칩 렛 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the chiplet market size is projected to be USD 52.45 billion in 2025, USD 65.31 billion in 2026, and reach USD 188.79 billion by 2031, growing at a CAGR of 23.65% from 2026 to 2031.

This report is Segmented by Processor Type (Central Processing Units (CPUs), Graphics Processing Units (GPUs), and More), Packaging Technology (2. 5D Interposer/Bridge-Based Packaging, 3D Stacked/Hybrid-Bonded Packaging, and More), End-User Industry (Data Centers and Cloud Computing, High-Performance Computing, Automotive and Mobility, and More), and Geography. The Market Forecasts in Provided in Terms of Value (USD).

Global Chiplet Market Trends and Insights

AI And HPC Reticle-Limit Escape

The chiplet market is being pushed forward by the simple fact that very large AI and HPC processors are no longer practical as single monolithic dies at the leading edge. As compute demand rises, multi-die integration gives designers a way to scale logic, memory access, and I/O without forcing every function onto one oversized piece of silicon. This is why the chiplet market is now closely tied to the server CPU and AI accelerator road map, not just to packaging innovation. AMD said in May 2026 that its 6th Gen EPYC Venice processor entered production on TSMC 2nm technology, which confirms that chiplet-based CPU design remains the proven path into next-generation server silicon. The chiplet market also benefits because smaller reusable dies lower the economic barrier for companies that cannot fund a full leading-edge system-on-chip program. That cost and yield advantage is turning chiplet design from a high-end option into a core product strategy across advanced compute programs.

HBM-Centered 2.5D And 3D Package Adoption

The chiplet market is also being lifted by the way AI systems now combine compute logic with stacked memory in dense package-level designs. In practice, that means advanced packages are no longer a supporting feature, they are becoming the performance center of the full device. The chiplet market gains from this shift because package architecture now decides bandwidth, latency, and scaling efficiency as much as transistor density does. The UCIe 3.0 specification released in August 2025 doubled supported data rates to 48 GT/s and 64 GT/s, extended sideband reach, and added new manageability features, which makes more demanding multi-die package designs easier to support over time. That improvement matters because memory and logic are increasingly being designed together at package level rather than selected separately late in the process. As a result, the chiplet market is moving toward deeper co-development between accelerator designers, packaging specialists, and memory suppliers.

Thermal And Power-Delivery Bottlenecks In Dense Packages

The chiplet market faces a clear engineering limit in thermal management as more compute and memory are packed into the same footprint. Dense 2.5D and 3D package designs create heat loads that standard cooling approaches struggle to handle outside the largest data center environments. This is a direct restraint on the chiplet market because deployment can be delayed even when the silicon itself is ready for shipment. A February 2026 study in Materials showed that intelligent thermal optimization for chiplet-based heterogeneous packages improved thermal resistance by 31% and pressure drop by 42% at 500 W/cm2, but it still depended on embedded microfluidic structures rather than conventional cooling methods. A July 2025 paper in Scientific Reports also showed that electrothermal co-optimization in 2.5D power networks can cut error rates below 4%, though it adds significant manufacturing complexity and cost. The result is that the chiplet market remains strongest in hyperscale settings, while broader enterprise rollout still depends on better thermal and power-delivery solutions.

Other drivers and restraints analyzed in the detailed report include:

1. Advanced-Node NRE Reduction Through IP Reuse
2. 5G, Cloud, And Networking Demand For Disaggregated Silicon
3. Immature Cross-Vendor Interoperability And IP Liability

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

CPUs held 34.54% of chiplet market share in 2025, while AI accelerator ASICs are projected to grow at a 25.43% CAGR through 2031. That leadership reflects the scale of the existing server CPU base and the fact that chiplet-based CPU layouts are already proven in cloud and enterprise deployments. The chiplet market has therefore leaned on CPUs for near-term revenue while using AI ASICs as the main forward growth engine. AMD's continuing EPYC road map, including the May 2026 production ramp for Venice on TSMC 2nm, shows that advanced server CPUs still rely on chiplet partitioning to move into the next node generation. The chiplet market also benefits because CPU platforms give buyers a familiar validation path, which lowers adoption risk when compared with completely new accelerator categories.

AI accelerator ASICs are expanding faster because hyperscalers want silicon tuned for specific training and inference workloads rather than only general-purpose compute. That pushes the chiplet market toward custom compute tiles, specialized memory arrangements, and tighter package-level optimization for each deployment profile. GPUs still retain major revenue weight in AI training, yet the line between GPUs, CPUs, DPUs, LPUs, and other accelerators is becoming less distinct. NVIDIA's Vera Rubin platform combines multiple processor classes inside one system architecture, which shows how heterogeneous integration is blurring the old processor type boundaries. The chiplet industry is therefore moving toward mixed processor platforms rather than clean single-category products.

Geography Analysis

Asia-Pacific held 35.93% of chiplet market share in 2025, which made it the largest regional base for the chiplet market. The region leads because Taiwan remains central to advanced foundry output and package integration, while South Korea adds major memory and packaging capability. The chiplet market also depends on the depth of Asia-Pacific's OSAT and substrate ecosystem, which supports scale production in ways few other regions can match. AMD's May 2026 update on Venice production at TSMC 2nm reinforces Taiwan's role as the core execution hub for advanced server chip programs. Japan is strengthening its position in the chiplet market through equipment, materials, and packaging capacity as the regional supply chain moves deeper into advanced-node manufacturing. SEAJ projected that Japan's domestic semiconductor equipment market would grow 22% in fiscal 2026, which points to a stronger local pipeline for future packaging and chip fabrication capability.

