AI 서버의 전원 무결성 향상 : 실리콘 커패시터와 MLCC의 역할 변화

The need for power integrity in AI servers is extending from the board level directly into the package. This shift is driving a transition in capacitor technology, moving beyond a sole reliance on traditional multi-layer ceramic capacitors (MLCCs) toward a layered, complementary approach utilizing both silicon capacitors and MLCCs. While MLCCs remain the primary components for system-level decoupling, filtering, and voltage regulation across PCBs, VRMs, power shelves, and power modules, silicon capacitors offer distinct localized advantages. Their thin profile, low equivalent series inductance (ESL), excellent high-frequency characteristics, and stable capacitance under DC bias and temperature fluctuations make them ideal for near-die decoupling around GPUs, ASICs, HBMs, and within advanced packages. As AI accelerators increasingly adopt chiplets, HBM stacking, and high-power packaging, silicon capacitors are poised to become vital complementary components for package-level power integrity in AI and HPC applications.

Key Highlights

• Power integrity demands in AI servers are extending from boards into packages.
• Capacitor strategy is shifting from only MLCCs to a complementary mix of silicon capacitors and MLCCs.
• MLCCs stay dominant for system-level decoupling, filtering, and voltage regulation across power distribution.
• Silicon capacitors, with thin form, low ESL and stable high‑frequency behavior, are suited for near‑die decoupling in advanced packages.
• As chiplet architectures, stacked HBM and high‑power packaging proliferate in AI and HPC, silicon capacitors are emerging as essential complements for package‑level power integrity.

Table of Contents

• 1. Advantages of Silicon Capacitors: Low ESL and Stability in High-Voltage, High-Temperature Environments
  • Figure 1: Schematic Diagram of a Silicon Capacitor
  • Figure 2: Capacitance Variations Between Silicon Capacitors and MLCCs Under Voltage and Temperature Changes
• 2. Silicon Capacitors Address MLCCs’ Limitations Within Packages, Thus Establishing a Division of Labor for Power Integrity
  • Table 1: Comparison Between MLCCs and Silicon Capacitors
• 3. As Power Supply Bottlenecks Shift from the PCB to Inside the Package, Silicon Capacitors Emerge as a Solution
  • Figure 3: Primary Placement Locations for Silicon Capacitors
• 4. Major Silicon Capacitor Manufacturers and Supply Chains in Taiwan, Japan, and South Korea
  • Table 2: Corresponding Dynamics of Silicon Capacitor Technology Among Taiwanese, Japanese, and South Korean Suppliers
• 5. Future Development: Silicon Capacitors to Slowly Become Standard Configuration for Advanced Packaging of AI
  • Figure 4: Future Technical Orientations and Existing Challenges of Silicon Capacitors
• 6. TRI’s View