AI GPU용 HBM 시장 : 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the HBM for AI GPUs market size is expected to increase from USD 8.88 billion in 2025 to USD 12.56 billion in 2026 and reach USD 46.82 billion by 2031, growing at a CAGR of 30.10% over 2026-2031.

This report is Segmented by Generation (HBM2e, HBM3, Hbm3e, and HBM4), Memory Capacity (Up To 32 GB, 32-64 GB, 64-128 GB, and More), Application (Training GPUs, Inference GPUs, HPC and Scientific AI, and Edge AI), End User (Hyperscalers, Enterprise AI, Research and Supercomputing, and Government and Defense), and Geography (Asia-Pacific, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global HBM For AI GPUs Market Trends and Insights

AI GPU Memory Bandwidth Bottlenecks Raising HBM Attach Rates

The HBM for AI GPUs market is moving higher because modern large language model inference is often limited by memory movement rather than raw compute throughput. NVIDIA stated that the GB300 Blackwell Ultra integrates eight 12-high HBM3e stacks, delivering 288GB and 8TB/s per GPU, demonstrating how memory capacity is rising with each new accelerator generation. That design change matters because it is architectural rather than temporary, which means higher HBM content remains tied to each new product cycle, even if unit shipment patterns shift across HBM for the AI GPU market. Longer reasoning contexts also raise key-value cache requirements, so lower-capacity configurations become less suitable for production inference as model context windows expand. This makes bandwidth limits a durable revenue driver for suppliers, as HBM becomes a required design element rather than a premium option in the AI GPU market. The result is that the memory stack keeps gaining strategic weight in accelerator bill of materials as AI hardware moves toward higher-capacity and taller-stack configurations.

Rapid HBM3e Adoption In Next-Generation Training Clusters

HBM3e quickly moved into the lead because it offered a clear bandwidth advantage over HBM3 and became the standard on the most advanced training platforms. NVIDIA listed the H200 with 141GB of HBM3e and 4.8 TB/s of memory bandwidth, which helped define the new performance floor for large-scale training deployments. Google also described Ironwood TPU with 192GB of HBM3e and 7,300GB/s, while AWS presented Trainium3 with 144GB of HBM3e and 4.9TB/s, showing that hyperscaler custom silicon is reinforcing the same memory standard across competing platforms. This matters for the HBM for AI GPU market because HBM demand no longer depends solely on NVIDIA shipments and instead draws support from a broader set of accelerator programs. SK hynix said its FY2025 record results were driven by AI memory demand, underscoring how quickly training-cluster deployment translated into HBM revenue expansion. The wider implication is that HBM3e became the minimum practical specification for frontier AI infrastructure within a single cycle, accelerating supplier utilization and keeping HBM for the AI GPU market on a steep growth path.

High Cost Of HBM Stacks And Interposer Integration

The HBM for the AI GPU market still faces a meaningful brake from the cost of stacked memory and the advanced packaging needed to make it usable in top-end accelerators. The input material makes clear that HBM remains far more expensive than conventional DRAM, and that the cost rises further when several stacks and complex interposer packaging are added to a single chip. This has an uneven effect across the HBM for AI GPUs market because hyperscalers can absorb higher procurement costs more easily than smaller enterprises, academic buyers, and public-sector programs with fixed budgets. The pressure also flows through the supply chain, as higher memory and packaging costs affect accelerator pricing before systems reach end users. That slows adoption outside the highest-value workloads, even when technical demand is clear, and performance gains are strong. Until cost curves improve, the HBM for AI GPUs market will remain most accessible to buyers who can justify premium systems through large-scale training or production inference economics.

Other drivers and restraints analyzed in the detailed report include:

1. Advanced Packaging Capacity Expansion Unlocking HBM Output
2. HBM4 Roadmap Pulling Forward Qualification And Supply Agreements
3. Limited CoWoS And Other Advanced-Packaging Capacity

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

HBM3e accounted for 58.67% of revenue in 2025, making it the largest generation in the HBM for the AI GPU market during the current platform cycle. Its lead came from broad deployment across the NVIDIA H200, Blackwell B200, and Google Ironwood TPU, all of which set a higher memory threshold for competitive AI hardware. HBM3 still retained residual demand through ongoing H100 production, while HBM2e remained tied to older HPC and cost-sensitive scientific computing workloads that no longer define the center of the HBM for AI GPUs industry. The structure of this segment is also shaped by qualification rules because JEDEC interoperability standards create a lag between engineering samples and meaningful volume revenue. That lag brings more predictability to generational handovers than in many other semiconductor categories because customers commit earlier and suppliers need a longer validation window. Within that pattern, HBM3e benefited from being the first broadly available generation that aligned with the memory needs of both large training clusters and more demanding inference systems. It therefore served as both the revenue anchor of 2025 and the bridge between legacy HBM3 deployments and the first HBM4 commercial ramps. The result is that HBM3e did not simply replace HBM3, and instead reset the baseline specification across the HBM for AI GPU market.

HBM4 is projected to be the fastest-growing generation through 2031, and that makes it the most important forward driver inside this segment. The input states that HBM4 entered the revenue mix in 2026 with volume shipments tied to NVIDIA Vera Rubin, after all 3 major suppliers qualified for the platform in the same year. SK hynix also said it shipped 12-layer HBM4E samples in June 2026 ahead of its earlier timeline, while Samsung supplied HBM4E samples in late May 2026, which shows how quickly development cycles are compressing. That speed matters because the HBM for AI GPUs market size for next-generation memory is being shaped by shorter recovery windows for each generation's qualification costs and by faster migration toward premium products. The segment also reflects a pricing pattern in which newer memory generations hold elevated average selling prices before cost learning spreads through manufacturing. HBM4 therefore carries both volume growth and mix improvement potential for suppliers that qualify early and scale efficiently. This keeps the HBM for AI GPU market centered on a rapid generational ladder, where leadership depends on qualification timing as much as on raw manufacturing capacity. It also means customers are increasingly planning procurement around future roadmaps instead of only current deployment cycles.

The 64-128 GB tier held a 48.34% revenue share in 2025, which placed it at the center of the HBM for the AI GPU market size during the base year. That position was supported by systems such as the H200 at 141GB and by platforms close to the boundary of the next capacity band, which kept this range commercially broad. The up to 32 GB segment continued to lose importance as older HBM2e designs gave way to denser successors, while the 32-64 GB range remained relevant for mid-tier inference and edge HPC use cases that did not yet require top-end memory pools. The main force in this segment is that model hosting and training requirements are steadily pushing buyers toward larger configurations. In practical terms, higher memory capacity is no longer just a premium feature; it is becoming a baseline requirement for strong performance on larger models. That shift has already influenced replacement cycles, as cloud operators have used H200 upgrades to improve inference latency and capacity compared with H100-based nodes. It also changed the demand profile in the HBM for AI GPUs market, as memory capacity now tracks directly with the commercial usefulness of deployed compute. For that reason, capacity segmentation increasingly mirrors workload complexity instead of price brackets alone.

The above 128 GB band is expected to record the fastest growth through 2031 and is becoming the most strategic capacity tier in the HBM for AI GPUs market. NVIDIA described the GB300 Blackwell Ultra with 288GB per GPU, while Google presented TPU 8t around the same 288GB class, confirming that major vendors are converging on the same high-capacity bracket. NVIDIA also highlighted GB300 NVL72 with 37TB of total HBM3e across 72 GPUs, which shows how rack-scale design is now built around very large aggregate memory pools. This matters because the HBM for AI GPUs market share is shifting toward denser configurations that carry higher per-system memory content and stronger pricing power. The move to 12-high stacks also supports that mix shift because these builds are more complex and keep value concentrated in higher-capacity hardware. Revenue therefore grows faster than unit volume when demand migrates toward the top of the capacity ladder. This reinforces the premium end of the HBM for AI GPU market and raises the importance of suppliers that can maintain yields on taller stacks. It also supports a longer runway for premium pricing as the installed base moves toward memory-heavy inference and training systems.

Complete Report Scope:

• By HBM Generation
  • HBM2e
  • HBM3
  • HBM3e
  • HBM4
• By Memory Capacity
  • Up to 32 GB
  • 32-64 GB
  • 64-128 GB
  • Above 128 GB
• By Application
  • Training GPUs
  • Inference GPUs
  • HPC and Scientific AI
  • Edge AI
• By End User
  • Hyperscalers and Cloud Service Providers
  • Enterprise AI Deployments
  • Research and Supercomputing Centers
  • Government and Defense
• Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

North America accounted for 52.43% of the HBM for AI GPUs market in 2025, making it the largest regional contributor by revenue. The region benefits from the concentration of the largest hyperscalers, the leading AI GPU designer, and many of the most advanced model developers in the United States. That combination creates a tight link between hardware design, cloud deployment, and end demand, which keeps the regional base strong across the HBM-based AI GPU market. U.S. export policy also shaped regional demand patterns in 2026, as BIS confirmed that license requirements for advanced computing items extend to entities headquartered in Country Group D:5, even when they are outside China. This narrowed the pool of accessible customers for the most advanced systems and pushed more compliant shipment opportunities toward domestic and allied-country demand. NVIDIA also stated that Microsoft, Oracle Cloud Infrastructure, and CoreWeave are deploying GB300 NVL72 systems, which support near-term shipment visibility tied to Blackwell Ultra platforms. The region, therefore, remains central not only because it buys large volumes, but also because it shapes the timing of platform adoption across the rest of the HBM for the AI GPU market.

Asia Pacific is projected to be the fastest-growing region over 2026-2031, driven by a mix of supply leadership and rising regional compute investment. The region already sits close to the production core of the HBM for the AI GPUs market because South Korea remains the main HBM manufacturing base, and Taiwan remains essential in advanced packaging flows. That supply position matters because regional companies influence qualification pace, allocation decisions, and generational ramp timing across the whole market. At the same time, the input shows growing sovereign and hyperscaler-backed AI infrastructure activity across South Korea, Japan, and India, which adds local demand on top of export-oriented supply. This combination makes Asia Pacific different from North America because it participates heavily on both sides of the HBM for AI GPUs market, as a manufacturing anchor and as a rising deployment destination. It also means that regional policy, capital spending, and technology roadmaps can simultaneously affect both volume availability and end-market absorption. For that reason, Asia Pacific's growth profile is broader than a simple catch-up story and reflects its role as a core operating base for the global HBM chain.

Europe held a meaningful but smaller share in 2025, with Germany, the United Kingdom, and France serving as the main regional centers for AI infrastructure deployment in the input material. The region moved more slowly because procurement cycles are longer and compliance priorities have often preceded large hardware ramps, which kept growth below North America and Asia Pacific in the HBM for AI GPUs market. South America, the Middle East, and Africa remained early-stage contributors, though sovereign compute programs in the Middle East suggest these markets could gain greater weight later in the forecast period. The geographic mix, therefore, remains uneven, with the HBM for the AI GPU market size still concentrated in regions that combine high-end compute demand, platform access, and strong links to the semiconductor supply chain.

1. SK hynix Inc.
2. Samsung Electronics Co., Ltd.
3. Micron Technology, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Impact of Macroeconomic Factors on the Market
• 4.3 Market Drivers
  • 4.3.1 AI GPU Memory Bandwidth Bottlenecks Raising HBM Attach Rates
  • 4.3.2 Advanced Packaging Capacity Expansion Unlocking HBM Output
  • 4.3.3 Rapid HBM3e Adoption in Next-Generation Training Clusters
  • 4.3.4 Hyperscaler Custom Accelerator Programs Increasing HBM Design Wins
  • 4.3.5 Rising Multi-Die GPU Architectures Increasing Per-Accelerator Memory Content
  • 4.3.6 HBM4 Roadmap Pulling Forward Qualification and Supply Agreements
• 4.4 Market Restraints
  • 4.4.1 Limited CoWoS and Other Advanced-Packaging Capacity
  • 4.4.2 High Cost of HBM Stacks and Interposer Integration
  • 4.4.3 Yield Losses in High-Stack DRAM Assembly
  • 4.4.4 Export Controls and Customer Concentration Risk in AI GPUs
• 4.5 Industry Supply Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By HBM Generation
  • 5.1.1 HBM2e
  • 5.1.2 HBM3
  • 5.1.3 HBM3e
  • 5.1.4 HBM4
• 5.2 By Memory Capacity
  • 5.2.1 Up to 32 GB
  • 5.2.2 32-64 GB
  • 5.2.3 64-128 GB
  • 5.2.4 Above 128 GB
• 5.3 By Application
  • 5.3.1 Training GPUs
  • 5.3.2 Inference GPUs
  • 5.3.3 HPC and Scientific AI
  • 5.3.4 Edge AI
• 5.4 By End User
  • 5.4.1 Hyperscalers and Cloud Service Providers
  • 5.4.2 Enterprise AI Deployments
  • 5.4.3 Research and Supercomputing Centers
  • 5.4.4 Government and Defense
• 5.5 Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 Southeast Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
  • 6.4.1 SK hynix Inc.
  • 6.4.2 Samsung Electronics Co., Ltd.
  • 6.4.3 Micron Technology, Inc.
• 6.5 Other Ecosystem Players
  • 6.5.1 NVIDIA Corporation
  • 6.5.2 Advanced Micro Devices, Inc.
  • 6.5.3 Intel Corporation
  • 6.5.4 Taiwan Semiconductor Manufacturing Company Limited
  • 6.5.5 ASE Technology Holding Co., Ltd.
  • 6.5.6 Amkor Technology, Inc.
  • 6.5.7 Tokyo Electron Limited
  • 6.5.8 Applied Materials, Inc.
  • 6.5.9 Lam Research Corporation
  • 6.5.10 Kioxia Holdings Corporation
  • 6.5.11 SanDisk Corporation
  • 6.5.12 Renesas Electronics Corporation
  • 6.5.13 Qualcomm Incorporated
  • 6.5.14 Broadcom Inc.
  • 6.5.15 Marvell Technology, Inc.
  • 6.5.16 Apple Inc.
  • 6.5.17 Alibaba Group Holding Limited
  • 6.5.18 Alphabet Inc.
  • 6.5.19 Amazon.com, Inc.
  • 6.5.20 Microsoft Corporation
  • 6.5.21 Meta Platforms, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment