡À¯À² : Áö¿ªº°(2020-2025³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× ¿¹Ãø : Áö¿ªº°(2026-2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê Ãß»ê°ú ¿¹Ãø : Áö¿ªº°(2020³â¡¤2024³â¡¤2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : Áö¿ªº°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ½ÃÀå Á¡À¯À² : Áö¿ªº°(2020-2025³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ¿¹Ãø : Áö¿ªº°(2026-2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀåÀÇ °¡°Ý ºÐ¼® : Áö¿ªº°(2020-2025³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê°ú ±Ý¾×, Àü³â´ëºñ ¼ºÀå
    • ºÏ¹ÌÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø(2020-2031³â)
    • À¯·´ÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø(2020-2031³â)
    • Áß±¹ÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø(2020-2031³â)
    • ÀϺ»ÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø(2020-2031³â)
    • Áß±¹ ´ë¸¸ÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× Ãß»ê°ú ¿¹Ãø(2020-2031³â)

Á¦4Àå ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ : Áö¿ªº°

  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ Ãß»ê°ú ¿¹Ãø : Áö¿ªº°(2020³â¡¤2024³â¡¤2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ : Áö¿ªº°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ : Áö¿ªº°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ ¿¹Ãø : Áö¿ªº°(2026-2031³â)
  • ºÏ¹Ì
    • ºÏ¹ÌÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼ÒºñÀÇ ¼ºÀå·ü : ±¹°¡º°(2020³â¡¤2024³â¡¤2031³â)
    • ºÏ¹ÌÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ : ±¹°¡º°(2020-2031³â)
    • ¹Ì±¹
    • ij³ª´Ù
  • À¯·´
    • À¯·´ÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼ÒºñÀÇ ¼ºÀå·ü : ±¹°¡º°(2020³â¡¤2024³â¡¤2031³â)
    • À¯·´ÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ : ±¹°¡º°(2020-2031³â)
    • µ¶ÀÏ
    • ÇÁ¶û½º
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • µ§¸¶Å©¿Í ½ºÀ§½º
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼ÒºñÀÇ ¼ºÀå·ü : ±¹°¡º°(2020³â¡¤2024³â¡¤2031³â)
    • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ(2020-2031³â)
    • Áß±¹
    • ÀϺ»
    • Çѱ¹
    • Áß±¹ ´ë¸¸
    • µ¿³²¾Æ½Ã¾Æ
    • Àεµ
  • ³²¹Ì
    • ³²¹ÌÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼ÒºñÀÇ ¼ºÀå·ü : ±¹°¡º°(2020³â¡¤2024³â¡¤2031³â)
    • ³²¹ÌÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ¼Òºñ : ±¹°¡º°(2020-2031³â)

Á¦5Àå ºÎ¹® : ¿­ÀüµµÀ²(25¡É)º°

  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : ¿­ÀüµµÀ²(25¡É)º°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : ¿­ÀüµµÀ²(25¡É)º°(2020-2025³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : ¿­ÀüµµÀ²(25¡É)º°(2026-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ½ÃÀå Á¡À¯À² : ¿­ÀüµµÀ²(25¡É)º°(2020-2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : ¿­ÀüµµÀ²(25¡É)º°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : ¿­ÀüµµÀ²(25¡É)º°(2020-2025³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : ¿­ÀüµµÀ²(25¡É)º°(2026-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× ½ÃÀå Á¡À¯À² : ¿­ÀüµµÀ²(25¡É)º°(2020-2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇÀÇ °¡°Ý : ¿­ÀüµµÀ²(25¡É)º°(2020-2031³â)

Á¦6Àå ºÎ¹® : ¿ëµµº°

  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : ¿ëµµº°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : ¿ëµµº°(2020-2025³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê : ¿ëµµº°(2026-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ½ÃÀå Á¡À¯À² : ¿ëµµº°(2020-2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : ¿ëµµº°(2020-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : ¿ëµµº°(2020-2025³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× : ¿ëµµº°(2026-2031³â)
    • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ±Ý¾× ½ÃÀå Á¡À¯À² : ¿ëµµº°(2020-2031³â)
  • ¼¼°èÀÇ ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ °¡°Ý : ¿ëµµº°(2020-2031³â)

Á¦7Àå ÁÖ¿ä ±â¾÷ÀÇ °³¿ä

  • Maruwa
  • Toshiba Materials
  • CeramTec
  • Denka
  • TD Power Materials
  • Kyocera
  • CoorsTek
  • LEATEC Fine Ceramics
  • Fujian Huaqing Electronic Material Technology
  • Wuxi Hygood New Technology
  • Zhuzhou Ascendus New Material Technology
  • Shengda Tech
  • Chaozhou Three-Circle(Group)
  • Sinoceram Technology(zhengzhou) Co., Ltd
  • Zhejiang Zhengtian New Materials
  • SiChuan Liufang Yucheng Electronic Technology
  • Fujian ZINGIN New Material Technology
  • Shandong Sinocera Functional Material
  • Hebei Sinopack Electronic Technology
  • Chengdu Xuci New Material

Á¦8Àå »ê¾÷ üÀΰú ÆÇ¸Åä³Î ºÐ¼®

  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ê¾÷ üÀÎ ºÐ¼®
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇÀÇ ÁÖ¿ä ¿øÀç·á
    • ÁÖ¿ä ¿øÀç·á
    • ¿øÀç·áÀÇ ÁÖ¿ä °ø±Þ¾÷ü
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ý»ê ¹æ½Ä°ú ÇÁ·Î¼¼½º
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ÆÇ¸Å¿Í ¸¶ÄÉÆÃ
    • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ÆÇ¸Å ä³Î
    • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ÆÇ¸Å¾÷ü
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ °í°´

Á¦9Àå ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå ¿ªÇÐ

  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ »ê¾÷ µ¿Çâ
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå ÃËÁø¿äÀÎ
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀåÀÌ ÇØ°áÇØ¾ß ÇÒ °úÁ¦
  • ÁúÈ­ ¾Ë·ç¹Ì´½ ±âÆÇ ½ÃÀå ¾ïÁ¦¿äÀÎ

Á¦10Àå Á¶»ç °á°ú¿Í °á·Ð

Á¦11Àå Á¶»ç ¹æ¹ý°ú µ¥ÀÌÅÍ ¼Ò½º

KSA 25.03.17

The global AlN ceramic substrates market size was about US$ 170 million in 2024 and is forecast to a readjusted size of US$ 277.4 million by 2031 with a CAGR of 6.63% during 2025-2031.

In 2024, China surpassed Japan to become the world's largest AlN ceramic substrates producer, with China and Japan accounting for 49.0% and 42.9% of the production value respectively. In Japan, the key manufacturers include Maruwa, Kyocera, Toshiba Materials, TD Power Materials, and Denka, etc. while in China mainland the key manufacturers include Fujian Huaqing Electronic Material Technology, Wuxi Hygood New Technology, Zhuzhou Ascendus New Material Technology, Shengda Tech, and Shandong Sinocera Functional Material, etc.

In 2024, the global top eight players have a 81.8% market share of Aluminum Nitride Substrates. In recent years, the Chinese market is very active, lots of new entrants enter this industry, such as Ningxia Ascendus, Shengda Tech, Sinoceram Technology (zhengzhou) Co., Ltd, Zhejiang Zhengtian New Materials, Hexagold Electronic Technology, Fujian ZINGIN New Material Technology, Shandong Sinocera Functional Material, Chengdu Xuci New Material and Hebei Sinopack Electronic Technology.

Asia-Pacific is the largest market, with a share about 83.6%, key consumers are Japan, China mainland, South Korea, Chinses Taiwan, driven by the strong demand from DPC ceramic substrates, DBC ceramic substrates and AMB ceramic substrates. China is the largest producer of DPC, DBC and AMB ceramic substrates. China Taiwan is the second largest producer of DPC ceramic substrates, while Europe and Japan, are key producer of DBC and AMB ceramic substrates.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Aluminum Nitride Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Aluminum Nitride Substrates.

The Aluminum Nitride Substrates market size, estimations, and forecasts are provided in terms of output/shipments (Square Meters) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Aluminum Nitride Substrates market comprehensively. Regional market sizes, concerning products by Thermal Coductivity (25°C), by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Aluminum Nitride Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Thermal Coductivity (25°C), by Application, and by regions.

By Company

  • Maruwa
  • TD Power Materials
  • Fujian Huaqing Electronic Material
  • Denka
  • Wuxi Hygood New Technology
  • Zhuzhou Ascendus New Material
  • Toshiba Materials
  • Zhejiang Xinna Ceramic New Material
  • LEATEC Fine Ceramics
  • Sinoceram Technology (zhengzhou)
  • Kyocera
  • Zhejiang Zhengtian New Materials
  • CeramTec
  • Chaozhou Three-Circle (Group)
  • Shengda Tech
  • Fujian ZINGIN New Material Technology
  • CoorsTek
  • SiChuan Liufang Yucheng Electronic
  • Shandong Sinocera Functional Material
  • Hebei Sinopack Electronic Technology
  • Chengdu Xuci New Material

By Thermal Coductivity (25°C)

  • AlN-170
  • AlN-200
  • Others

By Application

  • IGBT Module & Automotive
  • LED
  • Optical Communication and Laser
  • Aerospace & Military
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan
  • China Taiwan

Consumption by Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Asia-Pacific
  • China
  • Japan
  • South Korea
  • China Taiwan
  • Southeast Asia
  • India
  • Europe
  • Germany
  • Denmark and Switzerland
  • U.K.
  • France
  • Italy
  • South America
  • Brazil
  • Rest of South America

Core Chapters

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Thermal Coductivity (25°C), by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Aluminum Nitride Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Aluminum Nitride Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Aluminum Nitride Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Thermal Coductivity (25°C), covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: The main points and conclusions of the report.

Table of Contents

1 Aluminum Nitride Substrates Market Overview

  • 1.1 Product Definition
  • 1.2 Aluminum Nitride Substrates by Thermal Coductivity (25°C)
    • 1.2.1 Global Aluminum Nitride Substrates Market Value Growth Rate Analysis by Thermal Coductivity (25°C): 2024 VS 2031
    • 1.2.2 AlN-170
    • 1.2.3 AlN-200
    • 1.2.4 Others (like AlN-230, 150, 180 W/mK, etc.)
  • 1.3 Aluminum Nitride Substrates by Application
    • 1.3.1 Global Aluminum Nitride Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031
    • 1.3.2 Power Module
    • 1.3.3 LED
    • 1.3.4 Optical Communication, Laser, and TEC (Thermoelectric Coolers)
    • 1.3.5 Aerospace & Military
    • 1.3.6 Others
  • 1.4 Global Market Growth Prospects
    • 1.4.1 Global Aluminum Nitride Substrates Production Value Estimates and Forecasts (2020-2031)
    • 1.4.2 Global Aluminum Nitride Substrates Production Estimates and Forecasts (2020-2031)
    • 1.4.3 Global Aluminum Nitride Substrates Market Average Price Estimates and Forecasts (2020-2031)
  • 1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

  • 2.1 Global Aluminum Nitride Substrates Production Market Share by Manufacturers (2020-2025)
  • 2.2 Global Aluminum Nitride Substrates Production Value Market Share by Manufacturers (2020-2025)
  • 2.3 Global Aluminum Nitride Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
  • 2.4 Global Aluminum Nitride Substrates Average Price by Manufacturers (2020-2025)
  • 2.5 Global Key Manufacturers of Aluminum Nitride Substrates, Manufacturing Sites & Headquarters
  • 2.6 Global Key Manufacturers of Aluminum Nitride Substrates, Product Type & Application
  • 2.7 Global Aluminum Nitride Substrates Market Competitive Situation and Trends
    • 2.7.1 Global Aluminum Nitride Substrates Market Concentration Rate
    • 2.7.2 Global 3 and 5 Largest Aluminum Nitride Substrates Players Market Share by Revenue
  • 2.8 Mergers & Acquisitions, Expansion
  • 2.9 Metallized AlN Ceramic Substrates

3 Aluminum Nitride Substrates Production by Region

  • 3.1 Global Aluminum Nitride Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 3.2 Global Aluminum Nitride Substrates Production Value by Region (2020-2031)
    • 3.2.1 Global Aluminum Nitride Substrates Production Value Market Share by Region (2020-2025)
    • 3.2.2 Global Forecasted Production Value of Aluminum Nitride Substrates by Region (2026-2031)
  • 3.3 Global Aluminum Nitride Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 3.4 Global Aluminum Nitride Substrates Production by Region (2020-2031)
    • 3.4.1 Global Aluminum Nitride Substrates Production Market Share by Region (2020-2025)
    • 3.4.2 Global Forecasted Production of Aluminum Nitride Substrates by Region (2026-2031)
  • 3.5 Global Aluminum Nitride Substrates Market Price Analysis by Region (2020-2025)
  • 3.6 Global Aluminum Nitride Substrates Production and Value, Year-over-Year Growth
    • 3.6.1 North America Aluminum Nitride Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.2 Europe Aluminum Nitride Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.3 China Aluminum Nitride Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.4 Japan Aluminum Nitride Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.5 China Taiwan Aluminum Nitride Substrates Production Value Estimates and Forecasts (2020-2031)

