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시장보고서
상품코드
1870024
LCP 기반 MID(성형회로부품) 시장 규모, 점유율 및 동향 분석 보고서 : 제조 공정별, 제품별, 최종 용도별, 지역별, 부문별 예측(2025-2030년)LCP Based Molded Interconnect Devices Market Size, Share & Trends Analysis Report By Process (LDS, Two-Shot Molding), By Product, By End Use, By Region, And Segment Forecasts, 2025 - 2030 |
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※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.
LCP 기반 MID(성형회로부품) 시장 요약
세계의 LCP 기반 MID(성형회로부품) 시장 규모는 2024년 7억 3,750만 달러로 평가되었고, 2030년까지 18억 9,720만 달러에 이를 것으로 예측됩니다.
2025년부터 2030년까지 연평균 복합 성장률(CAGR) 17.5%를 나타낼 전망입니다. LCP 기반 MID(성형회로부품) 시장은 빠르게 성장하고 있습니다. 이 기술을 통해 제조업체는 전기 회로를 3D 성형 플라스틱 부품에 직접 임베딩하여 상당한 공간과 무게를 줄일 수 있기 때문입니다.
LCP 수지는 뛰어난 내열성, 내약품성, 치수 안정성을 갖추고 있어 까다로운 용도에 있어서 MID 제조의 우선재료가 되고 있습니다. 기존의 방법을 넘어 혁신적인 가공 기술의 혜택을 받아 시장 수요가 점점 커지고 있습니다. 2액 사출 성형과 핫 스탬핑은 복잡한 형상에 고도의 회로 집적을 실현하는 다기능 부품의 제조에 활용되는 대체 방법입니다. LCP의 저선 팽창률이나 뛰어난 내열성 등 고유 특성에 의해 치수 안정성을 손상시키지 않고 레이저 활성화에 의한 메탈리제이션이 성공적으로 실시 가능합니다.
자동차, 통신, 소비자용 전자기기, 의료기기 등 다양한 산업분야에서 소형화·경량화된 전자부품에 대한 수요 증가가 MID 기술의 채용을 촉진하고 있습니다. 레이저 직접 구조(LDS)와 같은 첨단 제조 기술은 복잡한 3D 표면에 정밀한 회로 패터닝을 가능하게 하여 설계 유연성과 조립 공정 간소화를 실현합니다. 이러한 제조 방법은 부품 수와 배선 수를 줄여 다양한 최종 용도에서 제품의 신뢰성과 성능을 향상시킵니다.
또한 LCP MID 제조에서 주로 적용되는 LDS 공정은 수지의 첨가제를 활성화하여 무전해 구리 도금을 촉진하고 날카로운 윤곽을 가진 미세한 전도성 추적을 실현합니다. 이 정밀도로 자유 곡면에 대한 3차원 회로 레이아웃이 가능해져 부품 설계나 조립의 제약을 경감합니다. 수직 관통 구멍의 형성 능력과 적응된 표면 마감는 성형 부품에 내장된 고밀도 회로를 필요로 하는 다양한 용도를 지원합니다. 이러한 기술은 조립 시간을 단축하고 상호 연결 수를 줄이는 데 기여하며 시스템 성능을 향상시키면서 작고 복잡한 부품의 제조 가능성을 실현합니다.
자주 묻는 질문
목차
제1장 조사 방법과 범위
제2장 주요 요약
제3장 LCP 기반 MID(성형회로부품) 시장 변수, 동향 및 범위
- 시장 도입/계통 전망
- 시장 역학
- 시장 성장 촉진요인 분석
- 시장 성장 억제요인 분석
- 업계의 과제
- LCP 기반 MID(성형회로부품) 시장 분석 툴
- Porter's Five Forces 분석
- PESTEL 분석
제4장 LCP 기반 MID(성형회로부품) 시장 : 공정의 추정·동향 분석
- 부문 대시보드
- LCP 기반 MID(성형회로부품) 시장 : 공정 변동 분석(2018-2030년)
- 레이저 직접 구조화(LDS)
- 투샷 성형
- 기타
제5장 LCP 기반 MID(성형회로부품) 시장 : 제품의 추정·동향 분석
- 부문 대시보드
- LCP 기반 MID(성형회로부품) 시장 : 제품 변동 분석(2018-2030년)
- 센서 하우징
- 안테나
- 커넥터 및 상호 연결 장치
- 기타
제6장 LCP 기반 MID(성형회로부품) 시장 : 최종 용도의 추정·동향 분석
- 부문 대시보드
- LCP 기반 MID(성형회로부품) 시장 : 최종 용도 변동 분석(2018-2030년)
- 은행, 금융서비스 및 보험(BFSI)
- 의료
- 자동차
- 가전
- 통신
- 항공우주 및 방위
- 기타
제7장 LCP 기반 MID(성형회로부품) : 지역 추정·동향 분석
- LCP 기반 MID(성형회로부품)의 점유율(지역별, 2018년 및 2030년)
- 북미
- 북미의 LCP 기반 MID(성형회로부품) 추정과 예측(2018-2030년)
- 미국
- 캐나다
- 멕시코
- 유럽
- 유럽의 LCP 기반 MID(성형회로부품) 추정과 예측(2018-2030년)
- 영국
- 독일
- 프랑스
- 아시아태평양
- 아시아태평양의 LCP 기반 MID(성형회로부품) 추정과 예측(2018-2030년)
- 중국
- 일본
- 인도
- 한국
- 호주
- 라틴아메리카
- 라틴아메리카의 LCP 기반 MID(성형회로부품) 추정과 예측(2018-2030년)
- 브라질
- 중동 및 아프리카
- 중동 및 아프리카의 LCP 기반 MID(성형회로부품) 추정과 예측(2018-2030년)
- 아랍에미리트(UAE)
- 사우디아라비아
- 남아프리카
제8장 경쟁 구도
- 기업 분류
- 기업의 시장 포지셔닝
- 참가 기업의 개요
- 재무실적
- 제품 벤치마킹
- 기업 히트맵 분석
- 전략 매핑
- 기업 프로파일
- Amphenol Corporation
- HARTING Technology Group
- KYOCERA AVX Components Corporation
- LPKF Laser &Electronics SE
- MID Solutions GmbH
- Molex LLC
- Sumitomo Electric Industries, Ltd.
- Taoglas
- TE Connectivity
- TEPROSA
LCP Based Molded Interconnect Devices Market Summary
The global LCP based molded interconnect devices market size was estimated at USD 737.5 million in 2024 and is projected to reach USD 1,897.2 million by 2030, growing at a CAGR of 17.5% from 2025 to 2030. The LCP based molded interconnect devices market is growing rapidly, as this technology enables manufacturers to achieve significant space and weight reductions by implanting electrical circuitry directly onto 3D molded plastic parts.
LCP resin offers exceptional thermal stability, chemical resistance, and dimensional stability, making it a preferred material for MID manufacturing in demanding applications. The market is increasingly in demand as it benefits from innovative processing techniques beyond traditional methods. Two-component injection molding and hot stamping are alternative methods utilized for producing MIDs, facilitating multifunctional parts with enhanced circuit integration on complex geometries. LCP's inherent properties, such as low linear expansion and superior heat resistance, allow successful metallization through laser activation without compromising dimensional stability.
The rising necessity for miniaturized, lightweight electronic components across industries such as automotive, telecommunications, consumer electronics, and medical devices has driven the adoption of MID technology. Advanced manufacturing techniques such as laser direct structuring (LDS) allow precise circuit patterning on complex 3D surfaces, enabling design flexibility and reduced assembly complexity. These construction methods reduce the number of components and interconnections, thus improving product reliability and performance in various end-use applications.
Furthermore, LDS process, most applied in LCP MID production, activates additive compounds within the resin for electro less copper deposition, achieving fine conductive traces with sharp contours. This precision enables three-dimensional circuit layouts on free-form surfaces, reducing constraints on component design and assembly. The ability to create vertical through-holes and adapted surface finishes supports diverse applications requiring high-density circuitry embedded within molded parts. These methods contribute to lower assembly times and fewer interconnections, enhancing system performance while enabling manufacturability of small and complex components.
