감광성 반도체 디바이스 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the photosensitive semiconductor device market size reached USD 4.21 billion in 2026 and is projected to grow to USD 5.22 billion by 2031, reflecting a 4.35% CAGR over the forecast period.

This report is Segmented by Device (Photocell, Photodiode, Phototransistor, and More), Material (Silicon, Germanium, and More), Operating Mode (Photovoltaic, Photoconductive, and Avalanche), Application (Optical Communication, Automotive, and More), End User (Automotive OEMs, Consumer Electronics, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Photosensitive Semiconductor Device Market Trends and Insights

Rising Automotive ADAS and LiDAR Adoption

LiDAR unit shipments reached 830,000 during the first three quarters of 2025 as Chinese sport-utility vehicles priced below USD 40,000 adopted solid-state scanners. European regulations requiring automatic emergency braking by model-year 2027 are accelerating avalanche-photodiode demand in forward-facing camera clusters. North American tier-one suppliers increased purchase orders by 40% in late 2025, driven by rollouts from General Motors and Ford. Time-of-flight arrays need sub-10-nanosecond response, creating a moat for incumbents that already hold AEC-Q101 qualifications. Unit prices have fallen roughly 60% since 2024, expanding addressable volume but squeezing margins for photodetector vendors.

Exploding Multi-Camera Smartphone Shipments

Handsets with three or more rear cameras surpassed 720 million units in 2025, up from 580 million in 2024, as mid-tier Android models adopted ultra-wide and telephoto modules. Sony's stacked sensors integrate phase-detection pixels and high-dynamic-range processing, while Samsung's ISOCELL GNJ shrinks module height by 8%. Chinese brands now specify back-side-illuminated arrays with on-chip analog-to-digital conversion that cuts power draw by 20%, meeting battery-life constraints imposed by 5G modems. Alignment of ISO 12233 and IEEE P2020 standards is allowing dual-use designs for smartphones and in-cabin monitoring, speeding product reuse.

Increasing Price Pressure

Average selling prices for mainstream CMOS sensors fell 12% between Q4 2024 and Q3 2025 as Chinese startups undercut incumbents. Automotive integrators now expect annual 5-7% unit cost reductions, eroding margins for discrete photodiodes. Computational photography extends flagship-level image quality to lower-resolution sensors, dampening hardware upgrades. System-on-chip integration shifts value toward foundry partners, leaving traditional sensor vendors with a shrinking share of the bill-of-material.

Other drivers and restraints analyzed in the detailed report include:

1. On-Sensor AI Processing Reducing Bandwidth and System Cost
2. Demand for Improved Imaging and Optical Sensing
3. Limited Supply of Ultra-High-Purity Silicon Wafers

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

CMOS image sensors contributed 41.28% of 2025 revenue and remain the volume backbone of the photosensitive semiconductor device market. Their dominance rests on stacked architectures that decouple pixel and logic wafers, allowing larger full-well capacity, faster readout, and on-sensor artificial-intelligence blocks that remove external signal processors. Sony, Samsung, and SK hynix collectively shipped more than 100 million stacked units in 2025, enabling 8 K video at 60 frames per second and sustained 480-frame bursts for computational photography. Back-side-illuminated layouts now cover roughly 70% of smartphone output, a jump from 55% in 2023, as mid-tier Android handsets demanded sub-0.7 micrometer pixels to preserve low-light sensitivity. The photosensitive semiconductor device market size tied to stacked sensors is forecast to rise from USD 1.74 billion in 2026 to USD 2.15 billion by 2031, supported by continued camera proliferation in wearables and drones.

Discrete photodiodes PIN, PN, avalanche, and Schottky variants occupy a resilient niche in optical communication, medical imaging, and industrial automation, where spectral customization and AEC-Q101 validation outweigh the integration advantages of image sensors. Single-photon avalanche diode and quantum image sensor arrays exhibit the fastest trajectory, advancing at a 4.89% CAGR as automakers and lidar makers require picosecond timing precision. Photo-ICs that merge photodiodes with transimpedance amplifiers and comparators are expanding in health-monitoring patches and augmented-reality headsets because they cut board area by half and power draw by one-third. In contrast, phototransistors, photoresistors, and legacy photocells account for under 2% of photosensitive semiconductor device market share and are slowly retreating to low-speed optocouplers and ambient-light modules. Reliability in automotive reflow remains an open challenge; forward-voltage drift forced suppliers to specify tighter junction-capacitance windows and dark-current ceilings, raising test cost but preserving field performance.

Silicon held 62.16% of 2025 value because decades of complementary metal-oxide-semiconductor process tuning keep defect densities low and cost per pixel unmatched. Its grip is strongest in smartphones, automotive surround-view cameras, and machine-vision systems, where wafer tooling and circuit libraries are highly amortized. Even so, marginal cost gains are tapering as pixel pitch nears 0.5 micrometers and quantum-efficiency ceilings approach 95% in the visible band. Suppliers are therefore stretching silicon through advanced doping profiles, backside deep-trench isolation, and wafer bonding to retain competitiveness. The photosensitive semiconductor device market size linked to silicon is expected to inch upward at a sub-4% CAGR, yet its overall share slips as alternatives mature.

Perovskite and organic semiconductors represent the most credible long-term threat. Research groups in Japan and South Korea reported external quantum efficiency above 80% in the 800-1,200 nanometer band during 2025, performance that undercuts indium gallium arsenide at one-tenth of material cost. Panasonic's pilot line for dashboard-integrated organic photodiodes illustrates early commercialization, while Hamamatsu and ON Semiconductor have disclosed roadmap evaluations for perovskite avalanche structures that promise internal gain without high reverse bias. Qualification gaps persist because neither IEC 60747 nor AEC-Q101 defines reliability rules for solution-processed layers; tier-one automotive suppliers are crafting bespoke 1,000-hour humidity and UV tests, adding up to 12 months to launch cycles. Germanium and indium gallium arsenide remain entrenched in telecom and spectroscopy, but their premium pricing will face incremental erosion once perovskite detectors prove 10,000-hour stability under 85 °C and 85% relative humidity.

Complete Report Scope:

• By Device
  • Photocell
  • Photodiode
    • PIN Photodiode
    • PN Photodiode
    • Avalanche Photodiode
    • Schottky Photodiode
  • Phototransistor
  • Photoresistor
  • Photo IC
  • CMOS Image Sensor
    • BSI Sensor
    • Stacked Sensor
  • SPAD / QIS
• By Material
  • Silicon
  • Germanium
  • Indium Gallium Arsenide
  • Gallium Arsenide
  • Organic Semiconductor
  • Perovskite and Other Emerging Materials
• By Operating Mode
  • Photovoltaic Mode
  • Photoconductive Mode
  • Avalanche Mode
• By Application
  • Optical Communication and Datacom
  • Automotive and Transportation
    • LiDAR
    • ADAS Cameras
  • Consumer Electronics
    • Smartphones and Tablets
    • Wearables and AR/VR
  • Healthcare and Medical Imaging
  • Industrial Automation and Robotics
  • Security and Surveillance
  • Scientific Research and Instrumentation
• By End User
  • Automotive OEMs
  • Consumer Electronics OEMs
  • Aerospace and Defence Contractors
  • Healthcare Device Manufacturers
  • Industrial and Manufacturing Firms
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • ASEAN
    • Oceania
  • Middle East
    • GCC
    • Turkey
    • Rest of Middle East
  • AFRICA
    • South Africa
    • North Africa
    • Rest of Africa

Geography Analysis

Asia Pacific contributed 44.17% of 2025 revenue and is projected to expand at 5.81% through 2031. Chinese electric-vehicle makers installed more LiDAR units than the rest of the world combined in 2025, while South Korean foundries shipped over 400 million smartphone image sensors. Japanese specialists dominate avalanche photodiodes for medical and scientific systems, and India plus ASEAN states are scaling module assembly although fabrication stays concentrated in China, Japan, South Korea, and Taiwan.

North America generated about 25% of value in 2025, driven by automotive ADAS, data-center optical links, and defense programs. However, the region relies on Japanese epitaxial wafers, exposing it to the same lead-time shocks faced by global peers. Teledyne and ON Semiconductor operate local wafer fabs, yet capacity expansion lags Asia's scale. Regulatory momentum from the National Highway Traffic Safety Administration for automatic emergency braking is encouraging LiDAR integration, but manufacturing subsidies trail the European Chips Act.

Europe and the Middle East delivered roughly 22% of revenue in 2025. German and French plants adopted surround-view cameras to meet General Safety Regulation mandates, lifting regional image-sensor shipments by 35%. Absence of local LiDAR photodiode suppliers compels automakers to source from Japan and the United States, prompting European policy initiatives to fund joint ventures. South America and Africa combined for under 9% of revenue, with adoption focused on mining automation and telecom backhaul; reliance on imports and exchange-rate volatility constrains growth.

1. Sony Semiconductor Solutions
2. Samsung System LSI
3. Hamamatsu Photonics K.K.
4. ON Semiconductor Corporation
5. STMicroelectronics N.V.
6. Teledyne Technologies Inc.
7. Canon Inc.
8. Panasonic Corporation
9. SK hynix Inc.
10. OmniVision Technologies, Inc.
11. Excelitas Technologies Corp.
12. First Sensor AG
13. Vishay Intertechnology Inc.
14. ROHM Co., Ltd.
15. Everlight Electronics Co. Ltd.
16. Kyosemi Corporation
17. OSI Optoelectronics, Inc.
18. Laser Components GmbH
19. Broadcom Inc.
20. Thorlabs Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Industry Value / Supply-Chain Analysis
• 4.3 Regulatory Landscape
• 4.4 Technological Outlook
• 4.5 Impact of Macroeconomic Factors on the Market
• 4.6 Porter's Five Forces Analysis
  • 4.6.1 Bargaining Power of Suppliers
  • 4.6.2 Bargaining Power of Consumers
  • 4.6.3 Threat of New Entrants
  • 4.6.4 Threat of Substitutes
  • 4.6.5 Intensity of Competitive Rivalry
• 4.7 Market Drivers
  • 4.7.1 Rising Automotive ADAS and LiDAR Adoption
  • 4.7.2 Exploding Multi-Camera Smartphone Shipments
  • 4.7.3 Demand for Improved Imaging and Optical Sensing
  • 4.7.4 Long Life and Low Power Consumption
  • 4.7.5 Emergence of Organic Photodetectors for Flexible Electronics
  • 4.7.6 On-Sensor AI Processing Reducing Bandwidth and System Cost
• 4.8 Market Restraints
  • 4.8.1 Increasing Price Pressure
  • 4.8.2 Competition from Alternative Sensing Technologies
  • 4.8.3 Photodiode Reliability Issues During Automotive Reflow Cycles
  • 4.8.4 Limited Supply of Ultra-High-Purity Silicon Wafers

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Device
  • 5.1.1 Photocell
  • 5.1.2 Photodiode
    • 5.1.2.1 PIN Photodiode
    • 5.1.2.2 PN Photodiode
    • 5.1.2.3 Avalanche Photodiode
    • 5.1.2.4 Schottky Photodiode
  • 5.1.3 Phototransistor
  • 5.1.4 Photoresistor
  • 5.1.5 Photo IC
  • 5.1.6 CMOS Image Sensor
    • 5.1.6.1 BSI Sensor
    • 5.1.6.2 Stacked Sensor
  • 5.1.7 SPAD / QIS
• 5.2 By Material
  • 5.2.1 Silicon
  • 5.2.2 Germanium
  • 5.2.3 Indium Gallium Arsenide
  • 5.2.4 Gallium Arsenide
  • 5.2.5 Organic Semiconductor
  • 5.2.6 Perovskite and Other Emerging Materials
• 5.3 By Operating Mode
  • 5.3.1 Photovoltaic Mode
  • 5.3.2 Photoconductive Mode
  • 5.3.3 Avalanche Mode
• 5.4 By Application
  • 5.4.1 Optical Communication and Datacom
  • 5.4.2 Automotive and Transportation
    • 5.4.2.1 LiDAR
    • 5.4.2.2 ADAS Cameras
  • 5.4.3 Consumer Electronics
    • 5.4.3.1 Smartphones and Tablets
    • 5.4.3.2 Wearables and AR/VR
  • 5.4.4 Healthcare and Medical Imaging
  • 5.4.5 Industrial Automation and Robotics
  • 5.4.6 Security and Surveillance
  • 5.4.7 Scientific Research and Instrumentation
• 5.5 By End User
  • 5.5.1 Automotive OEMs
  • 5.5.2 Consumer Electronics OEMs
  • 5.5.3 Aerospace and Defence Contractors
  • 5.5.4 Healthcare Device Manufacturers
  • 5.5.5 Industrial and Manufacturing Firms
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Argentina
  • 5.6.3 Europe
    • 5.6.3.1 Germany
    • 5.6.3.2 France
    • 5.6.3.3 United Kingdom
    • 5.6.3.4 Italy
    • 5.6.3.5 Spain
    • 5.6.3.6 Russia
    • 5.6.3.7 Rest of Europe
  • 5.6.4 Asia Pacific
    • 5.6.4.1 China
    • 5.6.4.2 Japan
    • 5.6.4.3 India
    • 5.6.4.4 South Korea
    • 5.6.4.5 ASEAN
    • 5.6.4.6 Oceania
  • 5.6.5 Middle East
    • 5.6.5.1 GCC
    • 5.6.5.2 Turkey
    • 5.6.5.3 Rest of Middle East
  • 5.6.6 AFRICA
    • 5.6.6.1 South Africa
    • 5.6.6.2 North Africa
    • 5.6.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for Key Companies, Products and Services, and Recent Developments)
  • 6.4.1 Sony Semiconductor Solutions
  • 6.4.2 Samsung System LSI
  • 6.4.3 Hamamatsu Photonics K.K.
  • 6.4.4 ON Semiconductor Corporation
  • 6.4.5 STMicroelectronics N.V.
  • 6.4.6 Teledyne Technologies Inc.
  • 6.4.7 Canon Inc.
  • 6.4.8 Panasonic Corporation
  • 6.4.9 SK hynix Inc.
  • 6.4.10 OmniVision Technologies, Inc.
  • 6.4.11 Excelitas Technologies Corp.
  • 6.4.12 First Sensor AG
  • 6.4.13 Vishay Intertechnology Inc.
  • 6.4.14 ROHM Co., Ltd.
  • 6.4.15 Everlight Electronics Co. Ltd.
  • 6.4.16 Kyosemi Corporation
  • 6.4.17 OSI Optoelectronics, Inc.
  • 6.4.18 Laser Components GmbH
  • 6.4.19 Broadcom Inc.
  • 6.4.20 Thorlabs Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment