시장보고서
상품코드
1530351

세계의 성형 회로 부품(MID) 시장 - 규모, 점유율, 동향 분석 보고서 : 프로세스별, 제품별, 최종 용도별, 지역별, 부문 예측(2024-2030년)

Molded Interconnect Device Market Size, Share & Trends Analysis Report By Process (Laser Direct Structuring, Two-shot Molding, Others), By Product, By End-use, By Region, And Segment Forecasts, 2024 - 2030

발행일: | 리서치사: Grand View Research | 페이지 정보: 영문 120 Pages | 배송안내 : 2-10일 (영업일 기준)

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

성형 회로 부품 시장 동향

성형 회로 부품 세계 시장 규모는 2023년에 19억 1,000만 달러로 추정되며, 2024-2030년에 걸쳐 CAGR 13.5%를 나타낼 것으로 예측됩니다. 전자기기의 소형화 경향이나 고성능·경량 부품에 대한 수요가 높아지는 등의 동향이 세계 시장의 성장을 뒷받침하고 있습니다. 성형 회로 부품(MID)은 기계적 기능과 전자적 기능을 단일 3차원(3D) 구조로 통합한 혁신적인 전자 부품입니다. 이것은 성형 플라스틱 부품의 표면에 회로 트레이스를 직접 형성함으로써 실현됩니다.

MID의 주요 이점은 공간 절약, 경량화, 부품 수 감소 등입니다. 기존 PCB와 달리 MID는 3D 구조의 표면에서 전기 연결성을 설명합니다. 결과적으로 MID는 공간 제약으로 인해 기존 배선이 실용적이지 않은 상황에서 특히 유용합니다. 또한, 여러 기능을 하나의 부품으로 결합함으로써 MID는 부품 수와 조립 공정을 줄일 수 있으며 제조 비용을 낮출 수 있습니다. 복잡한 3D 형태를 만들고 여러 기능을 하나의 부품으로 통합할 수 있으므로 설계 유연성이 향상됩니다.

전자기기의 소형화, 소형화의 동향에는 MID 기술이 제공할 수 있는 고급의 상호 접속 솔루션이 필요합니다. MID는 공간의 효율적인 이용과 전자 부품의 통합을 가능하게 합니다. 자동차, 소비자용 전자기기, 의료기기 등의 업계에서는 고성능이면서 경량의 부품이 요구되고 있습니다. 경량 재료로 만들어진 MID는 성능 기준을 유지하면서 이러한 요구를 충족합니다.

맞춤형 전자 부품에 대한 수요가 증가하고 있으며, MID는 특정 용도 요구 사항을 충족하는 맞춤형 설계를 작성하는 유연성을 설명합니다. MID는 프로토타이핑과 소량 생산에 이용하기 쉬워지고 있으며, 기업은 상당한 선행 투자 없이 혁신적인 설계를 시도할 수 있습니다.

정부 이니셔티브는 성형 회로 부품 시장에 큰 영향을 미칠 수 있습니다. 예를 들어 인도 정부는 2024년 2월 Digital India FutureLABS Summit 2024에서 'Digital India FutureLABS'를 시작하여 인도의 기술 소비국에서 차세대 전자 개발의 리더 국가로의 진전을 강조했습니다. 이 서밋에서는 NXP Semiconductors, Qualcomm Technologies, Inc.와 같은 기업과의 22건의 각서(MoU)가 발표되어 인공지능(AI), 사물인터넷(IoT), 양자컴퓨팅 등 주요 부문에서 혁신과 협력을 통해 인도의 전자 시스템 설계 및 제조(ESDM) 부문을 강화하는 것을 목표로 했습니다. 이러한 노력은 기술의 진보를 가속화하고 혁신적인 MID 솔루션 개발과 관련된 비용 장벽을 줄여줍니다.

성형 상호 연결 장치 세계 시장 보고서 분류

이 보고서는 세계, 지역 및 국가 수준에서 수익 성장을 예측하고 2017-2030년까지 각 하위 부문에 대한 최신 업계 동향 분석을 제공합니다. 이 연구에서 Grand View Research, Inc.는 프로세스, 제품, 최종 용도 및 지역을 기반으로 세계 성형 회로 부품 시장 보고서를 세분화합니다.

