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시장보고서
상품코드
1764902
아시아태평양의 3D 스태킹 시장 : 예측 - 지역별 분석(인터커넥트 기술별, 디바이스 유형별, 최종 사용자별)Asia Pacific 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User |
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아시아태평양의 3D 스태킹 시장은 2023년에 6억 9,932만 달러로 평가되었고, 2031년에는 23억 5,245만 달러에 이를 것으로 예측되고, 2023년부터 2031년까지의 CAGR은 16.4%를 나타낼 전망입니다.
고대역폭 메모리 수요의 급증이 아시아태평양의 3D 스태킹 시장을 뒷받침
다수의 DRAM을 수직 방향으로 적층함으로써 매우 고밀도가 되는 고대역폭 메모리(HBM)는 고속 데이터 처리와 저소비 전력이 특징입니다. 패키징 기술을 채택하여 성능과 수율을 높이고 있습니다. 처리 속도 6.4Gbps, 대역폭 819GB/s의 HBM3은 소비전력을 10% 삭감하면서 전세대 DRAM보다 1.8배 빠릅니다. HYNIX INC는 2024년 3월 초고성능의 최신 AI 메모리 제품인 HBM3E1의 양산을 시작했습니다.
HBM은 3D 스태킹 기술을 활용하여 실리콘 관통 비아(TSV)라고 하는 수직 채널을 사용하여 칩을 다층에 적층할 수 있습니다. 제공함으로써 배터리 수명을 늘리고 에너지 소비를 줄이는데 도움이 됩니다. 이는 메모리와 프로세서 간의 데이터 전송에 필요한 전력량을 줄여 사용자를 지원합니다.
아시아태평양 3D 스태킹 시장 개요
아시아태평양에서는 중국이 최대의 소비자 전자기기 제조업체입니다. 아시아 태평양 지역의 전자 산업은 아시아 태평양 전체 수출 가치의 20-50%를 차지합니다. 스마트 스피커, 홈 어시스턴트, 스마트 카메라는 3D 스태킹 메모리와 프로세서를 이용해 설치 면적을 작게 억제하면서 성능과 기능을 강화하고 있습니다.
아시아태평양의 3D 스태킹 시장 수익과 2031년까지의 예측(금액)
아시아태평양 3D 스태킹 시장 세분화
아시아태평양의 3D 스태킹 시장은 상호 연결 기술, 장치 유형, 최종 사용자, 국가별로 분류됩니다.
상호 연결 기술을 기반으로 아시아태평양의 3D 스태킹 시장은 스루 실리콘 비아, 모놀리식 3D 통합 및 3D 하이브리드 본딩으로 구분됩니다. 스루 실리콘 비아 부문은 2023년에 가장 큰 시장 점유율을 차지합니다.
기기 유형별로 아시아태평양의 3D 스태킹 시장은 메모리 디바이스, 메모리/센서, LED, 이미징 & 광전자 및 기타로 구분됩니다. 2023년 시장 점유율은 메모리 장치가 가장 큽니다.
최종 사용자별로 아시아태평양 3D 스태킹 시장은 소비자용 전자 기기, 통신, 자동차, 제조, 의료 등으로 구분됩니다. 2023년에는 소비자용 전자기기 부문이 가장 큰 시장 점유율을 차지했습니다.
국가별로 아시아태평양 3D 스태킹 시장은 인도, 중국, 일본, 한국, 대만, 호주 및 기타 아시아태평양으로 구분됩니다. 2023년 아시아태평양 3D 스태킹 시장 점유율은 대만이 독점했습니다.
Taiwan Semiconductor Manufacturing Co Ltd, Samsung Electronics Co Ltd, Intel Corp, MediaTek Inc, Texas Instruments Inc, Amkor Technology Inc, ASE Technology Holding Co Ltd, Advanced Micro Devices Inc, 3M Co., Globalfoundries Inc는 아시아태평양 3D 스태킹 시장에서 활동하는 선도적인 기업 중 일부입니다.
목차
제1장 서론
제2장 주요 요약
- 주요 인사이트
- 시장의 매력
제3장 분석 방법
- 2차 조사
- 1차 조사
- 가설의 책정
- 거시경제 요인분석
- 기초 수치의 개발
- 데이터의 삼각측량
- 국가 레벨 데이터
제4장 아시아태평양의 3D 스태킹 시장의 정세
- PEST 분석
- 생태계 분석
- 밸류체인의 벤더 일람
제5장 아시아태평양의 3D 스태킹 시장 : 주요 시장 역학
- 3D 스태킹 시장 : 주요 시장 역학
- 시장 성장 촉진요인
- 소비자용 전자 기기 수요 증가
- 이기종 통합과 컴포넌트 최적화 증가
- 시장 성장 억제요인
- 3D 스태킹 기술의 복잡성
- 시장 기회
- 광대역 메모리 수요의 급증
- 향후의 동향
- 게임용 고속 프로세서
- 성장 촉진요인과 억제요인의 영향
제6장 3D 스태킹 시장 : 아시아태평양 시장 분석
- 아시아태평양의 3D 스태킹 시장 개요
- 아시아태평양의 3D 스태킹 시장 수익(2021-2031년)
- 아시아태평양의 3D 스태킹 시장 예측·분석
제7장 아시아태평양의 3D 스태킹 시장 분석 : 상호 연결 기술별
- 스루 실리콘·비아
- 모놀리식 3D 인테그레이션
- 3D 하이브리드 본딩
제8장 아시아태평양의 3D 스태킹 시장 분석 : 디바이스 유형별
- 메모리 디바이스
- MEMS/센서
- LED
- 이미징·옵토일렉트로닉스
- 기타
제9장 아시아태평양의 3D 스태킹 시장 분석 : 최종 사용자별
- 소비자용 전자 기기
- 통신
- 자동차
- 제조업
- 의료
- 기타
제10장 아시아태평양의 3D 스태킹 시장 분석 : 국가별 분석
- 아시아태평양
- 인도
- 중국
- 일본
- 한국
- 대만
- 호주
- 기타 아시아태평양
제11장 경쟁 구도
- 히트 맵 분석 : 주요 기업별
- 기업의 포지셔닝과 집중도
제12장 업계 정세
- 시장 이니셔티브
- 제품 개발
제13장 기업 프로파일
- Taiwan Semiconductor Manufacturing Co Ltd
- Samsung Electronics Co Ltd
- Intel Corp
- MediaTek Inc
- Texas Instruments Inc
- Amkor Technology Inc
- ASE Technology Holding Co Ltd
- Advanced Micro Devices Inc
- 3M Co
- Globalfoundries Inc
제14장 부록
SHW 25.07.14The Asia Pacific 3D stacking market was valued at US$ 699.32 million in 2023 and is expected to reach US$ 2,352.45 million by 2031; it is expected to record a CAGR of 16.4% from 2023 to 2031.
Surge in Demand for High-Bandwidth Memory Fuels Asia Pacific 3D Stacking Market
High-bandwidth memory (HBM), which reaches extremely high density by stacking numerous dynamic random-access memory (DRAMs) vertically, is distinguished by rapid data processing and low power consumption. It is essential in high-performance computing (HPC), such as generative AI, which requires processing enormous amounts of data at significantly fast speeds. Samsung Electronics 12-layer stacked HBM uses next-generation 3D stacking packaging technique to boost performance and yield. With a processing speed of 6.4Gbps and a bandwidth of 819 GB/s, HBM3 is 1.8 times faster than the previous-generation DRAM while using 10% less power. The demand for HBM in high-performance computing applications encourages market players to increase their production. For instance, in March 2024, SK HYNIX INC started volume production of HBM3E1, the newest AI memory product with ultra-high performance. HBM3E is designed for an AI system that processes a huge amount of data quickly. The high-bandwidth memory is used by various industries, including telecommunication, automotive, healthcare, and manufacturing, for high-speed data processing.
HBM utilizes 3D stacking technology, allowing the stacking of multiple layers of chips using vertical channels known as through-silicon vias (TSVs). This enables a greater number of memory chips to be packed into a smaller space, minimizing the distance data must travel between the memory and processor. HBM can help lengthen battery life and reduce energy consumption by offering sustainable benefits to users. This supports users in decreasing the amount of power required to transmit data between memory and processor. Therefore, the surge in demand for high-speed data processing and low-power consumption memories is expected to create lucrative opportunities for the 3D stacking market growth during the forecast period.
Asia Pacific 3D Stacking Market Overview
In Asia Pacific, China is the largest manufacturer of consumer electronic devices. According to Nikkei Inc., the Government of China expanded the country's domestic electronic market by investing US$ 327 billion till 2023. The Government of India also aims to expand the electronics market in the country. Furthermore, the electronics sector in Asia Pacific accounts for 20-50% of Asia Pacific's total value of exports. Smart speakers, home assistants, and smart cameras utilize 3D stacked memory and processors to enhance performance and features while maintaining a small footprint. As Asia Pacific is the largest electronic manufacturer, the demand for 3D stacking is expected to rise during the forecast period.
Asia Pacific 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)
Asia Pacific 3D Stacking Market Segmentation
The Asia Pacific 3D stacking market is categorized into interconnecting technology, device type, end user, and country.
Based on interconnecting technology, the Asia Pacific 3D stacking market is segmented into through-silicon via, monolithic 3d integration, and 3d hybrid bonding. The through-silicon via segment held the largest market share in 2023.
By device type, the Asia Pacific 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.
In the terms of end user, the Asia Pacific 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.
By country, the Asia Pacific 3D stacking market is segmented into India, China, Japan, South Korea, Taiwan, Australia, and the Rest of Asia Pacific. Taiwan dominated the Asia Pacific 3D stacking market share in 2023.
Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the Asia Pacific 3D stacking market.
Table Of Contents
1. Introduction
- 1.1 The Insight Partners Research Report Guidance
- 1.2 Market Segmentation
2. Executive Summary
- 2.1 Key Insights
- 2.2 Market Attractiveness
3. Research Methodology
- 3.1 Secondary Research
- 3.2 Primary Research
- 3.2.1 Hypothesis formulation:
- 3.2.2 Macro-economic factor analysis:
- 3.2.3 Developing base number:
- 3.2.4 Data Triangulation:
- 3.2.5 Country level data:
4. Asia Pacific 3D Stacking Market Landscape
- 4.1 Overview
- 4.2 PEST Analysis
- 4.3 Ecosystem Analysis
- 4.3.1 List of Vendors in the Value Chain
5. Asia Pacific 3D Stacking Market - Key Market Dynamics
- 5.1 3D Stacking Market - Key Market Dynamics
- 5.2 Market Drivers
- 5.2.1 Rising Demand for Consumer Electronics
- 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
- 5.3 Market Restraints
- 5.3.1 Complexity Associated with 3D Stacking Technology
- 5.4 Market Opportunities
- 5.4.1 Surge in Demand for High-Bandwidth Memory
- 5.5 Future Trends
- 5.5.1 Fast Processors for Gaming Purposes
- 5.6 Impact of Drivers and Restraints:
6. 3D Stacking Market - Asia Pacific Market Analysis
- 6.1 Asia Pacific 3D Stacking Market Overview-
- 6.2 Asia Pacific 3D Stacking Market Revenue (US$ Million), 2021-2031
- 6.3 Asia Pacific 3D Stacking Market Forecast Analysis
7. Asia Pacific 3D Stacking Market Analysis - by Interconnecting Technology
- 7.1 Through-Silicon Via
- 7.1.1 Overview
- 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 7.2 Monolithic 3D Integration
- 7.2.1 Overview
- 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 7.3 3D Hybrid Bonding
- 7.3.1 Overview
- 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8. Asia Pacific 3D Stacking Market Analysis - by Device Type
- 8.1 Memory Devices
- 8.1.1 Overview
- 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 8.2 MEMS/Sensors
- 8.2.1 Overview
- 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 8.3 LEDs
- 8.3.1 Overview
- 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 8.4 Imaging and Optoelectronics
- 8.4.1 Overview
- 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 8.5 Others
- 8.5.1 Overview
- 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9. Asia Pacific 3D Stacking Market Analysis - by End User
- 9.1 Consumer Electronics
- 9.1.1 Overview
- 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 9.2 Telecommunication
- 9.2.1 Overview
- 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 9.3 Automotive
- 9.3.1 Overview
- 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 9.4 Manufacturing
- 9.4.1 Overview
- 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 9.5 Healthcare
- 9.5.1 Overview
- 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 9.6 Others
- 9.6.1 Overview
- 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
10. Asia Pacific 3D Stacking Market -Country Analysis
- 10.1 Asia Pacific
- 10.1.1 Asia Pacific 3D Stacking Market, by Key Countries - Revenue (2023) (US$ Million)
- 10.1.2 Asia Pacific 3D Stacking Market - Revenue and Forecast Analysis - by Country
- 10.1.2.1 Asia Pacific: 3D Stacking Market - Revenue and Forecast Analysis - by Country
- 10.1.2.2 India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.2.1 India: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.2.2 India: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.2.3 India: 3D Stacking Market Breakdown, by End User
- 10.1.2.3 China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.3.1 China: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.3.2 China: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.3.3 China: 3D Stacking Market Breakdown, by End User
- 10.1.2.4 Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.4.1 Japan: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.4.2 Japan: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.4.3 Japan: 3D Stacking Market Breakdown, by End User
- 10.1.2.5 South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.5.1 South Korea: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.5.2 South Korea: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.5.3 South Korea: 3D Stacking Market Breakdown, by End User
- 10.1.2.6 Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.6.1 Taiwan: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.6.2 Taiwan: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.6.3 Taiwan: 3D Stacking Market Breakdown, by End User
- 10.1.2.7 Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.7.1 Australia: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.7.2 Australia: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.7.3 Australia: 3D Stacking Market Breakdown, by End User
- 10.1.2.8 Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
- 10.1.2.8.1 Rest of Asia Pacific: 3D Stacking Market Breakdown, by Interconnecting Technology
- 10.1.2.8.2 Rest of Asia Pacific: 3D Stacking Market Breakdown, by Device Type
- 10.1.2.8.3 Rest of Asia Pacific: 3D Stacking Market Breakdown, by End User
11. Competitive Landscape
- 11.1 Heat Map Analysis by Key Players
- 11.2 Company Positioning & Concentration
12. Industry Landscape
- 12.1 Overview
- 12.2 Market Initiative
- 12.3 Product Development
13. Company Profiles
- 13.1 Taiwan Semiconductor Manufacturing Co Ltd
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments
- 13.2 Samsung Electronics Co Ltd
- 13.2.1 Key Facts
- 13.2.2 Business Description
- 13.2.3 Products and Services
- 13.2.4 Financial Overview
- 13.2.5 SWOT Analysis
- 13.2.6 Key Developments
- 13.3 Intel Corp
- 13.3.1 Key Facts
- 13.3.2 Business Description
- 13.3.3 Products and Services
- 13.3.4 Financial Overview
- 13.3.5 SWOT Analysis
- 13.3.6 Key Developments
- 13.4 MediaTek Inc
- 13.4.1 Key Facts
- 13.4.2 Business Description
- 13.4.3 Products and Services
- 13.4.4 Financial Overview
- 13.4.5 SWOT Analysis
- 13.4.6 Key Developments
- 13.5 Texas Instruments Inc
- 13.5.1 Key Facts
- 13.5.2 Business Description
- 13.5.3 Products and Services
- 13.5.4 Financial Overview
- 13.5.5 SWOT Analysis
- 13.5.6 Key Developments
- 13.6 Amkor Technology Inc
- 13.6.1 Key Facts
- 13.6.2 Business Description
- 13.6.3 Products and Services
- 13.6.4 Financial Overview
- 13.6.5 SWOT Analysis
- 13.6.6 Key Developments
- 13.7 ASE Technology Holding Co Ltd
- 13.7.1 Key Facts
- 13.7.2 Business Description
- 13.7.3 Products and Services
- 13.7.4 Financial Overview
- 13.7.5 SWOT Analysis
- 13.7.6 Key Developments
- 13.8 Advanced Micro Devices Inc
- 13.8.1 Key Facts
- 13.8.2 Business Description
- 13.8.3 Products and Services
- 13.8.4 Financial Overview
- 13.8.5 SWOT Analysis
- 13.8.6 Key Developments
- 13.9 3M Co
- 13.9.1 Key Facts
- 13.9.2 Business Description
- 13.9.3 Products and Services
- 13.9.4 Financial Overview
- 13.9.5 SWOT Analysis
- 13.9.6 Key Developments
- 13.10 Globalfoundries Inc
- 13.10.1 Key Facts
- 13.10.2 Business Description
- 13.10.3 Products and Services
- 13.10.4 Financial Overview
- 13.10.5 SWOT Analysis
- 13.10.6 Key Developments
14. Appendix
- 14.1 About The Insight Partners
- 14.2 Word Index
