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세계의 MID(Molded Interconnect Device) 시장

Molded Interconnect Device (MID)
발행일: | 리서치사: Global Industry Analysts, Inc. | 페이지 정보: 영문 223 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

MID(Molded Interconnect Device) 세계 시장은 2030년까지 57억 달러에 달할 전망

2024년에 26억 달러로 추정되는 MID(Molded Interconnect Device) 세계 시장은 분석 기간인 2024-2030년에 CAGR 13.9%로 성장하여 2030년에는 57억 달러에 달할 것으로 예측됩니다. 이 보고서에서 분석한 부문 중 하나인 안테나 및 접속 모듈은 CAGR 13.9%를 기록하며 분석 기간 종료시에는 19억 달러에 달할 것으로 예측됩니다. 커넥터 및 스위치 분야의 성장률은 분석 기간 동안 CAGR 12.8%로 추정됩니다.

미국 시장은 6억 6,810만 달러, 중국은 CAGR 17.9%로 성장 예측

미국의 MID(Molded Interconnect Device) 시장은 2024년에 6억 6,810만 달러로 추정됩니다. 세계 2위 경제 대국인 중국은 2030년까지 14억 달러의 시장 규모에 달할 것으로 예측되며, 분석 기간인 2024-2030년 CAGR은 17.9%를 기록할 것으로 예상됩니다. 기타 주목할 만한 지역별 시장으로는 일본과 캐나다가 있고, 분석 기간 동안 CAGR은 각각 9.5%와 11.4%로 예측됩니다. 유럽에서는 독일이 CAGR 10.6%로 성장할 것으로 예측됩니다.

세계 MID(Molded Interconnect Device) 시장 - 주요 동향 및 촉진요인 정리

MID(Molded Interconnect Device)란 무엇이며, 왜 혁명적인가?

MID(Molded Interconnect Device)는 열가소성 플라스틱 성형품에 기계적 기능과 전기적 기능을 통합한 다재다능한 부품입니다. 이 기술을 통해 플라스틱 기판에 직접 회로를 내장하여 플라스틱 하우징과 전자 배선을 하나의 작고 가벼운 부품으로 통합할 수 있으며, MID는 신뢰성과 성능을 향상시키면서 소형화를 촉진할 수 있어 스마트폰, 차량용 센서, 헬스케어 기기 등 다양한 하이테크 애플리케이션에 점점 더 많이 사용되고 있습니다. 헬스케어 기기 등 다양한 하이테크 애플리케이션에서 점점 더 많이 사용되고 있습니다. 여러 기능을 통합하면 제품의 크기와 무게를 줄일 수 있을 뿐만 아니라 조립 공정을 간소화하고 필요한 부품 수를 줄여 전체 제조 비용을 절감할 수 있습니다.

기술 발전이 MID 산업을 어떻게 형성하고 있는가?

기술 발전은 MID의 능력과 용도를 확장하는 데 중요한 역할을 하고 있으며, 특히 3D 성형 공정과 레이저 직접 구조화(LDS)의 혁신은 큰 변화를 가져오고 있습니다. 예를 들어, LDS 기술은 3차원 표면에 복잡한 회로 경로를 보다 정밀하게 형성할 수 있어 설계 유연성과 MID 기술의 혜택을 누릴 수 있는 제품 유형을 크게 확대할 수 있습니다. 또한, 고전도성 고분자 복합재료의 개발 및 도금 기술의 향상과 같은 재료 과학의 발전은 MID의 전기적 성능과 내구성을 향상시키고 있습니다. 이러한 기술 개선으로 다양한 산업 분야에서 보다 복잡하고 신뢰할 수 있는 디바이스를 제조할 수 있게 되었습니다.

MID(Molded Interconnect Device) 채택에 영향을 미치는 시장 동향은 무엇인가?

MID의 채택은 전자제품 시장에서 진행 중인 소형화 및 집적화 추세에 큰 영향을 받고 있습니다. 디바이스의 소형화 및 기능성에 대한 소비자의 기대치가 높아짐에 따라, 제조업체들은 이러한 요구를 충족시키기 위해 MID 기술로 눈을 돌리고 있습니다. 이러한 추세는 소비자 전자제품 분야에서 두드러지게 나타나는데, 소비자들은 더 얇고 기능이 풍부한 디바이스를 지속적으로 요구하고 있습니다. 자동차 업계에서는 특히 첨단 안전 시스템, 인포테인먼트 시스템 등 차량 1대당 탑재되는 전자부품이 증가함에 따라 좁은 공간에 복잡한 회로를 통합할 수 있는 MID에 대한 요구가 증가하고 있습니다. 또한, 의료 분야에서는 공간과 신뢰성이 중요한 의료용 웨어러블 및 임플란트의 컴팩트한 통합 솔루션에 MID가 활용되고 있습니다.

MID(Molded Interconnect Device) 시장의 성장 원동력은 무엇인가?

