FE 및 첨단 패키징용 금속 화학제품 시장 : 2024-2025년(Critical Materials Report)

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

INFOGRAPHICS

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

• 1.1 EXECUTIVE SUMMARY
• 1.2 ADVANCED PACKAGING PER WAFER STARTS
• 1.3 DEVICE DEMAND DRIVERS - LOGIC
• 1.4 CU PLATING FORECAST FOR CU INTERCONNECTS AND ADVANCED PACKAGING
• 1.5 MARKET SHARES
• 1.6 SUPPLIER ACTIVITIES - VARIOUS ANNOUNCEMENTS
• 1.7 RISK FACTORS
• 1.8 ANALYST ASSESSMENT

2 SCOPE, PURPOSE AND METHODOLOGY

• 2.1 SCOPE
• 2.2 PURPOSE & METHODOLOGY
• 2.3 OVERVIEW OF OTHER TECHCET CMR REPORTS

3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK

• 3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK
  • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2 SEMICONDUCTOR SALES GROWTH
  • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
• 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
  • 3.2.1 ELECTRONICS OUTLOOK
  • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  • 3.2.3 SMARTPHONE OUTLOOK
  • 3.2.4 PC OUTLOOK
  • 3.2.5 SERVERS / IT MARKET
• 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
  • 3.3.2 NEW FABS IN THE US
  • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
  • 3.3.4 EQUIPMENT SPENDING TRENDS
  • 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
  • 3.3.6 FAB INVESTMENT ASSESSMENT
• 3.4 POLICY & TRADE TRENDS AND IMPACT
• 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
  • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
  • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 METAL CHEMICALS MARKET BY SEGMENT

• 4.1 DEFINITIONS
• 4.2 METAL PLATING CHEMICALS MARKET OVERVIEW
  • 4.2.1 OVERVIEW - CU ADVANCED PACKAGING AND CHIP INTERCONNECTS METALLIZATION
  • 4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS
• 4.3 ADVANCED PACKAGING METALLIZATION - MARKET DRIVERS
  • 4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU PLATING REVENUE
  • 4.3.2 ADVANCED PACKAGING - COPPER CHEMICALS REVENUE
  • 4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES
  • 4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
  • 4.3.5 SN / SNAG PLATING
• 4.4 CHIP INTERCONNECTS GROWTH TRENDS
  • 4.4.1 CHIP INTERCONNECTS GROWTH DRIVERS
  • 4.4.2 CHIP INTERCONNECTS CU PLATING REVENUES
  • 4.4.3 CHIP INTERCONNECTS ADDITIVE VOLUMES
• 4.5 MINE LOCATIONS FOR METALS IN PLATING CHEMICALS
• 4.6 POSSIBLE CHOKE POINTS FOR METALS USED IN IC PLATING
• 4.7 FUTURE POSSIBLE DEMAND PRICE PRESSURES

5 TECHNICAL TRENDS

• 5.1 CHEMISTRIES USE FOR SEMICONDUCTOR METAL PLATING
• 5.2 PACKAGING TECH TRENDS
  • 5.2.1 PACKAGING TECHNICAL CHALLENGES
• 5.3 TECH TRENDS
  • 5.3.1 MARKET DRIVES TECHNOLOGY TRENDS
  • 5.3.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
  • 5.3.3 CU INTERCONNECTS QUALIFICATION REQUIREMENTS
  • 5.3.4 LOGIC METALLIZATION ROADMAP
  • 5.3.5 ADV LOGIC BURIED POWER RAIL
  • 5.3.6 TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
  • 5.3.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
  • 5.3.8 EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD
  • 5.3.9 TECHNICAL REQUIREMENTS SUMMARY 1/2

6 COMPETITIVE LANDSCAPE

• 6.1 TOTAL ADVANCED PACKAGING AND INTERCONNECTS MARKET SHARES
• 6.2 OEM MARKET SHARE - PLATING EQUIPMENT
• 6.3 MARKET SHARE BY APPLICATION - CU PLATING FOR ADVANCED PACKAGING
• 6.4 REGIONAL PLAYERS AND OTHERS
• 6.5 M&A ACTIVITY

7 ANALYST ASSESSMENT

• 7.1 ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8 SUPPLIER PROFILES

• BASF
• DUPONT
• CHANG CHUN GROUP
• INCHEON CHEMICAL COMPANY
• ISHIHARA CHEMICAL/UNICON
• ...AND 9 MORE

9 APPENDIX A: PACKAGING TECH TRENDS

• 9.1 TECHNOLOGY CHALLENGE
  • 9.1.1 METAL CLEANINGS CHALLENGE
  • 9.1.2 MARKET DYNAMIC
  • 9.1.3 WAFER LEVEL PLATING-FIRST LEVEL INTERCONNECT
  • 9.1.4 MARKET DRIVERS OF ADVANCED PACKAGING APPLICATIONS
  • 9.1.5 WAFER LEVEL PACKAGING ARCHITECTURES
  • 9.1.6 TECH TRENDS- RDL
  • 9.1.7 MARKET DRIVERS OF CHIPLET ARCHITECTURE
  • 9.1.8 TSV FILLING 2.5-3D
  • 9.1.9 PACKAGING ELECTROPLATING REQUIREMENTS