North America is projected to expand at a 26.41% CAGR through 2031, making it the fastest-growing geography in the chiplet market. Growth is being driven by the concentration of hyperscalers, fabless chip companies, advanced system designers, and policy-led investment in domestic semiconductor capacity. The chiplet market is especially active in North America because many of the companies defining AI system architecture are based there, even when manufacturing still spans Asia-Pacific. Ayar Labs closed a USD 500 million Series E round in March 2026 and said it would use the funding to accelerate production of co-packaged optics and expand operations in Taiwan, which captures the region's role as a design and capital center connected to Asian manufacturing execution. The NVIDIA and Marvell NVLink Fusion partnership announced in March 2026 also highlights how the chiplet market in North America is being shaped by platform alliances around custom XPUs, networking, and photonics.

Europe holds a smaller position in the chiplet market, yet it is becoming more relevant through automotive, industrial, aerospace, and secure-compute use cases. The region's demand profile favors validated and application-specific multi-die solutions rather than sheer shipment scale. South America and the Middle East and Africa remain early-stage participants in the chiplet market, with demand tied mostly to imported AI infrastructure and cloud data center build-outs. These regions are still modest today, but they should become more visible as hyperscaler reach expands and advanced compute platforms spread into more end markets.

1. Advanced Micro Devices, Inc.
2. Intel Corporation
3. NVIDIA Corporation
4. Broadcom Inc.
5. Marvell Technology, Inc.
6. Taiwan Semiconductor Manufacturing Company Limited
7. Samsung Electronics Co., Ltd.
8. International Business Machines Corporation
9. MediaTek Inc.
10. Achronix Semiconductor Corporation
11. Alphawave IP Group plc
12. Ayar Labs, Inc.
13. Rapidus Corporation
14. Renesas Electronics
15. Tenstorrent Holdings, Inc.
16. SiFive, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AI and HPC Reticle-limit Escape
  • 4.2.2 Hbm-centered 2.5D/3D Package Adoption
  • 4.2.3 Advanced-node NRE Reduction Through IP Reuse
  • 4.2.4 5G, Cloud, and Networking Demand for Disaggregated Silicon
  • 4.2.5 Optical I/O Chiplets for Rack-scale AI Scale-up
  • 4.2.6 KGD Testing and UCIe Alliances De-risk Merchant Chiplets
• 4.3 Market Restraints
  • 4.3.1 Thermal and Power-delivery Bottlenecks in Dense Packages
  • 4.3.2 Immature Cross-vendor Interoperability and IP Liability
  • 4.3.3 Yield Compounding and Test-cost Inflation in KGD Flows
  • 4.3.4 CoWoS, Interposer, Substrate, and Optical-packaging Bottlenecks
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Rivalry Among Competitors

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Processor Type
  • 5.1.1 Central Processing Units (CPUs)
  • 5.1.2 Graphics Processing Units (GPUs)
  • 5.1.3 AI Accelerator ASICs
  • 5.1.4 Field-Programmable Gate Arrays (FPGAs) and Adaptive SoCs
  • 5.1.5 Networking and Data Processing Units (NPUs/DPUs)
  • 5.1.6 Other Chiplet-Based Processor Types
• 5.2 By Packaging Technology
  • 5.2.1 2.5D Interposer/Bridge-Based Packaging
  • 5.2.2 3D Stacked/Hybrid-Bonded Packaging
  • 5.2.3 Fan-Out/RDL-Based Advanced Packaging
  • 5.2.4 Organic Substrate-Based Multi-Die Packaging
  • 5.2.5 Other Packaging Technologies
• 5.3 By End-user Industry
  • 5.3.1 Data Centers and Cloud Computing
  • 5.3.2 High-Performance Computing
  • 5.3.3 Consumer Computing
  • 5.3.4 Automotive and Mobility
  • 5.3.5 Telecommunications and Networking
  • 5.3.6 Industrial and Edge AI
  • 5.3.7 Aerospace and Defense
  • 5.3.8 Other End-user Industries
• 5.4 By Geography
  • 5.4.1 North America
    • 5.4.1.1 United States
    • 5.4.1.2 Canada
    • 5.4.1.3 Mexico
  • 5.4.2 Europe
    • 5.4.2.1 Germany
    • 5.4.2.2 United Kingdom
    • 5.4.2.3 France
    • 5.4.2.4 Italy
    • 5.4.2.5 Rest of Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 South Korea
    • 5.4.3.4 Taiwan
    • 5.4.3.5 India
    • 5.4.3.6 Rest of Asia-Pacific
  • 5.4.4 South America
    • 5.4.4.1 Brazil
    • 5.4.4.2 Argentina
    • 5.4.4.3 Rest of South America
  • 5.4.5 Middle East and Africa
    • 5.4.5.1 United Arab Emirates
    • 5.4.5.2 Saudi Arabia
    • 5.4.5.3 South Africa
    • 5.4.5.4 Rest of Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Vendor Positioning Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Advanced Micro Devices, Inc.
  • 6.4.2 Intel Corporation
  • 6.4.3 NVIDIA Corporation
  • 6.4.4 Broadcom Inc.
  • 6.4.5 Marvell Technology, Inc.
  • 6.4.6 Taiwan Semiconductor Manufacturing Company Limited
  • 6.4.7 Samsung Electronics Co., Ltd.
  • 6.4.8 International Business Machines Corporation
  • 6.4.9 MediaTek Inc.
  • 6.4.10 Achronix Semiconductor Corporation
  • 6.4.11 Alphawave IP Group plc
  • 6.4.12 Ayar Labs, Inc.
  • 6.4.13 Rapidus Corporation
  • 6.4.14 Renesas Electronics
  • 6.4.15 Tenstorrent Holdings, Inc.
  • 6.4.16 SiFive, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Needs Assessment