4 Aluminum Nitride Substrates Consumption by Region

  • 4.1 Global Aluminum Nitride Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 4.2 Global Aluminum Nitride Substrates Consumption by Region (2020-2031)
    • 4.2.1 Global Aluminum Nitride Substrates Consumption by Region (2020-2031)
    • 4.2.2 Global Aluminum Nitride Substrates Forecasted Consumption by Region (2026-2031)
  • 4.3 North America
    • 4.3.1 North America Aluminum Nitride Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
    • 4.3.2 North America Aluminum Nitride Substrates Consumption by Country (2020-2031)
    • 4.3.3 U.S.
    • 4.3.4 Canada
  • 4.4 Europe
    • 4.4.1 Europe Aluminum Nitride Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
    • 4.4.2 Europe Aluminum Nitride Substrates Consumption by Country (2020-2031)
    • 4.4.3 Germany
    • 4.4.4 France
    • 4.4.5 U.K.
    • 4.4.6 Italy
    • 4.4.7 Denmark and Switzerland
  • 4.5 Asia Pacific
    • 4.5.1 Asia Pacific Aluminum Nitride Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
    • 4.5.2 Asia Pacific Aluminum Nitride Substrates Consumption by Region (2020-2031)
    • 4.5.3 China
    • 4.5.4 Japan
    • 4.5.5 South Korea
    • 4.5.6 China Taiwan
    • 4.5.7 Southeast Asia
    • 4.5.8 India
  • 4.6 South America
    • 4.6.1 South America Aluminum Nitride Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
    • 4.6.2 South America Aluminum Nitride Substrates Consumption by Country (2020-2031)

5 Segment by Thermal Coductivity (25°C)

  • 5.1 Global Aluminum Nitride Substrates Production by Thermal Coductivity (25°C) (2020-2031)
    • 5.1.1 Global Aluminum Nitride Substrates Production by Thermal Coductivity (25°C) (2020-2025)
    • 5.1.2 Global Aluminum Nitride Substrates Production by Thermal Coductivity (25°C) (2026-2031)
    • 5.1.3 Global Aluminum Nitride Substrates Production Market Share by Thermal Coductivity (25°C) (2020-2031)
  • 5.2 Global Aluminum Nitride Substrates Production Value by Thermal Coductivity (25°C) (2020-2031)
    • 5.2.1 Global Aluminum Nitride Substrates Production Value by Thermal Coductivity (25°C) (2020-2025)
    • 5.2.2 Global Aluminum Nitride Substrates Production Value by Thermal Coductivity (25°C) (2026-2031)
    • 5.2.3 Global Aluminum Nitride Substrates Production Value Market Share by Thermal Coductivity (25°C) (2020-2031)
  • 5.3 Global Aluminum Nitride Substrates Price by Thermal Coductivity (25°C) (2020-2031)

6 Segment by Application

  • 6.1 Global Aluminum Nitride Substrates Production by Application (2020-2031)
    • 6.1.1 Global Aluminum Nitride Substrates Production by Application (2020-2025)
    • 6.1.2 Global Aluminum Nitride Substrates Production by Application (2026-2031)
    • 6.1.3 Global Aluminum Nitride Substrates Production Market Share by Application (2020-2031)
  • 6.2 Global Aluminum Nitride Substrates Production Value by Application (2020-2031)
    • 6.2.1 Global Aluminum Nitride Substrates Production Value by Application (2020-2025)
    • 6.2.2 Global Aluminum Nitride Substrates Production Value by Application (2026-2031)
    • 6.2.3 Global Aluminum Nitride Substrates Production Value Market Share by Application (2020-2031)
  • 6.3 Global Aluminum Nitride Substrates Price by Application (2020-2031)

7 Key Companies Profiled

  • 7.1 Maruwa
    • 7.1.1 Maruwa Aluminum Nitride Substrates Company Information
    • 7.1.2 Maruwa Aluminum Nitride Substrates Product Portfolio
    • 7.1.3 Maruwa Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.1.4 Maruwa Main Business and Markets Served
  • 7.2 Toshiba Materials
    • 7.2.1 Toshiba Materials Aluminum Nitride Substrates Company Information
    • 7.2.2 Toshiba Materials Aluminum Nitride Substrates Product Portfolio
    • 7.2.3 Toshiba Materials Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.2.4 Toshiba Materials Main Business and Markets Served
    • 7.2.5 Toshiba Materials Recent Developments/Updates
  • 7.3 CeramTec
    • 7.3.1 CeramTec Aluminum Nitride Substrates Company Information
    • 7.3.2 CeramTec Aluminum Nitride Substrates Product Portfolio
    • 7.3.3 CeramTec Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.3.4 CeramTec Main Business and Markets Served
    • 7.3.5 CeramTec Recent Developments/Updates
  • 7.4 Denka
    • 7.4.1 Denka Aluminum Nitride Substrates Company Information
    • 7.4.2 Denka Aluminum Nitride Substrates Product Portfolio
    • 7.4.3 Denka Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.4.4 Denka Main Business and Markets Served
    • 7.4.5 Denka Recent Developments/Updates
  • 7.5 TD Power Materials
    • 7.5.1 TD Power Materials Aluminum Nitride Substrates Company Information
    • 7.5.2 TD Power Materials Aluminum Nitride Substrates Product Portfolio
    • 7.5.3 TD Power Materials Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.5.4 TD Power Materials Main Business and Markets Served
  • 7.6 Kyocera
    • 7.6.1 Kyocera Aluminum Nitride Substrates Company Information
    • 7.6.2 Kyocera Aluminum Nitride Substrates Product Portfolio
    • 7.6.3 Kyocera Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.6.4 Kyocera Main Business and Markets Served
    • 7.6.5 Kyocera Recent Developments/Updates
  • 7.7 CoorsTek
    • 7.7.1 CoorsTek Aluminum Nitride Substrates Company Information
    • 7.7.2 CoorsTek Aluminum Nitride Substrates Product Portfolio
    • 7.7.3 CoorsTek Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.7.4 CoorsTek Main Business and Markets Served
  • 7.8 LEATEC Fine Ceramics
    • 7.8.1 LEATEC Fine Ceramics Aluminum Nitride Substrates Company Information
    • 7.8.2 LEATEC Fine Ceramics Aluminum Nitride Substrates Product Portfolio
    • 7.8.3 LEATEC Fine Ceramics Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.8.4 LEATEC Fine Ceramics Main Business and Markets Served
  • 7.9 Fujian Huaqing Electronic Material Technology
    • 7.9.1 Fujian Huaqing Electronic Material Technology Aluminum Nitride Substrates Company Information
    • 7.9.2 Fujian Huaqing Electronic Material Technology Aluminum Nitride Substrates Product Portfolio
    • 7.9.3 Fujian Huaqing Electronic Material Technology Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.9.4 Fujian Huaqing Electronic Material Technology Main Business and Markets Served
  • 7.10 Wuxi Hygood New Technology
    • 7.10.1 Wuxi Hygood New Technology Aluminum Nitride Substrates Company Information
    • 7.10.2 Wuxi Hygood New Technology Aluminum Nitride Substrates Product Portfolio
    • 7.10.3 Wuxi Hygood New Technology Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.10.4 Wuxi Hygood New Technology Main Business and Markets Served
  • 7.11 Zhuzhou Ascendus New Material Technology
    • 7.11.1 Zhuzhou Ascendus New Material Technology Aluminum Nitride Substrates Company Information
    • 7.11.2 Zhuzhou Ascendus New Material Technology Aluminum Nitride Substrates Product Portfolio
    • 7.11.3 Zhuzhou Ascendus New Material Technology Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.11.4 Zhuzhou Ascendus New Material Technology Main Business and Markets Served
  • 7.12 Shengda Tech
    • 7.12.1 Shengda Tech Aluminum Nitride Substrates Company Information
    • 7.12.2 Shengda Tech Aluminum Nitride Substrates Product Portfolio
    • 7.12.3 Shengda Tech Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.12.4 Shengda Tech Main Business and Markets Served
  • 7.13 Chaozhou Three-Circle (Group)
    • 7.13.1 Chaozhou Three-Circle (Group) Aluminum Nitride Substrates Company Information
    • 7.13.2 Chaozhou Three-Circle (Group) Aluminum Nitride Substrates Product Portfolio
