SRAM 및 ROM 설계 IP 시장 규모, 점유율, 성장 분석 : 용도별, 제품별, 기술별, 최종 용도별, 지역별 - 산업 예측(2025-2032년)

Global SRAM and ROM Design IP Market size was valued at USD 2.4 billion in 2023 and is poised to grow from USD 2.55 billion in 2024 to USD 4.16 billion by 2032, growing at a CAGR of 6.3% during the forecast period (2025-2032).

The global SRAM and ROM design IP market is propelled by the rising need for energy-efficient, high-density on-chip memory in consumer electronics, automotive systems on chips (SoCs), and edge AI applications. As designers favor smaller footprints and power-conscious architectures, the demand for embedded SRAM and ROM memory IP blocks has intensified. These IP blocks enhance performance and reduce latency while offering compatibility across various foundry processes. Applications in AI accelerators and image processing leverage SRAM for rapid data handling, whereas ROM secures firmware and device ID. Additionally, the surge in customization tailored to specific use-cases, such as automotive ADAS and wearable tech, combined with advancements in security integration, underscores the robust growth potential for SRAM and ROM IP in diverse applications.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global SRAM and ROM Design IP market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global SRAM and ROM Design IP Market Segments Analysis

Global SRAM and ROM Design IP Market is segmented by Application, Product, Technology, End use and region. Based on Application, the market is segmented into Consumer Electronics, Automotive, Telecommunications, Industrial Automation and Aerospace. Based on Product, the market is segmented into Standard SRAM, Embedded SRAM, Asynchronous SRAM, Synchronous SRAM and ROM. Based on Technology, the market is segmented into CMOS, BiCMOS, SOI and FinFET. Based on End use, the market is segmented into Mobile Devices, Computers, Networking Equipment and IoT Devices. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global SRAM and ROM Design IP Market

The expansion of AI-driven applications across consumer electronics, automotive, and industrial sectors has greatly increased the demand for on-chip memory solutions. Embedded SRAM plays a pivotal role in edge AI chips, facilitating low-latency and high-speed memory required for real-time data processing. Additionally, ROM IP is vital for storing firmware and static configurations in ultra-compact IoT devices. The core advantage of these intellectual properties lies in their ability to enhance performance while managing power consumption effectively, influencing their widespread adoption in various domains, including smart wearables, drones, autonomous systems, and advanced neural processors.

Restraints in the Global SRAM and ROM Design IP Market

A significant challenge in the current Global SRAM and ROM Design IP market is the high licensing costs associated with high-performance SRAM and ROM IP blocks, which significantly impacts smaller chip developers and start-ups. In addition to navigating the complexities of licensing agreements, these smaller entities often face considerable integration challenges when incorporating these IPs into existing system-on-chip (SoC) frameworks. This integration process typically involves extensive verification, optimization, and validation, mainly driven by foundry requirements, which further escalates both development costs and timelines. Consequently, many smaller organizations find it prohibitively expensive to access premium IP options, limiting their competitive capacity in the market.

Market Trends of the Global SRAM and ROM Design IP Market

The Global SRAM and ROM Design IP market is experiencing a pronounced trend towards customizable and application-specific memory IP, driven by the evolving landscape of semiconductor applications such as AI accelerators, automotive systems-on-chip (SoCs), and wearable devices. As SoC designs become more specialized, the demand for memory IP that can be tailored to optimize power efficiency, enhance performance, bolster security, and minimize physical footprint is escalating. In response, IP vendors are increasingly offering configurable memory compilers and application-optimized memory solutions, enabling chipmakers to meet specific performance criteria and integrate cutting-edge technologies that cater to their unique design requirements.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Technology Analysis
• Case Studies
• Customer Buying Behavior Analysis

Global SRAM and ROM Design IP Market Size by Application & CAGR (2025-2032)

• Market Overview
• Consumer Electronics
• Automotive
• Telecommunications
• Industrial Automation
• Aerospace

Global SRAM and ROM Design IP Market Size by Product & CAGR (2025-2032)

• Market Overview
• Standard SRAM
• Embedded SRAM
• Asynchronous SRAM
• Synchronous SRAM
• ROM

Global SRAM and ROM Design IP Market Size by Technology & CAGR (2025-2032)

• Market Overview
• CMOS
• BiCMOS
• SOI
• FinFET

Global SRAM and ROM Design IP Market Size by End use & CAGR (2025-2032)

• Market Overview
• Mobile Devices
• Computers
• Networking Equipment
• IoT Devices

Global SRAM and ROM Design IP Market Size & CAGR (2025-2032)

• North America (Application, Product, Technology, End use)
  • US
  • Canada
• Europe (Application, Product, Technology, End use)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Application, Product, Technology, End use)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Application, Product, Technology, End use)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Application, Product, Technology, End use)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Qualcomm
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Cadence Design Systems
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Broadcom
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Analogue Devices
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Texas Instruments
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Infineon Technologies
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Synopsys
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ON Semiconductor
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• STMicroelectronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Microchip Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Intel
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations