세계의 성형 회로 부품 시장 예측(-2032년) : 제품, 재료, 기술, 구성요소, 용도, 최종사용자, 지역별 분석

According to Stratistics MRC, the Global Molded Interconnect Device Market is accounted for $2.06 billion in 2025 and is expected to reach $4.57 billion by 2032 growing at a CAGR of 12.0% during the forecast period. A Molded Interconnect Device (MID) is a sophisticated electronic solution that combines structural and electronic functions within a three-dimensional plastic base. It allows conductive pathways to be formed directly on molded plastic components, reducing reliance on conventional circuit boards. MIDs find applications across automotive, medical, consumer electronics, and telecom sectors, offering benefits like miniaturization, weight savings, and greater durability. They support intricate, compact designs while enhancing overall device performance.

Market Dynamics:

Driver:

Rising demand for iot devices and 5g technology

The proliferation of smart devices and next-generation connectivity is accelerating the need for compact, multifunctional components like molded interconnect devices. MIDs enable the integration of electronic circuits directly onto 3D plastic structures, making them ideal for space-constrained IoT applications. As 5G networks expand globally, telecom and consumer electronics sectors are increasingly deploying MIDs in antennas, sensors, and switches. The trend toward miniaturization and lightweight electronics is further boosting market momentum. Technological advancements such as laser direct structuring (LDS) and multi-shot molding are enhancing design precision and electrical performance. These innovations are positioning MIDs as essential building blocks in wearables, smart home systems, and edge computing devices.

Restraint:

High initial manufacturing and tooling costs

Setting up LDS systems and precision molding equipment requires significant capital investment, particularly challenging for small and mid-sized manufacturers. The integration of mechanical and electronic functions into a single substrate demands advanced engineering and rigorous quality control. Customization across diverse applications further increases prototyping and validation expenses. Although automation and modular tooling are emerging to reduce these costs, scalability remains a concern. These financial constraints can slow market expansion, especially in cost-sensitive regions.

Opportunity:

Increased adoption in healthcare and medical devices

Devices such as hearing aids, diagnostic sensors, and wearable monitors benefit from MID-enabled miniaturization and durability. The integration of wireless communication and IoT in patient monitoring systems is expanding MID applications. Advances in biocompatible materials and precision molding are enabling safer and more ergonomic medical designs. Regulatory support for digital health and remote diagnostics is further propelling market demand. As personalized medicine and smart therapeutics evolve, MIDs are playing a pivotal role in next-generation healthcare solutions.

Threat:

Alternative interconnect technologies

The alternatives offer cost benefits and compatibility with conventional manufacturing workflows. Innovations in additive electronics and printed conductive inks are also challenging MID dominance in select applications. Some manufacturers prefer modular designs that allow easier upgrades and maintenance, reducing reliance on integrated structures. Rapid advancements in nanomaterials and conductive polymers are diversifying the interconnect landscape. Without continuous innovation, MIDs risk being displaced by more adaptable or cost-effective technologies.

Covid-19 Impact:

The COVID-19 pandemic disrupted global supply chains, delaying MID production and affecting component availability across industries. Lockdowns and workforce shortages impacted manufacturing timelines, particularly for precision tooling and semiconductor integration. However, the crisis accelerated digital transformation, increasing demand for IoT-enabled healthcare and remote diagnostics. MID applications in medical wearables and contactless devices saw a notable rise. Post-pandemic strategies now emphasize flexible production, digital inventory systems, and localized sourcing to mitigate future disruptions.

The liquid crystal polymer (LCP) segment is expected to be the largest during the forecast period

The liquid crystal polymer (LCP) segment is expected to account for the largest market share during the forecast period, due to its exceptional thermal stability, low moisture absorption, and superior dielectric properties. LCPs are well-suited for high-frequency applications such as antennas, RF modules, and 5G components. Their compatibility with LDS technology allows precise circuit structuring on complex geometries. As demand grows for miniaturized and high-speed electronics, LCPs offer unmatched performance in demanding environments. Recent developments include LCP-based sensor housings and ultra-thin connectors for automotive and telecom sectors.

The medical devices segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the medical devices segment is predicted to witness the highest growth rate, driven by the need for compact, multifunctional, and biocompatible components. MIDs facilitate the integration of sensors, antennas, and circuitry into ergonomic medical tools and wearables. The rise of remote patient monitoring and smart diagnostics is expanding MID applications in healthcare. Emerging trends include disposable diagnostic kits and implantable devices with wireless telemetry. Regulatory bodies are supporting innovation through fast-track approvals and digital health initiatives.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, supported by robust electronics manufacturing and expanding telecom infrastructure. Countries like China, Japan, and South Korea are investing heavily in 5G deployment and consumer electronics production. Government initiatives promoting local semiconductor and component fabrication are boosting MID demand. The region's leadership in automotive electronics and industrial automation further strengthens its market position. Strategic collaborations between global OEMs and regional suppliers are accelerating technology transfer and innovation.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by technological leadership and strong R&D investments. The U.S. is pioneering MID applications in aerospace, defense, and advanced medical devices. Adoption of smart manufacturing and AI-driven design tools is enhancing MID customization and performance. Regulatory support for digital health and connected infrastructure is expanding market opportunities. Key developments include MID-enabled wearables, automotive sensors, and industrial IoT modules.

Key players in the market

Some of the key players in Molded Interconnect Device Market include TE Connectivity, Element Solutions, Molex LLC, Cicor Group, Amphenol Corporation, Sumitomo Electric Industries, Ltd., LPKF Laser & Electronics AG, RTP Company, Taoglas Limited, Multiple Dimensions AG, KYOCERA AVX Components Corporation, Teprosa GmbH, HARTING Technology Group, 2E mechatronic GmbH & Co. KG, and MID Solutions GmbH.

Key Developments:

In October 2025, Molex announced that it has signed an agreement to acquire Smiths Interconnect. Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, is a leading provider of high-reliability connectivity products and solutions serving the aerospace and defense, medical, semiconductor test and industrial markets.

In March 2024, Element Solutions Inc announced an agreement to sell its flexographic printing plate business, MacDermid Graphics Solutions, to XSYS, a global specialist provider in the flexographic printing industry, for an enterprise value of approximately $325 million. The MacDermid Graphics Solutions business transferring to XSYS constitutes substantially all of Element Solutions' Graphics Solutions reporting vertical.

Products Covered:

• Two-Dimensional (2D) MID
• Three-Dimensional (3D) MID
• Other Products

Materials Covered:

• Thermoplastics
• Other Thermoplasticsd

Technologies Covered:

• Laser Direct Structuring (LDS)
• Film Insert Molding (FIM)
• Two-Shot Molding
• Other Technologies

Components Covered:

• Antennas
• Connectors
• Sensors
• Switches
• Lighting Components

Applications Covered:

• Automotive
• Consumer Electronics
• Medical Devices
• Telecommunications
• Industrial
• Other Applications

End Users Covered:

• Original Equipment Manufacturers (OEMs)
• Electronics Manufacturing Services

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Technology Analysis
• 3.8 Application Analysis
• 3.9 End User Analysis
• 3.10 Emerging Markets
• 3.11 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Molded Interconnect Device Market, By Product

• 5.1 Introduction
• 5.2 Two-Dimensional (2D) MID
• 5.3 Three-Dimensional (3D) MID
• 5.4 Other Products

6 Global Molded Interconnect Device Market, By Material

• 6.1 Introduction
• 6.2 Thermoplastics
  • 6.2.1 Polycarbonate (PC)
  • 6.2.2 Liquid Crystal Polymer (LCP)
  • 6.2.3 Polybutylene Terephthalate (PBT)
  • 6.2.4 Polyphthalamide (PPA)
• 6.3 Other Thermoplastics

7 Global Molded Interconnect Device Market, By Technology

• 7.1 Introduction
• 7.2 Laser Direct Structuring (LDS)
• 7.3 Film Insert Molding (FIM)
• 7.4 Two-Shot Molding
• 7.5 Other Technologies

8 Global Molded Interconnect Device Market, By Component

• 8.1 Introduction
• 8.2 Antennas
• 8.3 Connectors
• 8.4 Sensors
• 8.5 Switches
• 8.6 Lighting Components

9 Global Molded Interconnect Device Market, By Application

• 9.1 Introduction
• 9.2 Automotive
  • 9.2.1 Steering Wheel Controls
  • 9.2.2 Sensors & Switches
  • 9.2.3 Lighting Systems
• 9.3 Consumer Electronics
  • 9.3.1 Smartphones & Wearables
  • 9.3.2 Home Appliances
• 9.4 Medical Devices
  • 9.4.1 Diagnostic Equipment
  • 9.4.2 Surgical Instruments
• 9.5 Telecommunications
  • 9.5.1 Antenna Modules
  • 9.5.2 Routers & Modems
• 9.6 Industrial
  • 9.6.1 Automation Equipment
  • 9.6.2 Control Systems
• 9.7 Other Applications

10 Global Molded Interconnect Device Market, By End User

• 10.1 Introduction
• 10.2 Original Equipment Manufacturers (OEMs)
• 10.3 Electronics Manufacturing Services

11 Global Molded Interconnect Device Market, By Geography

• 11.1 Introduction
• 11.2 North America
  • 11.2.1 US
  • 11.2.2 Canada
  • 11.2.3 Mexico
• 11.3 Europe
  • 11.3.1 Germany
  • 11.3.2 UK
  • 11.3.3 Italy
  • 11.3.4 France
  • 11.3.5 Spain
  • 11.3.6 Rest of Europe
• 11.4 Asia Pacific
  • 11.4.1 Japan
  • 11.4.2 China
  • 11.4.3 India
  • 11.4.4 Australia
  • 11.4.5 New Zealand
  • 11.4.6 South Korea
  • 11.4.7 Rest of Asia Pacific
• 11.5 South America
  • 11.5.1 Argentina
  • 11.5.2 Brazil
  • 11.5.3 Chile
  • 11.5.4 Rest of South America
• 11.6 Middle East & Africa
  • 11.6.1 Saudi Arabia
  • 11.6.2 UAE
  • 11.6.3 Qatar
  • 11.6.4 South Africa
  • 11.6.5 Rest of Middle East & Africa

12 Key Developments

• 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 12.2 Acquisitions & Mergers
• 12.3 New Product Launch
• 12.4 Expansions
• 12.5 Other Key Strategies

13 Company Profiling

• 13.1 TE Connectivity
• 13.2 Element Solutions
• 13.3 Molex LLC
• 13.4 Cicor Group
• 13.5 Amphenol Corporation
• 13.6 Sumitomo Electric Industries, Ltd.
• 13.7 LPKF Laser & Electronics AG
• 13.8 RTP Company
• 13.9 Taoglas Limited
• 13.10 Multiple Dimensions AG
• 13.11 KYOCERA AVX Components Corporation
• 13.12 Teprosa GmbH
• 13.13 HARTING Technology Group
• 13.14 2E mechatronic GmbH & Co. KG
• 13.15 MID Solutions GmbH