목차

제1장 조사 방법과 범위

제2장 주요 요약

제3장 성형 회로 부품 시장의 변수, 동향, 범위

  • 시장 소개/계통 전망
  • 업계 밸류체인 분석
  • 시장 역학
    • 시장 성장 촉진요인 분석
    • 시장 성장 억제요인 분석
    • 업계의 기회
    • 업계의 과제
  • 성형 회로 부품 시장 분석 툴
    • Porter's Five Forces 분석
    • PESTEL 분석

제4장 성형 회로 부품 시장 : 프로세스, 추정·동향 분석

  • 부문 대시보드
  • 성형 회로 부품 시장 : 프로세스 변동 분석, 2023년과 2030년
  • 레이저 직접 구조(LDS)
  • 2샷 성형
  • 기타

제5장 성형 회로 부품 시장 : 제품, 추정·동향 분석

  • 부문 대시보드
  • 성형 회로 부품 시장 : 제품 변동 분석, 2023년과 2030년
  • 센서 하우징
  • 안테나
  • 커넥터와 스위치
  • 조명
  • 기타

제6장 성형 회로 부품 시장 : 최종 용도, 추정·동향 분석

  • 부문 대시보드
  • 성형 회로 부품 시장 : 최종 용도 변동 분석, 2023년과 2030년
  • 의료
  • 자동차
  • 소비자용 전자 기기
  • 통신
  • 항공우주 및 방위
  • 기타

제7장 성형 회로 부품 시장 :지역별, 추정·동향 분석

  • 성형 회로 부품 시장 점유율, 지역별, 2023년과 2030년
  • 북미
    • 북미의 성형 회로 부품 시장 추정·예측, 2017-2030년
    • 미국
    • 캐나다
    • 멕시코
  • 유럽
    • 유럽의 성형 회로 부품 시장 추정·예측, 2017-2030년
    • 영국
    • 독일
    • 프랑스
  • 아시아태평양
    • 아시아태평양의 성형 회로 부품 시장 추정·예측, 2017-2030년
    • 중국
    • 일본
    • 인도
    • 한국
    • 호주
  • 라틴아메리카
    • 라틴아메리카의 성형 회로 부품 시장 추정·예측, 2017-2030년
    • 브라질
  • 중동 및 아프리카
    • 중동 및 아프리카의 성형 회로 부품 시장 추정·예측, 2017-2030년
    • 사우디아라비아(KSA)
    • 아랍에미리트(UAE)
    • 남아프리카

제8장 경쟁 구도

  • 주요 시장 진출기업에 의한 최근의 동향과 영향 분석
  • 기업 분류
  • 기업의 시장 포지셔닝
  • 기업의 시장 점유율 분석
  • 기업 히트맵 분석
  • 전략 매핑
    • 확대
    • 합병과 인수
    • 파트너십과 협업
    • 신제품 발매
    • 연구개발
  • 기업 프로파일
    • TE Connectivity
    • KYOCERA AVX Components Corporation
    • LPKF
    • Molex
    • Amphenol Corporation
    • Taoglas
    • HARTING Technology Group
    • Sumitomo Electric Industries, Ltd.
    • MID Solutions GmbH
    • TEPROSA
JHS 24.08.22

Molded Interconnect Device Market Trends

The global molded interconnect device market size was estimated at USD 1.91 billion in 2023 and is projected to grow at a CAGR of 13.5% from 2024 to 2030. Factors such as the trend towards miniaturization of electronic devices and the increasing demand for high-performance and lightweight components are driving the global market growth. A Molded Interconnect Device (MID) is an innovative electronic component that integrates mechanical and electronic functions into a single, three-dimensional (3D) structure. This is achieved by creating circuit traces directly onto the surface of a molded plastic part.

The key advantages of MIDs include space-saving, weight reduction, and a decrease in the number of components. Unlike conventional PCBs, MIDs provide electrical connectivity on the surfaces of 3D structures. Consequently, MIDs are particularly beneficial in situations where traditional wiring is impractical due to space constraints. Moreover, by combining multiple functions into a single part, MIDs can reduce the number of components and assembly steps, potentially lowering manufacturing costs. The ability to create complex 3D shapes and integrate multiple functions into a single component provides greater design flexibility.

The trend towards smaller, more compact electronic devices necessitates advanced interconnect solutions that MID technology can provide. MIDs allow for more efficient use of space and integration of electronic components. Industries such as automotive, consumer electronics, and medical devices require high-performance yet lightweight components. MIDs, made from lightweight materials, meet these needs while maintaining performance standards.

The demand for customized electronic components is growing, and MIDs offer the flexibility to create bespoke designs that meet specific application requirements. MIDs are becoming more accessible for prototyping and low-volume production, allowing companies to experiment with innovative designs without significant upfront investment.

Government initiatives can have a significant positive impact on the molded interconnect device market. For instance, in February 2024, the Indian government launched the "Digital India FutureLABS" at the Digital India FutureLABS Summit 2024, emphasizing India's progress from a technology consumer to a leader in developing next-generation electronics. The summit featured the announcement of 22 Memorandums of Understanding (MoUs) with companies like NXP Semiconductors and Qualcomm Technologies, Inc., aiming to strengthen India's Electronics System Design and Manufacturing (ESDM) sector through innovation and collaboration in key areas such as Artificial Intelligence (AI), the Internet of Things (IoT), and quantum computing. Such initiatives can accelerate technological advancements and reduce the cost barriers associated with developing innovative MID solutions.

Global Molded Interconnect Device Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2017 to 2030. For this study, Grand View Research has segmented the global molded interconnect device market report based on process, product, end-use, and region:

  • Process Outlook (Revenue, USD Million, 2017 - 2030)
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Others
  • Product Outlook (Revenue, USD Million, 2017 - 2030)
  • Sensor Housings
  • Antennas
  • Connectors & Switches
  • Lighting
  • Others
  • End Use Outlook (Revenue, USD Million, 2017 - 2030)
  • Healthcare
  • Automotive
  • Consumer Electronics
  • Telecommunication
  • Aerospace and Defense
  • Others
  • Regional Outlook (Revenue, USD Million, 2017 - 2030)
  • North America

U.S.

Canada

Mexico

  • Europe

UK

Germany

France

  • Asia Pacific

India

China

Japan

South Korea

Australia

  • Latin America

Brazil

  • Middle East and Africa (MEA)

Kingdom of Saudi Arabia (KSA)

UAE

South Africa

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation and Scope
  • 1.2. Market Definitions
  • 1.3. Research Methodology
    • 1.3.1. Information Procurement
    • 1.3.2. Information or Data Analysis
    • 1.3.3. Market Formulation & Data Visualization
    • 1.3.4. Data Validation & Publishing
  • 1.4. Research Scope and Assumptions
    • 1.4.1. List of Data Sources

Chapter 2. Executive Summary

  • 2.1. Market Outlook
  • 2.2. Segment Outlook
  • 2.3. Competitive Insights

Chapter 3. Molded Interconnect Device Market Variables, Trends, & Scope

  • 3.1. Market Introduction/Lineage Outlook
  • 3.2. Industry Value Chain Analysis
  • 3.3. Market Dynamics
    • 3.3.1. Market Drivers Analysis
    • 3.3.2. Market Restraints Analysis
    • 3.3.3. Industry Opportunities
    • 3.3.4. Industry Challenges
  • 3.4. Molded Interconnect Device Market Analysis Tools
    • 3.4.1. Porter's Analysis
      • 3.4.1.1. Bargaining power of the suppliers
      • 3.4.1.2. Bargaining power of the buyers
      • 3.4.1.3. Threats of substitution
      • 3.4.1.4. Threats from new entrants
      • 3.4.1.5. Competitive rivalry
    • 3.4.2. PESTEL Analysis
      • 3.4.2.1. Political landscape
      • 3.4.2.2. Economic and Social landscape
      • 3.4.2.3. Technological landscape
      • 3.4.2.4. Environmental landscape
      • 3.4.2.5. Legal landscape

Chapter 4. Molded Interconnect Device Market: Process Estimates & Trend Analysis

  • 4.1. Segment Dashboard
  • 4.2. Molded Interconnect Device Market: Process Movement Analysis, 2023 & 2030 (USD Million)
  • 4.3. Laser Direct Structuring (LDS)
    • 4.3.1. Laser Direct Structuring (LDS) Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 4.4. Two-Shot Molding
    • 4.4.1. Two-Shot Molding Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 4.5. Others
    • 4.5.1. Others Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)

Chapter 5. Molded Interconnect Device Market: Product Estimates & Trend Analysis

  • 5.1. Segment Dashboard
  • 5.2. Molded Interconnect Device Market: Product Movement Analysis, 2023 & 2030 (USD Million)
  • 5.3. Sensor Housings
    • 5.3.1. Sensor Housings Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 5.4. Antennas
    • 5.4.1. Antennas Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 5.5. Connectors & Switches
    • 5.5.1. Connectors & Switches Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 5.6. Lighting
    • 5.6.1. Lighting Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 5.7. Others
    • 5.7.1. Others Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)

Chapter 6. Molded Interconnect Device Market: End Use Estimates & Trend Analysis

  • 6.1. Segment Dashboard
  • 6.2. Molded Interconnect Device Market: End Use Movement Analysis, 2023 & 2030 (USD Million)
  • 6.3. Healthcare
    • 6.3.1. Healthcare Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 6.4. Automotive
    • 6.4.1. Automotive Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 6.5. Consumer Electronics
    • 6.5.1. Consumer Electronics Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 6.6. Telecommunication
    • 6.6.1. Telecommunication Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 6.7. Aerospace and Defense
    • 6.7.1. Aerospace and Defense Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
  • 6.8. Others
    • 6.8.1. Others Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)

Chapter 7. Molded Interconnect Device Market: Regional Estimates & Trend Analysis

  • 7.1. Molded Interconnect Device Market Share, By Region, 2023 & 2030 (USD Million)
  • 7.2. North America
    • 7.2.1. North America Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
    • 7.2.2. North America Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
    • 7.2.3. North America Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
    • 7.2.4. North America Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.2.5. U.S.
      • 7.2.5.1. U.S. Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.2.5.2. U.S. Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.2.5.3. U.S. Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.2.5.4. U.S. Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.2.6. Canada
      • 7.2.6.1. Canada Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.2.6.2. Canada Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.2.6.3. Canada Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.2.6.4. Canada Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.2.7. Mexico
      • 7.2.7.1. Mexico Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.2.7.2. Mexico Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.2.7.3. Mexico Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.2.7.4. Mexico Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
  • 7.3. Europe
    • 7.3.1. Europe Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
    • 7.3.2. Europe Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
    • 7.3.3. Europe Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
    • 7.3.4. Europe Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.3.5. UK
      • 7.3.5.1. UK Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.3.5.2. UK Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.3.5.3. UK Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.3.5.4. UK Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.3.6. Germany
      • 7.3.6.1. Germany Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.3.6.2. Germany Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.3.6.3. Germany Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.3.6.4. Germany Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.3.7. France
      • 7.3.7.1. France Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.3.7.2. France Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.3.7.3. France Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.3.7.4. France Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
  • 7.4. Asia Pacific
    • 7.4.1. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
    • 7.4.2. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
    • 7.4.3. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
    • 7.4.4. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.4.5. China
      • 7.4.5.1. China Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.4.5.2. China Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.4.5.3. China Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.4.5.4. China Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.4.6. Japan
      • 7.4.6.1. Japan Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.4.6.2. Japan Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.4.6.3. Japan Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.4.6.4. Japan Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.4.7. India
      • 7.4.7.1. India Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.4.7.2. India Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.4.7.3. India Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.4.7.4. India Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.4.8. South Korea
      • 7.4.8.1. South Korea Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.4.8.2. South Korea Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.4.8.3. South Korea Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.4.8.4. South Korea Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.4.9. Australia
      • 7.4.9.1. Australia Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.4.9.2. Australia Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.4.9.3. Australia Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.4.9.4. Australia Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
  • 7.5. Latin America
    • 7.5.1. Latin America Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
    • 7.5.2. Latin America Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
    • 7.5.3. Latin America Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
    • 7.5.4. Latin America Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.5.5. Brazil
      • 7.5.5.1. Brazil Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.5.5.2. Brazil Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.5.5.3. Brazil Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.5.5.4. Brazil Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
  • 7.6. Middle East and Africa
    • 7.6.1. Middle East & Africa Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
    • 7.6.2. Middle East & Africa (MEA) Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
    • 7.6.3. Middle East & Africa (MEA) Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
    • 7.6.4. Middle East & Africa (MEA) Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.6.5. Kingdom of Saudi Arabia (KSA)
      • 7.6.5.1. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.6.5.2. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.6.5.3. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.6.5.4. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.6.6. UAE
      • 7.6.6.1. UAE Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.6.6.2. UAE Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.6.6.3. UAE Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.6.6.4. UAE Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)
    • 7.6.7. South Africa
      • 7.6.7.1. South Africa Molded Interconnect Device Market Estimates and Forecasts, 2017 - 2030 (USD Million)
      • 7.6.7.2. South Africa Molded Interconnect Device Market Estimates and Forecasts, by Process, 2017 - 2030 (USD Million)
      • 7.6.7.3. South Africa Molded Interconnect Device Market Estimates and Forecasts, by Product, 2017 - 2030 (USD Million)
      • 7.6.7.4. South Africa Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2017 - 2030 (USD Million)

