세계의 성형 회로 기판(MIS) : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

The global market for Molded Interconnect Substrate (MIS) was estimated to be worth US$ 98 million in 2024 and is forecast to a readjusted size of US$ 297 million by 2031 with a CAGR of 15.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Molded Interconnect Substrate (MIS) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.

Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates

The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.

In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.

Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.

As technology continues to update, 5G applications require high speed, low latency technology and stable signals. With the demand for electronicization and intelligence, new applications continue to emerge in the consumer electronics and Industrial markets. This drives the performance requirements of Semiconductor chips to continue, towards high-speed computing, high performance, low loss, etc.

The development direction has also increased the demand for IC packaging substrates to have fine, narrow spacing, high heat dissipation and other characteeristics. The MIS substrates manufacturers have be cultivating its product production Technology capabilities for a long time and has currently developed Narrow pitch, winding, multi-layer board production technologies will be used in 5G, a lot, electric vehicles, etc.

In addition, in terms of consumer electronic smartphone applications, global well-known brand mobile phone manufacturers have a large presence in the market. When launching new mobile phones, the specifications of camera modules are continuously improved, and high-specification camera modules are constantly being. The penetration into new mobile phones has also accelerated the development of major Chinese mobile phone manufacturers due to theimpact of the Sino-US trade war. By introducing local raw Material supply, The MIS substrates manufacturers have laid out multiple plans in the field of mobile phone camera module applications. As new mobile phones are launched in the market one after another, it is expected that the market penetration rate of MIS substrates manufacturers products will increase.

This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate (MIS), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Molded Interconnect Substrate (MIS) by region & country, by Type, and by Application.

The Molded Interconnect Substrate (MIS) market size, estimations, and forecasts are provided in terms of sales volume (Million Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate (MIS).

Market Segmentation

By Company

• PPt
• MiSpak Technology
• QDOS

Segment by Type

• 1 Layer MIS Substrate
• 2 Layer MIS Substrate
• 3 Layer MIS Substrate
• 4 Layer MIS Substrate
• 6 Layer MIS Substrate
• Others