Global LCP Based Molded Interconnect Devices Market Report Segmentation
This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2018 to 2030. For this study, Grand View Research has segmented the global LCP based molded interconnect devices market report based on process, product, end use, and region:
- Process Outlook (Revenue, USD Million, 2018 - 2030)
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Others
- Product Outlook (Revenue, USD Million, 2018 - 2030)
- Sensor Housings
- Antennas
- Connectors & Interconnects
- Others
- End Use Outlook (Revenue, USD Million, 2018 - 2030)
- Healthcare
- Automotive
- Consumer Electronics
- Telecommunication
- Aerospace and Defense
- Others
- Regional Outlook (Revenue, USD Million, 2018 - 2030)
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Asia Pacific
- China
- Japan
- India
- South Korea
- Australia
- Latin America
- Brazil
- Middle East and Africa (MEA)
- KSA
- UAE
- South Africa
Table of Contents
Chapter 1. Methodology and Scope
- 1.1. Market Segmentation and Scope
- 1.2. Market Definition
- 1.3. Research Methodology
- 1.3.1. Information Procurement
- 1.3.2. Information or Data Analysis
- 1.3.3. Market Formulation & Data Visualization
- 1.3.4. Data Validation & Publishing
- 1.4. Research Scope and Assumptions
- 1.4.1. List of Data Sources
Chapter 2. Executive Summary
- 2.1. Market Outlook
- 2.2. Segment Outlook
- 2.3. Competitive Insights
Chapter 3. LCP Based Molded Interconnect Devices Market Variables, Trends, & Scope
- 3.1. Market Introduction/Lineage Outlook
- 3.2. Market Dynamics
- 3.2.1. Market Driver Analysis
- 3.2.2. Market Restraint Analysis
- 3.2.3. Industry Challenge
- 3.3. LCP Based Molded Interconnect Devices Market Analysis Tools
- 3.3.1. Porter's Analysis
- 3.3.2. PESTEL Analysis
Chapter 4. LCP Based Molded Interconnect Devices Market: Process Estimates & Trend Analysis
- 4.1. Segment Dashboard
- 4.2. LCP Based Molded Interconnect Devices market: Process Movement Analysis, 2018 & 2030 (USD Million)
- 4.3. Laser Direct Structuring (LDS)
- 4.3.1. Laser Direct Structuring (LDS) LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 4.4. Two-Shot Molding
- 4.4.1. Two-Shot Molding LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 4.5. Others
- 4.5.1. Others LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 5. LCP Based Molded Interconnect Devices Market: Product Estimates & Trend Analysis
- 5.1. Segment Dashboard
- 5.2. LCP Based Molded Interconnect Devices market: Product Movement Analysis, 2018 & 2030 (USD Million)
- 5.3. Sensor Housings
- 5.3.1. Sensor Housings LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 5.4. Antennas
- 5.4.1. Antennas LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 5.5. Connectors & Interconnects
- 5.5.1. Connectors & Interconnects LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 5.6. Others
- 5.6.1. Others LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 6. LCP Based Molded Interconnect Devices Market: End Use Estimates & Trend Analysis
- 6.1. Segment Dashboard
- 6.2. LCP Based Molded Interconnect Devices market: End Use Movement Analysis, 2018 & 2030 (USD Million)
- 6.3. Banking, financial services, and insurance (BFSI)
- 6.3.1. Banking, financial services, and insurance (BFSI) LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.4. Healthcare
- 6.4.1. Healthcare LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.5. Automotive
- 6.5.1. Automotive LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.6. Consumer Electronics
- 6.6.1. Consumer Electronics LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.7. Telecommunication
- 6.7.1. Telecommunication LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.8. Aerospace and Defense
- 6.8.1. Aerospace and Defense LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
- 6.9. Others
- 6.9.1. Others LCP Based Molded Interconnect Devices Market Revenue Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 7. LCP Based Molded Interconnect Devices: Regional Estimates & Trend Analysis
- 7.1. LCP Based Molded Interconnect Devices Share, By Region, 2018 & 2030 (USD Million)
- 7.2. North America
- 7.2.1. North America LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.2.1.1. North America LCP Based Molded Interconnect Devices Estimates and Forecasts, by Country, 2018 - 2030 (USD Million)
- 7.2.1.2. North America LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.2.1.3. North America LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.2.1.4. North America LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.2.2. U.S.
- 7.2.2.1. U.S. LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.2.2.2. U.S. LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.2.2.3. U.S. LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.2.2.4. U.S. LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.2.3. Canada
- 7.2.3.1. Canada LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.2.3.2. Canada LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.2.3.3. Canada LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.2.4. Mexico
- 7.2.4.1. Mexico LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.2.4.2. Mexico LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.2.4.3. Mexico LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.2.1. North America LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.3. Europe
- 7.3.1. Europe LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.3.1.1. Europe LCP Based Molded Interconnect Devices Estimates and Forecasts, by Country, 2018 - 2030 (USD Million)
- 7.3.1.2. Europe LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.3.1.3. Europe LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.3.1.4. Europe LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.3.2. UK
- 7.3.2.1. UK LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.3.2.2. UK LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.3.2.3. UK LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.3.3. Germany
- 7.3.3.1. Germany LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.3.3.2. Germany LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.3.3.3. Germany LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.3.4. France
- 7.3.4.1. France LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.3.4.2. France LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.3.4.3. France LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.3.1. Europe LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.4. Asia Pacific
- 7.4.1. Asia Pacific LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.4.1.1. Asia Pacific LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.4.1.2. Asia Pacific LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.4.1.3. Asia Pacific LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.4.2. China
- 7.4.2.1. China LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.4.2.2. China LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.4.2.3. China LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.4.2.4. China LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.4.3. Japan
- 7.4.3.1. Japan LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.4.3.2. Japan LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.4.3.3. Japan LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.4.4. India
- 7.4.4.1. India LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.4.4.2. India LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.4.4.3. India LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.4.5. South Korea
- 7.4.5.1. South Korea LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.4.5.2. South Korea LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.4.5.3. South Korea LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.4.6. Australia
- 7.4.6.1. Australia LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.4.6.2. Australia LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.4.6.3. Australia LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.4.1. Asia Pacific LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.5. Latin America
- 7.5.1. Latin America LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.5.1.1. Latin America LCP Based Molded Interconnect Devices Estimates and Forecasts, by Country, 2018 - 2030 (USD Million)
- 7.5.1.2. Latin America LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.5.1.3. Latin America LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.5.1.4. Latin America LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.5.2. Brazil
- 7.5.2.1. Brazil LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.5.2.2. Brazil LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.5.2.3. Brazil LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.5.2.4. Brazil LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.5.1. Latin America LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.6. Middle East and Africa
- 7.6.1. Middle East and Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
- 7.6.1.1. Middle East and Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.6.1.2. Middle East and Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.6.1.3. Middle East and Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.6.2. UAE
- 7.6.2.1. UAE LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.6.2.2. UAE LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.6.2.3. UAE LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.6.3. KSA
- 7.6.3.1. KSA LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.6.3.2. KSA LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.6.3.3. KSA LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.6.4. South Africa
- 7.6.4.1. South Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, by Process, 2018 - 2030 (USD Million)
- 7.6.4.2. South Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, by Product, 2018 - 2030 (USD Million)
- 7.6.4.3. South Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, by End Use, 2018 - 2030 (USD Million)
- 7.6.1. Middle East and Africa LCP Based Molded Interconnect Devices Estimates and Forecasts, 2018 - 2030 (USD Million)
Chapter 8. Competitive Landscape
- 8.1. Company Categorization
- 8.2. Company Market Positioning
- 8.3. Participant's Overview
- 8.4. Financial Performance
- 8.5. Product Benchmarking
- 8.6. Company Heat Map Analysis
- 8.7. Strategy Mapping
- 8.8. Company Profiles/Listing
- 8.8.1. Amphenol Corporation
- 8.8.1.1. Participant's Overview
- 8.8.1.2. Financial Performance
- 8.8.1.3. Product Benchmarking
- 8.8.1.4. Recent Developments
- 8.8.2. HARTING Technology Group
- 8.8.2.1. Participant's Overview
- 8.8.2.2. Financial Performance
- 8.8.2.3. Product Benchmarking
- 8.8.2.4. Recent Developments
- 8.8.3. KYOCERA AVX Components Corporation
- 8.8.3.1. Participant's Overview
- 8.8.3.2. Financial Performance
- 8.8.3.3. Product Benchmarking
- 8.8.3.4. Recent Developments
- 8.8.4. LPKF Laser & Electronics SE
- 8.8.4.1. Participant's Overview
- 8.8.4.2. Financial Performance
- 8.8.4.3. Product Benchmarking
- 8.8.4.4. Recent Developments
- 8.8.5. MID Solutions GmbH
- 8.8.5.1. Participant's Overview
- 8.8.5.2. Financial Performance
- 8.8.5.3. Product Benchmarking
- 8.8.5.4. Recent Developments
- 8.8.6. Molex LLC
- 8.8.6.1. Participant's Overview
- 8.8.6.2. Financial Performance
- 8.8.6.3. Product Benchmarking
- 8.8.6.4. Recent Developments
- 8.8.7. Sumitomo Electric Industries, Ltd.
- 8.8.7.1. Participant's Overview
- 8.8.7.2. Financial Performance
- 8.8.7.3. Product Benchmarking
- 8.8.7.4. Recent Developments
- 8.8.8. Taoglas
- 8.8.8.1. Participant's Overview
- 8.8.8.2. Financial Performance
- 8.8.8.3. Product Benchmarking
- 8.8.8.4. Recent Developments
- 8.8.9. TE Connectivity
- 8.8.9.1. Participant's Overview
- 8.8.9.2. Financial Performance
- 8.8.9.3. Product Benchmarking
- 8.8.9.4. Recent Developments
- 8.8.10. TEPROSA
- 8.8.10.1. Participant's Overview
- 8.8.10.2. Financial Performance
- 8.8.10.3. Product Benchmarking
- 8.8.10.4. Recent Developments
- 8.8.1. Amphenol Corporation
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