    • 7.13.3 Chaozhou Three-Circle (Group) Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.13.4 Chaozhou Three-Circle (Group) Main Business and Markets Served
  • 7.14 Sinoceram Technology (zhengzhou) Co., Ltd
    • 7.14.1 Sinoceram Technology (zhengzhou) Co., Ltd Aluminum Nitride Substrates Company Information
    • 7.14.2 Sinoceram Technology (zhengzhou) Co., Ltd Aluminum Nitride Substrates Product Portfolio
    • 7.14.3 Sinoceram Technology (zhengzhou) Co., Ltd Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.14.4 Sinoceram Technology (zhengzhou) Co., Ltd Main Business and Markets Served
  • 7.15 Zhejiang Zhengtian New Materials
    • 7.15.1 Zhejiang Zhengtian New Materials Aluminum Nitride Substrates Company Information
    • 7.15.2 Zhejiang Zhengtian New Materials Aluminum Nitride Substrates Product Portfolio
    • 7.15.3 Zhejiang Zhengtian New Materials Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.15.4 Zhejiang Zhengtian New Materials Main Business and Markets Served
  • 7.16 SiChuan Liufang Yucheng Electronic Technology
    • 7.16.1 SiChuan Liufang Yucheng Electronic Technology Aluminum Nitride Substrates Company Information
    • 7.16.2 SiChuan Liufang Yucheng Electronic Technology Aluminum Nitride Substrates Product Portfolio
    • 7.16.3 SiChuan Liufang Yucheng Electronic Technology Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.16.4 SiChuan Liufang Yucheng Electronic Technology Main Business and Markets Served
  • 7.17 Fujian ZINGIN New Material Technology
    • 7.17.1 Fujian ZINGIN New Material Technology Aluminum Nitride Substrates Company Information
    • 7.17.2 Fujian ZINGIN New Material Technology Aluminum Nitride Substrates Product Portfolio
    • 7.17.3 Fujian ZINGIN New Material Technology Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.17.4 Fujian ZINGIN New Material Technology Main Business and Markets Served
  • 7.18 Shandong Sinocera Functional Material
    • 7.18.1 Shandong Sinocera Functional Material Aluminum Nitride Substrates Company Information
    • 7.18.2 Shandong Sinocera Functional Material Aluminum Nitride Substrates Product Portfolio
    • 7.18.3 Shandong Sinocera Functional Material Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.18.4 Shandong Sinocera Functional Material Main Business and Markets Served
  • 7.19 Hebei Sinopack Electronic Technology
    • 7.19.1 Hebei Sinopack Electronic Technology Aluminum Nitride Substrates Company Information
    • 7.19.2 Hebei Sinopack Electronic Technology Aluminum Nitride Substrates Product Portfolio
    • 7.19.3 Hebei Sinopack Electronic Technology Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.19.4 Hebei Sinopack Electronic Technology Main Business and Markets Served
  • 7.20 Chengdu Xuci New Material
    • 7.20.1 Chengdu Xuci New Material Aluminum Nitride Substrates Company Information
    • 7.20.2 Chengdu Xuci New Material Aluminum Nitride Substrates Product Portfolio
    • 7.20.3 Chengdu Xuci New Material Aluminum Nitride Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 7.20.4 Chengdu Xuci New Material Main Business and Markets Served

8 Industry Chain and Sales Channels Analysis

  • 8.1 Aluminum Nitride Substrates Industry Chain Analysis
  • 8.2 Aluminum Nitride Substrates Key Raw Materials
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
  • 8.3 Aluminum Nitride Substrates Production Mode & Process
  • 8.4 Aluminum Nitride Substrates Sales and Marketing
    • 8.4.1 Aluminum Nitride Substrates Sales Channels
    • 8.4.2 Aluminum Nitride Substrates Distributors
  • 8.5 Aluminum Nitride Substrates Customers

9 Aluminum Nitride Substrates Market Dynamics

  • 9.1 Aluminum Nitride Substrates Industry Trends
  • 9.2 Aluminum Nitride Substrates Market Drivers
  • 9.3 Aluminum Nitride Substrates Market Challenges
  • 9.4 Aluminum Nitride Substrates Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

  • 11.1 Methodology/Research Approach
    • 11.1.1 Research Programs/Design
    • 11.1.2 Market Size Estimation
    • 11.1.3 Market Breakdown and Data Triangulation
  • 11.2 Data Source
    • 11.2.1 Secondary Sources
    • 11.2.2 Primary Sources
  • 11.3 Author List
  • 11.4 Disclaimer 149
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