Chapter 8. Competitive Landscape

  • 8.1. Recent Developments & Impact Analysis by Key Market Participants
  • 8.2. Company Categorization
  • 8.3. Company Market Positioning
  • 8.4. Company Market Share Analysis
  • 8.5. Company Heat Map Analysis
  • 8.6. Strategy Mapping
    • 8.6.1. Expansion
    • 8.6.2. Mergers & Acquisition
    • 8.6.3. Partnerships & Collaborations
    • 8.6.4. New Product Launches
    • 8.6.5. Research And Development
  • 8.7. Company Profiles
    • 8.7.1. TE Connectivity
      • 8.7.1.1. Participant's Overview
      • 8.7.1.2. Financial Performance
      • 8.7.1.3. Product Benchmarking
      • 8.7.1.4. Recent Developments
    • 8.7.2. KYOCERA AVX Components Corporation
      • 8.7.2.1. Participant's Overview
      • 8.7.2.2. Financial Performance
      • 8.7.2.3. Product Benchmarking
      • 8.7.2.4. Recent Developments
    • 8.7.3. LPKF
      • 8.7.3.1. Participant's Overview
      • 8.7.3.2. Financial Performance
      • 8.7.3.3. Product Benchmarking
      • 8.7.3.4. Recent Developments
    • 8.7.4. Molex
      • 8.7.4.1. Participant's Overview
      • 8.7.4.2. Financial Performance
      • 8.7.4.3. Product Benchmarking
      • 8.7.4.4. Recent Developments
    • 8.7.5. Amphenol Corporation
      • 8.7.5.1. Participant's Overview
      • 8.7.5.2. Financial Performance
      • 8.7.5.3. Product Benchmarking
      • 8.7.5.4. Recent Developments
    • 8.7.6. Taoglas
      • 8.7.6.1. Participant's Overview
      • 8.7.6.2. Financial Performance
      • 8.7.6.3. Product Benchmarking
      • 8.7.6.4. Recent Developments
    • 8.7.7. HARTING Technology Group
      • 8.7.7.1. Participant's Overview
      • 8.7.7.2. Financial Performance
      • 8.7.7.3. Product Benchmarking
      • 8.7.7.4. Recent Developments
    • 8.7.8. Sumitomo Electric Industries, Ltd.
      • 8.7.8.1. Participant's Overview
      • 8.7.8.2. Financial Performance
      • 8.7.8.3. Product Benchmarking
      • 8.7.8.4. Recent Developments
    • 8.7.9. MID Solutions GmbH
      • 8.7.9.1. Participant's Overview
      • 8.7.9.2. Financial Performance
      • 8.7.9.3. Product Benchmarking
      • 8.7.9.4. Recent Developments
    • 8.7.10. TEPROSA
      • 8.7.10.1. Participant's Overview
      • 8.7.10.2. Financial Performance
      • 8.7.10.3. Product Benchmarking
      • 8.7.10.4. Recent Developments
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