세계의 반도체 본딩 시장 예측(-2030년) : 유형별, 재료별, 프로세스별, 기술별, 용도별, 최종 사용자별, 지역별 분석

According to Stratistics MRC, the Global Semiconductor Bonding Market is accounted for $1044.5 million in 2024 and is expected to reach $1448.4 million by 2030 growing at a CAGR of 5.6% during the forecast period. Semiconductor bonding is a crucial process in the assembly of electronic devices, where different semiconductor materials are interconnected to form functional circuits and components. This process encompasses various techniques, including wire bonding, flip-chip bonding, and adhesive bonding, each tailored to ensure robust electrical and mechanical connections. Effective bonding is essential for the performance, reliability, and longevity of semiconductor devices, influencing thermal management, signal integrity, and overall device efficiency.

Market Dynamics:

Driver:

Increasing demand from various industries

The market is experiencing growing demand across various industries, including consumer electronics, automotive, and telecommunications. As the need for advanced electronic devices rises, driven by trends like 5G, IoT, and electric vehicles, the demand for efficient and reliable semiconductor connections intensifies. This surge propels innovations in bonding technologies, enabling manufacturers to meet performance requirements and enhance the functionality of increasingly compact and powerful electronic systems.

Restraint:

Shortage of skilled labor

The shortage of skilled labor in the market poses significant challenges, hindering production efficiency and innovation. With a lack of trained technicians and engineers, companies may struggle to maintain quality standards, leading to increased defect rates in semiconductor devices. This workforce gap can slow down the development of advanced technologies and delay project timelines, ultimately impacting competitiveness and the ability to meet the rising demand for sophisticated electronic products in various industries.

Opportunity:

Shift towards electric vehicles (EVs)

The shift towards electric vehicles (EVs) is driving substantial growth in the market, as these vehicles require advanced electronic systems for battery management, power distribution, and infotainment. This transition increases the demand for reliable semiconductor connections that ensure safety, efficiency, and performance. Consequently, manufacturers are investing in innovative bonding technologies to meet the specific needs of EV applications, fostering advancements that enhance the functionality and reliability of electric vehicle components.

Threat:

High production costs

High production costs in the market can significantly impact profitability and competitiveness for manufacturers. These elevated expenses may stem from advanced materials, intricate bonding techniques. As a result, companies may struggle to maintain affordable pricing for their products, limiting market accessibility and reducing overall demand. This financial strain can also hinder investment in research and development, stalling innovation and advancements in bonding technologies critical for future growth.

Covid-19 Impact:

The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in production. Lockdowns and labor shortages led to reduced manufacturing capacity, while increased demand for electronics in remote work and healthcare applications strained resources. Additionally, semiconductor shortages emerged, affecting various industries reliant on bonded components. These challenges highlighted the need for greater resilience and flexibility in semiconductor manufacturing processes and supply chain management.

The flip chip bonding segment is projected to be the largest during the forecast period

The flip chip bonding segment is projected to account for the largest market share during the projection period. This method enhances electrical performance and thermal management, enabling compact designs in high-performance applications such as smartphones, computers, and automotive electronics. As demand for miniaturization and efficiency grows, flip chip bonding continues to gain prominence, driving innovations that support the evolving needs of modern electronic devices.

The automotives segment is expected to have the highest CAGR during the forecast period

The automotives segment is expected to have the highest CAGR during the extrapolated period. As automakers integrate technologies like driver assistance, infotainment, and electric powertrains, reliable semiconductor bonding becomes essential for performance and safety. This trend is accelerating the adoption of innovative bonding techniques, enabling manufacturers to produce smaller, more efficient components that meet the rigorous standards required for modern automotive applications and electric vehicles.

Region with largest share:

North America region is projected to account for the largest market share during the forecast period fueled by advancements in technology. Key drivers include the rising adoption of 5G, automotive electronics, and IoT applications. Major companies are investing in innovative bonding techniques to enhance performance and efficiency. Additionally, the region benefits from a strong research and development ecosystem, fostering collaboration and innovation within the semiconductor industry to address evolving market needs.

Region with highest CAGR:

Asia Pacific is expected to register the highest growth rate over the forecast period. The increasing adoption of technologies such as IoT, AI, and 5G is significantly boosting demand for advanced semiconductor bonding techniques. These technologies require high-performance chips that depend on efficient bonding processes. The rise in electric vehicle production is a major driver, as these vehicles require sophisticated semiconductor components for power management and efficiency.

Key players in the market

Some of the key players in Semiconductor Bonding market include EV Group, ASMPT Semiconductor Solutions, MRSI Systems., WestBond Inc., Panasonic Holding Corporation, Palomar Technologies, Dr. Tresky AG, BE Semiconductor Industries NV, Fasford Technology Co.Ltd , Kulicke and Soffa Industries Inc., DIAS Automation, Shibaura Mechatronics Corporation, SUSS MicroTec SE, Tokyo Electron Limited, Intel Corporation, Kulicke and Soffa Industries, Inc. and TDK Corporation.

Key Developments:

In March 2024, TANAKA Kikinzoku Kogyo K.K., a leading company in the precious metals industry, recently pioneered the semiconductor bonding field by developing a gold particle bonding technology. This innovative method utilizes AuRoFUSE, a specialized low-temperature fired paste, to facilitate gold-to-gold bonding in high-density semiconductor mounting applications.