Segment by Application

• Analog Chip
• Power IC
• RF/5G
• Fingerprint Sensor
• OIS (Optical Image Stablization)
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Molded Interconnect Substrate (MIS) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Molded Interconnect Substrate (MIS) in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Molded Interconnect Substrate (MIS) Product Introduction
• 1.2 Global Molded Interconnect Substrate (MIS) Market Size Forecast
  • 1.2.1 Global Molded Interconnect Substrate (MIS) Sales Value (2020-2031)
  • 1.2.2 Global Molded Interconnect Substrate (MIS) Sales Volume (2020-2031)
  • 1.2.3 Global Molded Interconnect Substrate (MIS) Sales Price (2020-2031)
• 1.3 Molded Interconnect Substrate (MIS) Market Trends & Drivers
  • 1.3.1 Molded Interconnect Substrate (MIS) Industry Trends
  • 1.3.2 Molded Interconnect Substrate (MIS) Market Drivers & Opportunity
  • 1.3.3 Molded Interconnect Substrate (MIS) Market Challenges
  • 1.3.4 Molded Interconnect Substrate (MIS) Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Molded Interconnect Substrate (MIS) Players Revenue Ranking (2024)
• 2.2 Global Molded Interconnect Substrate (MIS) Revenue by Company (2020-2025)
• 2.3 Global Molded Interconnect Substrate (MIS) Players Sales Volume Ranking (2024)
• 2.4 Global Molded Interconnect Substrate (MIS) Sales Volume by Company Players (2020-2025)
• 2.5 Global Molded Interconnect Substrate (MIS) Average Price by Company (2020-2025)
• 2.6 Key Manufacturers Molded Interconnect Substrate (MIS) Manufacturing Base and Headquarters
• 2.7 Key Manufacturers Molded Interconnect Substrate (MIS) Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of Molded Interconnect Substrate (MIS)
• 2.9 Molded Interconnect Substrate (MIS) Market Competitive Analysis
  • 2.9.1 Molded Interconnect Substrate (MIS) Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by Molded Interconnect Substrate (MIS) Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Molded Interconnect Substrate (MIS) as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 1 Layer MIS Substrate
  • 3.1.2 2 Layer MIS Substrate
  • 3.1.3 3 Layer MIS Substrate
  • 3.1.4 4 Layer MIS Substrate
  • 3.1.5 6 Layer MIS Substrate
  • 3.1.6 Others
• 3.2 Global Molded Interconnect Substrate (MIS) Sales Value by Type
  • 3.2.1 Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Molded Interconnect Substrate (MIS) Sales Value, by Type (2020-2031)
  • 3.2.3 Global Molded Interconnect Substrate (MIS) Sales Value, by Type (%) (2020-2031)
• 3.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Type
  • 3.3.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global Molded Interconnect Substrate (MIS) Sales Volume, by Type (2020-2031)
  • 3.3.3 Global Molded Interconnect Substrate (MIS) Sales Volume, by Type (%) (2020-2031)
• 3.4 Global Molded Interconnect Substrate (MIS) Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Analog Chip
  • 4.1.2 Power IC
  • 4.1.3 RF/5G
  • 4.1.4 Fingerprint Sensor
  • 4.1.5 OIS (Optical Image Stablization)
  • 4.1.6 Others
• 4.2 Global Molded Interconnect Substrate (MIS) Sales Value by Application
  • 4.2.1 Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Molded Interconnect Substrate (MIS) Sales Value, by Application (2020-2031)
  • 4.2.3 Global Molded Interconnect Substrate (MIS) Sales Value, by Application (%) (2020-2031)
• 4.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Application
  • 4.3.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global Molded Interconnect Substrate (MIS) Sales Volume, by Application (2020-2031)
  • 4.3.3 Global Molded Interconnect Substrate (MIS) Sales Volume, by Application (%) (2020-2031)
• 4.4 Global Molded Interconnect Substrate (MIS) Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global Molded Interconnect Substrate (MIS) Sales Value by Region
  • 5.1.1 Global Molded Interconnect Substrate (MIS) Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025)
  • 5.1.3 Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031)
  • 5.1.4 Global Molded Interconnect Substrate (MIS) Sales Value by Region (%), (2020-2031)
• 5.2 Global Molded Interconnect Substrate (MIS) Sales Volume by Region
  • 5.2.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025)
  • 5.2.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031)
  • 5.2.4 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (%), (2020-2031)
• 5.3 Global Molded Interconnect Substrate (MIS) Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 5.4.2 North America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 5.5.2 Europe Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 5.6.2 Asia Pacific Molded Interconnect Substrate (MIS) Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 5.7.2 South America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.3.2 United States Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.4.2 Europe Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.5.2 China Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.6.2 Japan Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.7.2 South Korea Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
  • 6.9.2 India Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 PPt
  • 7.1.1 PPt Company Information
  • 7.1.2 PPt Introduction and Business Overview
  • 7.1.3 PPt Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 PPt Molded Interconnect Substrate (MIS) Product Offerings
  • 7.1.5 PPt Recent Development
• 7.2 MiSpak Technology
  • 7.2.1 MiSpak Technology Company Information
  • 7.2.2 MiSpak Technology Introduction and Business Overview
  • 7.2.3 MiSpak Technology Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 MiSpak Technology Molded Interconnect Substrate (MIS) Product Offerings
  • 7.2.5 MiSpak Technology Recent Development
• 7.3 QDOS
  • 7.3.1 QDOS Company Information
  • 7.3.2 QDOS Introduction and Business Overview
  • 7.3.3 QDOS Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 QDOS Molded Interconnect Substrate (MIS) Product Offerings
  • 7.3.5 QDOS Recent Development

8 Industry Chain Analysis

• 8.1 Molded Interconnect Substrate (MIS) Industrial Chain
• 8.2 Molded Interconnect Substrate (MIS) Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Molded Interconnect Substrate (MIS) Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Molded Interconnect Substrate (MIS) Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer