차세대 칩렛 및 첨단 패키징 아키텍처 : AI 및 HPC의 성능과 확장성 재정의

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyzes how chiplet-based partitioning, open die-to-die interconnect standards, and tightly coupled HBM integration unlock higher bandwidth, improved yield, reduced design complexity, and scalable, modular platforms that overcome the physical and economic limits of traditional monolithic AI/HPC processors and accelerators. The study specifically examines architecture and roadmap implications for AI accelerators, GPUs, data-center and cloud infrastructure, networking and edge systems that are adopting these technologies, and evaluates commercialization trends and ecosystem roles across foundries, IDMs, fabless vendors, OSATs, and EDA providers as they build chiplet-centric AI/HPC platforms. It further assesses the key opportunities and constraints shaping these AI/HPC architectures—including interoperability of chiplets and standards, packaging capacity, thermal and power management at AI-class power densities, test and reliability complexity, cost efficiency, supply-chain dependencies, and geopolitical factors that influence where and how advanced AI/HPC silicon can be manufactured and deployed, while highlighting future technology roadmaps and ecosystem-driven innovation trends.

Scope and Segmentation

• Scope of Analysis
• Segmentation

Strategic Imperatives

• Why Is It Increasingly Difficult to Grow? The Strategic Imperative 8TM: Factors Creating Pressure on Growth
• The Strategic Imperative 8TM
• The Impact of the Top 3 Strategic Imperatives on the Semiconductor Industry
• Growth Opportunities Fuel the Growth Pipeline EngineTM
• Research Methodology

Growth Opportunity Analysis

• Growth Drivers
• Growth Restraints

Technology Overview

• Technology Overview-Chiplets and Advanced Packaging
• Packaging Approaches Enabling AI Memory Integration
• Recent Technology Developments in Chiplet and Packaging
• Strategic Relationships Shaping the Chiplet and Advanced Packaging Value Chain
• Technological Components of the Chiplet Ecosystem
• Essential Features, Value Propositions, and Hurdles
• Hurdles, Challenges, and Strategic Considerations
• Architecture Benefits and Integration Complexities
• Key Capabilities for AI and HPC Systems

Strategic Implications and Technology Convergence

• Strategic Viewpoint and Implications
• Technology Convergence Shaping AI & HPC

Key R&D Innovation Themes

• Key R&D Innovation Themes
• Strategic Implications for Stakeholders
• Strategic Recommendations and Vision for a Chiplet-Driven Computing Ecosystem

Patent and Funding Trends Assessment

• Patent Filing Trends in Chiplets & Advanced Packaging
• Recent Public Funding and Ecosystem Initiatives in Advanced Packaging
• Chiplet Ecosystem Development
• Strategic Roadmap-Technology Adoption and Emerging Trends

Industry Use Cases

• Case Study 1-NVIDIA Blackwell GB200 Architecture: Chiplet-Based AI Accelerator Leadership
• Case Study 2-AMD 4th Gen EPYC "Genoa": Chiplet CPU Platform for AI and HPC
• Case Study 3-Intel Data Center GPU Max Series: Heterogeneous AI/HPC Packaging Leadership

Future Outlook and Strategic Insights

• Future Outlook (3–5 Year Horizon)-Market and Adoption
• Technology Evolution Roadmap for Advanced Chiplet and 3D Integration
• Strategic Recommendations for Advancing Chiplet, HBM, and 2.5D/3D Integration

Growth Opportunities Universe

• Growth Opportunity 1: UCIe-Based Multi-Vendor Chiplet Platforms for AI & HPC
• Growth Opportunity 2: HBM4-Ready 2.5D/3D Packaging Platforms for Memory-Bound AI Workloads
• Growth Opportunity 3: Optical UCIe Chiplets for Energy-Efficient Disaggregated AI Fabrics

Appendix

• Technology Readiness Levels (TRL): Explanation

Next Steps

• Benefits and Impacts of Growth Opportunities
• Next Steps
• Legal Disclaimer