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System on Chip Market by Type (Analog, Digital, Mixed Signal), Product Type (Application-Specific Integrated Circuits, Central Processing Units, Digital Signal Processors), Integration Type, Application - Global Forecast 2025-2030

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½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀåÀÇ 2023³â ½ÃÀå ±Ô¸ð´Â 1,948¾ï 3,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú½À´Ï´Ù. 2024³â¿¡´Â 2,091¾ï 3,000¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 7.43%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 3,218¾ï 1,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀÔ´Ï´Ù.

½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀåÀº ÄÄÇ»ÅÍ ¹× ±âŸ ÀüÀÚ ½Ã½ºÅÛÀÇ ¸ðµç ±¸¼º¿ä¼Ò¸¦ ´ÜÀÏ Ä¨¿¡ ÅëÇÕÇÏ¿© ¼º´ÉÀ» Çâ»ó½Ã۰í Àü·Â ¼Òºñ¸¦ ÁÙÀÏ ¼ö ÀÖµµ·Ï ÇÏ´Â ±â¼úÀÔ´Ï´Ù. ÀÌ ±â¼úÀº ¼ÒºñÀÚ ÀüÀÚÁ¦Ç°, ÀÚµ¿Â÷, Åë½Å µî È¿À²¼º°ú ÄÄÆÑÆ®ÇÑ ¼³°è°¡ ÇʼöÀûÀÎ ºÐ¾ß¿¡¼­ ¸Å¿ì Áß¿äÇϸç, SoCÀÇ Çʿ伺Àº ½º¸¶Æ® ±â±â, IoT(»ç¹°ÀÎÅͳÝ) ½Ã½ºÅÛ, °ß°íÇϸ鼭µµ ¿¡³ÊÁö È¿À²ÀûÀΠó¸® ´É·ÂÀ» ÇÊ¿ä·Î Çϴ ÷´Ü ÄÄÇ»ÆÃ ÀåÄ¡¿¡ ´ëÇÑ Æø¹ßÀûÀÎ ¼ö¿ä·Î ÀÎÇØ ´õ¿í Ä¿Áö°í ÀÖ½À´Ï´Ù. ÄÄÇ»ÆÃ µð¹ÙÀ̽º¿¡ ´ëÇÑ Æø¹ßÀûÀÎ ¼ö¿ä·Î ÀÎÇØ ±× Çʿ伺ÀÌ ´õ¿í Ä¿Áö°í ÀÖ½À´Ï´Ù. ½º¸¶Æ®Æù, ÅÂºí¸´, ½º¸¶Æ® ÀÇ·ù, ÀÚÀ²ÁÖÇàÂ÷ µî ´Ù¾çÇÑ ÃÖÁ¾ ¿ëµµ¿¡´Â Çö´ë ±â¼ú¿¡¼­ SoC°¡ ¾ó¸¶³ª ´Ù¾çÇÏ°í º¸ÆíÈ­µÇ¾î ÀÖ´ÂÁö ¾Ë ¼ö ÀÖ½À´Ï´Ù.

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CAGR(%) 7.43%

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±×·¯³ª ³ôÀº ½ÃÀå °³Ã´ ºñ¿ë, ´Ù±â´É Ĩ ¼³°èÀÇ º¹À⼺, µ¥ÀÌÅÍ º¸¾È ¹× ÇÁ¶óÀ̹ö½Ã ¹®Á¦ µîÀ¸·Î ÀÎÇØ ¼ºÀå¿¡ ÇѰ谡 ÀÖ½À´Ï´Ù. ƯÈ÷ ¹ÝµµÃ¼ Á¦Á¶ÀÇ ¹«¿ª ¸¶Âû°ú °ø±Þ¸Á È¥¶õÀº ½ÃÀå ¿ªÇп¡ ¿µÇâÀ» ¹ÌÄ¡´Â °úÁ¦ÀÔ´Ï´Ù. ÀÌ·¯ÇÑ ¹®Á¦¸¦ ¿ÏÈ­Çϱâ À§ÇØ ±â¾÷Àº R&D¿¡ ÅõÀÚÇÏ¿© È¿À²¼ºÀ» °³¼±Çϰí, °­·ÂÇÑ º¸¾È Á¶Ä¡¸¦ °³¹ßÇϰí, °ø±Þ¸ÁÀ» ´Ù¾çÈ­ÇÏ¿© ź·Â¼ºÀ» ³ô¿©¾ß ÇÕ´Ï´Ù.

±â¼ú Çõ½Å°ú ¿¬±¸¸¦ À§ÇÑ »õ·Î¿î ºÐ¾ß·Î´Â ¾çÀÚ ÄÄÇ»ÆÃ, ÀÇ·á¿ë »ýü ÀûÇÕ¼º ÀüÀÚÁ¦Ç°, ģȯ°æ ±â¼ú ¿ä°ÇÀ» ÃæÁ·ÇÏ´Â ¿¡³ÊÁö È¿À²Àû ¼³°è µîÀÌ ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ º¹À⼺¿¡µµ ºÒ±¸Çϰí SoC ½ÃÀåÀº ³«°üÀûÀ̸ç, Â÷¼¼´ë ±â¼ú¿¡ ´ëÇÑ Áö¼ÓÀûÀÎ ÅõÀÚ´Â Á¡ÁøÀû Çõ½Å°ú ȹ±âÀûÀÎ Çõ½ÅÀ» ¸ðµÎ ÃËÁøÇϰí ÀÖ½À´Ï´Ù. Áö¼Ó°¡´É¼º, È®À强, º¸¾ÈÀ» ¿ì¼±½ÃÇÏ´Â ±â¾÷ÀÌ »óÈ£ ¿¬°áµÇ°í ½º¸¶Æ®È­µÇ´Â ¼¼»ó¿¡¼­ Â÷¼¼´ë SoCÀÇ ¹°°áÀ» ÁÖµµÇÒ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.

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½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ëÀ» ÅëÇØ º¯È­Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ º¯È­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº Á¤º¸¿¡ ÀÔ°¢ÇÑ ÅõÀÚ °áÁ¤À» ³»¸®°í, Àü·«ÀûÀÎ ÀÇ»ç°áÁ¤À» Á¤±³È­Çϸç, »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Æ÷ÂøÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Æ®·»µå¸¦ Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª Àü¹Ý¿¡ °ÉÄ£ ´Ù¾çÇÑ ¸®½ºÅ©¸¦ ÁÙÀÏ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë ¹× ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

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Porter's Five Forces: ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå °ø·«À» À§ÇÑ Àü·« µµ±¸

PorterÀÇ Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå °æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â µ¥ Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. PorterÀÇ Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀïÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ ¸ð»öÇϱâ À§ÇÑ ¸íÈ®ÇÑ ¹æ¹ýÀ» ¼³¸íÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÅëÂû·ÂÀ» ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇÏ°í ¾àÁ¡À» º¸¿ÏÇϸç ÀáÀçÀû µµÀüÀ» ÇÇÇÔÀ¸·Î½á º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ ´ã°í ÀÖÀ¸¸ç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀ̰í Àû±ØÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå °æÀï ±¸µµ ÆÄ¾Ç

½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ º¥´õÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü°ú °°Àº ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀïÀû À§Ä¡¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®Àº ½ÃÀåÀÇ ÁýÁßÈ­, ¼¼ºÐÈ­ ¹× ÅëÇÕ Ãß¼¼¸¦ ÆÄ¾ÇÇÏ¿© °ø±Þ¾÷ü°¡ Ä¡¿­ÇÑ °æÀï¿¡¼­ ÀÚ½ÅÀÇ ÀÔÁö¸¦ °­È­ÇÒ ¼ö ÀÖ´Â Àü·«Àû ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ ÅëÂû·ÂÀ» Á¦°øÇÕ´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º: ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå¿¡¼­°ø±Þ¾÷ü ¼º°ú Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÒ ¼ö ÀÖ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î º¥´õ¸¦ Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀ¸·Î º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù. Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× Ãßõ: ½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå¿¡¼­ ¼º°øÀÇ ±æÀ» ±×¸³´Ï´Ù.

½Ã½ºÅÛ¿ÂĨ(SoC) ½ÃÀå Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ÀÇ ÀÔÁö¸¦ °­È­ÇϰíÀÚ ÇÏ´Â ±â¾÷¿¡°Ô ÇʼöÀûÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ¿ª·® ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ½Äº°ÇÏ°í °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀº °æÀï ȯ°æÀÇ °úÁ¦¸¦ ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö Àִ ü°è¸¦ ±¸ÃàÇÒ ¼ö ÀÖµµ·Ï µµ¿ÍÁÝ´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÎ¹®¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ½ÃÀå ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõµµ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·ÂÀ» Æò°¡ÇÕ´Ï´Ù.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÎ¹®ÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» ±â¼úÇϰí ÀÖ½À´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, »ê¾÷ÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸ °³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

¶ÇÇÑ, ÀÌÇØ°ü°èÀÚµéÀÌ ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖµµ·Ï Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯µµ Á¦°øÇÕ´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, Áö¿ªÀº?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

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    • Apple Inc.
    • Broadcom Limited
    • Fujitsu Semiconductor Inc.
    • Huawei Technologies Co., Ltd.
    • Intel Corporation
    • Marvell Technology Group
    • Maxim Integrated Products, Inc. by Analog Devices Inc.
    • Microchip Technology Inc.
    • NVIDIA Corp.
    • NXP Semiconductors N.V.
    • Qualcomm Inc.
    • Samsung Electronics Co. Ltd.
    • STMicroelectronics N.V.
    • Taiwan Semiconductor Manufacturing Co. Ltd.
    • Toshiba Corporation
    LSH

    The System on Chip Market was valued at USD 194.83 billion in 2023, expected to reach USD 209.13 billion in 2024, and is projected to grow at a CAGR of 7.43%, to USD 321.81 billion by 2030.

    The market for System on Chip (SoC) technology encompasses the integration of all components of a computer or other electronic system into a single chip, enabling increased performance and reduced power consumption. This technology is crucial in areas like consumer electronics, automotive, and telecommunications, where efficiency and compact design are imperative. The necessity of SoCs is driven by the explosive demand for smart devices, IoT (Internet of Things) systems, and advanced computing devices which require robust yet energy-efficient processing capabilities. End-use applications include smartphones, tablets, smart clothing, and autonomous vehicles, highlighting the diversity and ubiquity of SoCs in modern technology.

    KEY MARKET STATISTICS
    Base Year [2023] USD 194.83 billion
    Estimated Year [2024] USD 209.13 billion
    Forecast Year [2030] USD 321.81 billion
    CAGR (%) 7.43%

    Key growth influencers for the SoC market include advancements in semiconductor manufacturing processes, increased demand for high-speed internet connectivity, and the rise of AI (Artificial Intelligence) and machine learning technologies. These elements, coupled with the expansion of 5G networks, are generating substantial opportunities for growth. Companies can seize these opportunities by focusing on enhancing chip performance, exploring new applications in untapped markets like healthcare and industrial IoT, and forming strategic partnerships to develop innovative solutions.

    However, market growth faces limitations such as high development costs, complexity in designing multifunctional chips, and concerns over data security and privacy. Trade tensions and supply chain disruptions, particularly in semiconductor manufacturing, are challenging factors that affect market dynamics. To mitigate these challenges, businesses should invest in R&D to improve efficiencies, develop robust security measures, and diversify supply chains to enhance resilience.

    Emerging areas for innovation and research include quantum computing, bio-compatible electronics for medical applications, and energy-efficient designs catering to green technology requirements. Despite its complexity, the SoC market remains optimistic, with continuous investment in next-gen technologies fostering both incremental and breakthrough innovations. Firms that prioritize sustainability, scalability, and security will likely drive the next wave of SoC advancements in an increasingly interconnected and smart world.

    Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving System on Chip Market

    The System on Chip Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

    • Market Drivers
      • Rising demand for compact and energy-efficient consumer electronics
      • Growing investment in 5G technology across globe
    • Market Restraints
      • High cost of designing, developing, and maintaining System on Chip
    • Market Opportunities
      • Government initiatives supporting the development of the semiconductor industry
      • High potential for System on Chip with expansion of IoT and AI
    • Market Challenges
      • Technical obstacles associated with device integration in System on Chip

    Porter's Five Forces: A Strategic Tool for Navigating the System on Chip Market

    Porter's five forces framework is a critical tool for understanding the competitive landscape of the System on Chip Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

    PESTLE Analysis: Navigating External Influences in the System on Chip Market

    External macro-environmental factors play a pivotal role in shaping the performance dynamics of the System on Chip Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

    Market Share Analysis: Understanding the Competitive Landscape in the System on Chip Market

    A detailed market share analysis in the System on Chip Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

    FPNV Positioning Matrix: Evaluating Vendors' Performance in the System on Chip Market

    The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the System on Chip Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

    Strategy Analysis & Recommendation: Charting a Path to Success in the System on Chip Market

    A strategic analysis of the System on Chip Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

    Key Company Profiles

    The report delves into recent significant developments in the System on Chip Market, highlighting leading vendors and their innovative profiles. These include Apple Inc., Broadcom Limited, Fujitsu Semiconductor Inc., Huawei Technologies Co., Ltd., Intel Corporation, Marvell Technology Group, Maxim Integrated Products, Inc. by Analog Devices Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors N.V., Qualcomm Inc., Samsung Electronics Co. Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Co. Ltd., and Toshiba Corporation.

    Market Segmentation & Coverage

    This research report categorizes the System on Chip Market to forecast the revenues and analyze trends in each of the following sub-markets:

    • Based on Type, market is studied across Analog, Digital, and Mixed Signal.
    • Based on Product Type, market is studied across Application-Specific Integrated Circuits, Central Processing Units, Digital Signal Processors, Field-Programmable Gate Arrays, Graphics Processing Units, and Microcontroller Units.
    • Based on Integration Type, market is studied across Full Custom Integration, Semicustom Integration, and Standard Cell.
    • Based on Application, market is studied across Automotive, Computing & Data Center, Consumer Electronics, Industrial, and Telecommunications. The Automotive is further studied across ADAS, Advanced Driver Assistance Systems, Infotainment Systems, and Powertrain Electronics. The Consumer Electronics is further studied across Home Appliances, Smartphones, Tablets, and Wearables. The Industrial is further studied across Energy Management and Industrial Automation. The Telecommunications is further studied across Mobile Networks and Network Infrastructure.
    • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

    The report offers a comprehensive analysis of the market, covering key focus areas:

    1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

    2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

    3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

    4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

    5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

    The report also answers critical questions to aid stakeholders in making informed decisions:

    1. What is the current market size, and what is the forecasted growth?

    2. Which products, segments, and regions offer the best investment opportunities?

    3. What are the key technology trends and regulatory influences shaping the market?

    4. How do leading vendors rank in terms of market share and competitive positioning?

    5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

    Table of Contents

    1. Preface

    • 1.1. Objectives of the Study
    • 1.2. Market Segmentation & Coverage
    • 1.3. Years Considered for the Study
    • 1.4. Currency & Pricing
    • 1.5. Language
    • 1.6. Stakeholders

    2. Research Methodology

    • 2.1. Define: Research Objective
    • 2.2. Determine: Research Design
    • 2.3. Prepare: Research Instrument
    • 2.4. Collect: Data Source
    • 2.5. Analyze: Data Interpretation
    • 2.6. Formulate: Data Verification
    • 2.7. Publish: Research Report
    • 2.8. Repeat: Report Update

    3. Executive Summary

    4. Market Overview

    5. Market Insights

    • 5.1. Market Dynamics
      • 5.1.1. Drivers
        • 5.1.1.1. Rising demand for compact and energy-efficient consumer electronics
        • 5.1.1.2. Growing investment in 5G technology across globe
      • 5.1.2. Restraints
        • 5.1.2.1. High cost of designing, developing, and maintaining System on Chip
      • 5.1.3. Opportunities
        • 5.1.3.1. Government initiatives supporting the development of the semiconductor industry
        • 5.1.3.2. High potential for System on Chip with expansion of IoT and AI
      • 5.1.4. Challenges
        • 5.1.4.1. Technical obstacles associated with device integration in System on Chip
    • 5.2. Market Segmentation Analysis
    • 5.3. Porter's Five Forces Analysis
      • 5.3.1. Threat of New Entrants
      • 5.3.2. Threat of Substitutes
      • 5.3.3. Bargaining Power of Customers
      • 5.3.4. Bargaining Power of Suppliers
      • 5.3.5. Industry Rivalry
    • 5.4. PESTLE Analysis
      • 5.4.1. Political
      • 5.4.2. Economic
      • 5.4.3. Social
      • 5.4.4. Technological
      • 5.4.5. Legal
      • 5.4.6. Environmental

    6. System on Chip Market, by Type

    • 6.1. Introduction
    • 6.2. Analog
    • 6.3. Digital
    • 6.4. Mixed Signal

    7. System on Chip Market, by Product Type

    • 7.1. Introduction
    • 7.2. Application-Specific Integrated Circuits
    • 7.3. Central Processing Units
    • 7.4. Digital Signal Processors
    • 7.5. Field-Programmable Gate Arrays
    • 7.6. Graphics Processing Units
    • 7.7. Microcontroller Units

    8. System on Chip Market, by Integration Type

    • 8.1. Introduction
    • 8.2. Full Custom Integration
    • 8.3. Semicustom Integration
    • 8.4. Standard Cell

    9. System on Chip Market, by Application

    • 9.1. Introduction
    • 9.2. Automotive
      • 9.2.1. ADAS
      • 9.2.2. Advanced Driver Assistance Systems
      • 9.2.3. Infotainment Systems
      • 9.2.4. Powertrain Electronics
    • 9.3. Computing & Data Center
    • 9.4. Consumer Electronics
      • 9.4.1. Home Appliances
      • 9.4.2. Smartphones
      • 9.4.3. Tablets
      • 9.4.4. Wearables
    • 9.5. Industrial
      • 9.5.1. Energy Management
      • 9.5.2. Industrial Automation
    • 9.6. Telecommunications
      • 9.6.1. Mobile Networks
      • 9.6.2. Network Infrastructure

    10. Americas System on Chip Market

    • 10.1. Introduction
    • 10.2. Argentina
    • 10.3. Brazil
    • 10.4. Canada
    • 10.5. Mexico
    • 10.6. United States

    11. Asia-Pacific System on Chip Market

    • 11.1. Introduction
    • 11.2. Australia
    • 11.3. China
    • 11.4. India
    • 11.5. Indonesia
    • 11.6. Japan
    • 11.7. Malaysia
    • 11.8. Philippines
    • 11.9. Singapore
    • 11.10. South Korea
    • 11.11. Taiwan
    • 11.12. Thailand
    • 11.13. Vietnam

    12. Europe, Middle East & Africa System on Chip Market

    • 12.1. Introduction
    • 12.2. Denmark
    • 12.3. Egypt
    • 12.4. Finland
    • 12.5. France
    • 12.6. Germany
    • 12.7. Israel
    • 12.8. Italy
    • 12.9. Netherlands
    • 12.10. Nigeria
    • 12.11. Norway
    • 12.12. Poland
    • 12.13. Qatar
    • 12.14. Russia
    • 12.15. Saudi Arabia
    • 12.16. South Africa
    • 12.17. Spain
    • 12.18. Sweden
    • 12.19. Switzerland
    • 12.20. Turkey
    • 12.21. United Arab Emirates
    • 12.22. United Kingdom

    13. Competitive Landscape

    • 13.1. Market Share Analysis, 2023
    • 13.2. FPNV Positioning Matrix, 2023
    • 13.3. Competitive Scenario Analysis
      • 13.3.1. Qorvo's innovative SoC solution revolutionizing the smart home device market ecosystem
      • 13.3.2. SiMa.ai's MLSoC Modalix drives multi-modal intelligence with a power-efficient edge platform
      • 13.3.3. BigEndian Semiconductors secures USD 3 million investment to drive India's presence in the global SoC market
      • 13.3.4. Strategic merger of SK Telecom's AI chip unit sets the stage for innovation in system on chip advancements
      • 13.3.5. L&T's strategic acquisition of SiliConch Systems to enhance semiconductor capabilities and market presence
      • 13.3.6. Mindgrove revolutionizes India's market with first indigenous microcontroller for better OEM efficiency
      • 13.3.7. AMD revolutionizes AI-driven embedded systems with enhanced Versal Gen 2 adaptive SoC portfolio
      • 13.3.8. Strategic alliance between HCLTech and CAST to drive innovation in custom chip solutions for diverse industries
      • 13.3.9. Strategic investment by Taisys boosts India's automotive semiconductor industry with USD 100 million for OneChip(TM) platform innovation
      • 13.3.10. Intel and Cadence forge strategic alliance to enhance advanced SoC design for AI, HPC, and mobile applications
    • 13.4. Strategy Analysis & Recommendation
      • 13.4.1. Qualcomm Inc.
      • 13.4.2. Broadcom Limited
      • 13.4.3. Samsung Electronics Co. Ltd.
      • 13.4.4. Intel Corporation

    Companies Mentioned

    • 1. Apple Inc.
    • 2. Broadcom Limited
    • 3. Fujitsu Semiconductor Inc.
    • 4. Huawei Technologies Co., Ltd.
    • 5. Intel Corporation
    • 6. Marvell Technology Group
    • 7. Maxim Integrated Products, Inc. by Analog Devices Inc.
    • 8. Microchip Technology Inc.
    • 9. NVIDIA Corp.
    • 10. NXP Semiconductors N.V.
    • 11. Qualcomm Inc.
    • 12. Samsung Electronics Co. Ltd.
    • 13. STMicroelectronics N.V.
    • 14. Taiwan Semiconductor Manufacturing Co. Ltd.
    • 15. Toshiba Corporation
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