In December 2023, Tokyo Electron Kyushu developed an Extreme Laser Lift Off (XLO) technology. This cutting-edge approach is set to revolutionize the field of 3D integration for advanced semiconductor devices that utilize permanent wafer bonding.

Types Covered:

• Wire Bonding
• Flip Chip Bonding
• Bump Bonding
• Interposer Bonding
• Other Types

Materials Covered:

• Gold
• Aluminum
• Solder
• Conductive Adhesives
• Other Materials

Processes Covered:

• Die-to-Die Bonding
• Die-to-Wafer Bonding
• Wafer-to-Wafer Bonding
• Other Processes

Technologies Covered:

• Thermo-Compression Bonding
• Adhesive Bonding
• Solder Bonding
• Hybrid Bonding
• Other Technologies

Applications Covered:

• Memory Devices
• RF Devices
• CMOS Image Sensors
• LED
• MEMS Devices
• Discrete Components
• Integrated Circuits (ICs)
• Other Applications

End Users Covered:

• Semiconductor Manufacturers
• Medical Device Manufacturers
• Automotives
• Aerospace & Defense
• Telecommunications Equipments
• Research Institutions
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Technology Analysis
• 3.7 Application Analysis
• 3.8 End User Analysis
• 3.9 Emerging Markets
• 3.10 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Semiconductor Bonding Market, By Type

• 5.1 Introduction
• 5.2 Wire Bonding
• 5.3 Flip Chip Bonding
• 5.4 Bump Bonding
• 5.5 Interposer Bonding
• 5.6 Other Types

6 Global Semiconductor Bonding Market, By Material

• 6.1 Introduction
• 6.2 Gold
• 6.3 Aluminum
• 6.4 Solder
• 6.5 Conductive Adhesives
• 6.6 Other Materials

7 Global Semiconductor Bonding Market, By Process

• 7.1 Introduction
• 7.2 Die-to-Die Bonding
• 7.3 Die-to-Wafer Bonding
• 7.4 Wafer-to-Wafer Bonding
• 7.5 Other Processes

8 Global Semiconductor Bonding Market, By Technology

• 8.1 Introduction
• 8.2 Thermo-Compression Bonding
• 8.3 Adhesive Bonding
• 8.4 Solder Bonding
• 8.5 Hybrid Bonding
• 8.6 Other Technologies

9 Global Semiconductor Bonding Market, By Application

• 9.1 Introduction
• 9.2 Memory Devices
• 9.3 RF Devices
• 9.4 CMOS Image Sensors
• 9.5 LED
• 9.6 MEMS Devices
• 9.7 Discrete Components
• 9.8 Integrated Circuits (ICs)
• 9.9 Other Applications

10 Global Semiconductor Bonding Market, By End User

• 10.1 Introduction
• 10.2 Semiconductor Manufacturers
• 10.3 Medical Device Manufacturers
• 10.4 Automotives
• 10.5 Aerospace & Defense
• 10.6 Telecommunications Equipments
• 10.7 Research Institutions
• 10.8 Other End Users

11 Global Semiconductor Bonding Market, By Geography

• 11.1 Introduction
• 11.2 North America
  • 11.2.1 US
  • 11.2.2 Canada
  • 11.2.3 Mexico
• 11.3 Europe
  • 11.3.1 Germany
  • 11.3.2 UK
  • 11.3.3 Italy
  • 11.3.4 France
  • 11.3.5 Spain
  • 11.3.6 Rest of Europe
• 11.4 Asia Pacific
  • 11.4.1 Japan
  • 11.4.2 China
  • 11.4.3 India
  • 11.4.4 Australia
  • 11.4.5 New Zealand
  • 11.4.6 South Korea
  • 11.4.7 Rest of Asia Pacific
• 11.5 South America
  • 11.5.1 Argentina
  • 11.5.2 Brazil
  • 11.5.3 Chile
  • 11.5.4 Rest of South America
• 11.6 Middle East & Africa
  • 11.6.1 Saudi Arabia
  • 11.6.2 UAE
  • 11.6.3 Qatar
  • 11.6.4 South Africa
  • 11.6.5 Rest of Middle East & Africa

12 Key Developments

• 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 12.2 Acquisitions & Mergers
• 12.3 New Product Launch
• 12.4 Expansions
• 12.5 Other Key Strategies

13 Company Profiling

• 13.1 EV Group
• 13.2 ASMPT Semiconductor Solutions
• 13.3 MRSI Systems.
• 13.4 WestBond Inc.
• 13.5 Panasonic Holding Corporation
• 13.6 Palomar Technologies
• 13.7 Dr. Tresky AG
• 13.8 BE Semiconductor Industries NV
• 13.9 Fasford Technology Co.Ltd
• 13.10 Kulicke and Soffa Industries Inc.
• 13.11 DIAS Automation
• 13.12 Shibaura Mechatronics Corporation
• 13.13 SUSS MicroTec SE
• 13.14 Tokyo Electron Limited
• 13.15 Intel Corporation
• 13.16 Kulicke and Soffa Industries, Inc.
• 13.17 TDK Corporation