MID(Molded Interconnect Device) 시장의 성장은 기술 혁신, 산업 수요, 소비자 행동의 역동적인 상호 작용을 반영하는 몇 가지 요인에 의해 이루어지며, 3D 프린팅 및 레이저 구조화 기술의 발전으로 MID의 적용 범위가 넓어지고 소형 전자 장치의 설계 및 제조에 필수적인 요소로 자리 잡았습니다. 또한, 보다 지속가능한 제조 공정에 대한 요구는 전통적인 회로 기판 및 전자 어셈블리와 관련된 폐기물 및 환경 영향을 줄이는 MID를 촉진하고 있습니다. 또한, 고기능이면서도 작고 에너지 효율이 높은 전자제품에 대한 소비자 수요 증가는 MID 시장의 지속적인 성장을 촉진하고 있습니다. 특히 자동차, 가전, 헬스케어 등의 산업은 MID가 제공하는 통합 능력과 설계 유연성에 대한 의존도가 높아지면서 제품 제공의 혁신과 강화에 더욱 의존하고 있습니다. 이러한 요인들이 종합적으로 현대 기술 환경에서 MID(Molded Interconnect Device) 시장의 급속한 성장과 확장을 뒷받침하고 있습니다.

부문

유형(안테나 및 커넥티비티 모듈, 커넥터 및 스위치, 센서, 조명, 기타 유형), 최종사용(가전, 통신, 의료, 자동차, 산업, 기타 최종사용)

조사 대상 기업 사례(총 46개사)

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

AI 통합

Global Industry Analysts는 검증된 전문가 컨텐츠와 AI 툴을 통해 시장 정보와 경쟁 정보를 혁신하고 있습니다.

Global Industry Analysts는 LLM 및 업계 고유의 SLM을 조회하는 일반적인 규범에 따르는 대신 비디오 기록, 블로그, 검색 엔진 조사, 방대한 양의 기업, 제품/서비스, 시장 데이터 등 세계 전문가로부터 수집한 컨텐츠 리포지토리를 구축했습니다.

관세 영향 계수

Global Industry Analysts는 본사의 국가, 제조거점, 수출입(완제품 및 OEM)을 기반으로 기업의 경쟁력 변화를 예측하고 있습니다. 이러한 복잡하고 다면적인 시장 역학은 매출원가(COGS) 증가, 수익성 감소, 공급망 재편 등 미시적 및 거시적 시장 역학 중에서도 특히 경쟁사들에게 영향을 미칠 것으로 예상됩니다.

목차

제1장 조사 방법

제2장 주요 요약

  • 시장 개요
  • 주요 기업
  • 시장 동향과 촉진요인
  • 세계 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 스페인
  • 러시아
  • 기타 유럽
  • 아시아태평양
  • 호주
  • 인도
  • 한국
  • 기타 아시아태평양
  • 라틴아메리카
  • 아르헨티나
  • 브라질
  • 멕시코
  • 기타 라틴아메리카
  • 중동
  • 이란
  • 이스라엘
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동
  • 아프리카

제4장 경쟁

ksm

Global Molded Interconnect Device (MID) Market to Reach US$5.7 Billion by 2030

The global market for Molded Interconnect Device (MID) estimated at US$2.6 Billion in the year 2024, is expected to reach US$5.7 Billion by 2030, growing at a CAGR of 13.9% over the analysis period 2024-2030. Antennae & Connectivity Modules, one of the segments analyzed in the report, is expected to record a 13.9% CAGR and reach US$1.9 Billion by the end of the analysis period. Growth in the Connectors & Switches segment is estimated at 12.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$668.1 Million While China is Forecast to Grow at 17.9% CAGR

The Molded Interconnect Device (MID) market in the U.S. is estimated at US$668.1 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$1.4 Billion by the year 2030 trailing a CAGR of 17.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.5% and 11.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 10.6% CAGR.

Global Molded Interconnect Device (MID) Market - Key Trends & Drivers Summarized

What Is a Molded Interconnect Device (MID) and Why Is It Revolutionary?

A Molded Interconnect Device (MID) is a highly versatile component that integrates both mechanical and electrical functions within a single molded thermoplastic unit. This technology allows for the incorporation of circuitry directly onto plastic substrates, combining the plastic housing and electronic interconnects into one compact and lightweight part. MIDs are increasingly used in various high-tech applications such as smartphones, automotive sensors, and healthcare devices due to their ability to facilitate miniaturization while enhancing reliability and performance. The integration of multiple functions not only reduces the size and weight of the product but also simplifies assembly processes, reduces the number of components required, and ultimately, cuts overall manufacturing costs.

How Are Technological Advancements Shaping the MID Industry?

Technological advancements play a crucial role in expanding the capabilities and applications of MIDs. Innovations in 3D molding processes and laser direct structuring (LDS) have particularly been transformative. LDS technology, for example, allows for greater precision in creating intricate circuit paths on three-dimensional surfaces, vastly increasing the design flexibility and the types of products that can benefit from MID technology. Additionally, advancements in materials science, including the development of highly conductive polymer composites and improved plating techniques, enhance the electrical performance and durability of MIDs. These technological improvements enable the production of more complex and reliable devices across a broader range of industries.

What Market Trends Are Influencing the Adoption of Molded Interconnect Devices?

The adoption of MIDs is heavily influenced by the ongoing trends in miniaturization and integration within the electronics market. As devices become smaller and consumer expectations for device functionality increase, manufacturers are turning to MID technology to meet these demands. This trend is evident in the consumer electronics sector, where there is a continuous push for thinner, more feature-packed devices. In the automotive industry, the increasing electronic content per vehicle, particularly for advanced safety and infotainment systems, drives the need for MIDs that can incorporate complex circuitry into tight spaces. Additionally, the medical sector utilizes MIDs for compact, integrated solutions in medical wearables and implants, where space and reliability are critical.

What Drives the Growth in the Molded Interconnect Devices Market?

The growth in the molded interconnect devices market is driven by several factors, reflecting the dynamic interplay of technological innovation, industry demands, and consumer behavior. Advances in 3D printing and laser structuring technologies have broadened the scope of MID applications, making them indispensable in the design and manufacture of compact electronic devices. The push for more sustainable manufacturing processes also favors MIDs, as they reduce the waste and environmental impact associated with traditional circuit boards and electronic assemblies. Furthermore, the increasing consumer demand for sophisticated, yet smaller and energy-efficient electronic products stimulates continuous growth in the MID market. Industries such as automotive, consumer electronics, and healthcare are particularly pivotal, as they increasingly rely on the integration capabilities and design flexibility offered by MIDs to innovate and enhance product offerings. These factors collectively underscore the burgeoning reliance on and expansion of the molded interconnect devices market in the modern technological landscape.

SCOPE OF STUDY:

The report analyzes the Molded Interconnect Device (MID) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting, Other Types); End-Use (Consumer Electronics, Telecommunications, Medical, Automotive, Industrial, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 46 Featured) -

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Global Economic Update
    • Molded Interconnect Device (MID) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Advancements in 3D Molding Technologies Propel the Growth of Molded Interconnect Devices (MIDs)
    • Increasing Demand for Miniaturization in Consumer Electronics Spurs Adoption of MIDs
    • Expansion of Automotive Applications Drives Innovations in MID Technology
    • Integration of MIDs in Medical Devices Enhances Functionality and Compactness
    • Rise of IoT and Connected Devices Boosts Market Opportunities for MIDs
    • Technological Convergence in Multi-Functional Devices Amplifies Use of Molded Interconnect Devices
    • Growing Environmental Regulations Promote Development of Eco-Friendly MID Materials
    • Adoption of MID Technology in Smart Wearables Generates Market Growth
    • Advancements in Laser Direct Structuring (LDS) Techniques Expand MID Capabilities
    • Increasing Role of MIDs in Aerospace and Defense for Lightweight Solutions
    • Consumer Demand for Sleek, Integrated Interfaces Strengthens Market for MIDs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Molded Interconnect Device (MID) Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Antennae & Connectivity Modules by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Antennae & Connectivity Modules by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Connectors & Switches by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Connectors & Switches by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Lighting by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for Lighting by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Medical by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Medical by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 28: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 29: USA 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 30: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Canada 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 34: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 35: Japan 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 36: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Japan 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 40: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 41: China 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 43: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 46: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 48: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 49: France 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 50: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: France 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 52: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Germany 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 54: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Germany 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 56: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Italy 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 58: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Italy 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 60: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 61: UK 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 62: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: UK 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SPAIN
    • TABLE 64: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Spain 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 66: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Spain 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • RUSSIA
    • TABLE 68: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Russia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 70: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Russia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 72: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 74: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 76: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 77: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 78: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 80: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AUSTRALIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 82: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 83: Australia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 84: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 85: Australia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • INDIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 86: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: India 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 88: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 89: India 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 90: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 91: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 92: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 94: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 96: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • LATIN AMERICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 98: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 99: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 100: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 102: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 104: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 106: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 107: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • BRAZIL
    • TABLE 108: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 109: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 110: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MEXICO
    • TABLE 112: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 113: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 114: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 115: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 116: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 117: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 118: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 119: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MIDDLE EAST
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 120: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 121: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 122: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 124: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 125: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • IRAN
    • TABLE 126: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 127: Iran 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 128: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Iran 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ISRAEL
    • TABLE 130: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 131: Israel 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 132: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 133: Israel 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 134: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 136: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 137: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 138: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 139: UAE 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 140: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 141: UAE 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 142: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 143: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 144: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 145: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AFRICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 146: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Africa 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 148: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 149: Africa 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION

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