세계의 MID(Molded Interconnect Device) 시장 - 예측(2025-2030년)

The Molded Interconnect Devices Market is anticipated to increase from USD 1.541 billion in 2025 to USD 2.974 billion by 2030, registering a 14.06% CAGR.

Molded interconnect devices (MIDs) are gaining traction due to their role in enabling miniaturization and advanced functionality across industries. The consumer electronics sector, particularly in developing economies, drives demand through widespread smartphone adoption and the trend toward compact devices. In the automotive industry, manufacturers' focus on enhancing user experience and convenience has increased in-vehicle electronic content, creating revenue opportunities for MID manufacturers. Additionally, MIDs' ability to support the development of sophisticated medical devices bolsters their demand in the healthcare sector, presenting significant market potential. Rising research and development investments by key vendors to advance MID technology further propel market growth over the forecast period. However, a shortage of skilled labor poses a notable constraint on market expansion.

Key market drivers include the flexibility of MID design, which allows for innovative and compact solutions, and the ongoing emphasis on device miniaturization across applications. The primary restraint is the limited availability of skilled professionals capable of working with MID technology, which may hinder scalability and adoption.

This research examines current trends in demand, supply, and sales, alongside recent developments shaping the MID market. It provides a comprehensive analysis of key drivers, restraints, and opportunities. The study details industry trends, policies, and regulations across geographical regions, offering stakeholders a thorough understanding of the regulatory framework and critical factors influencing the market environment.

Competitive intelligence identifies major industry players and their revenue contributions, derived from extensive secondary research. Sources include industry association studies, analyst reports, investor presentations, press releases, and journals. Market size for the overall MID sector and its key segments was determined using both bottom-up and top-down methodologies. Values were validated with primary inputs from stakeholders in the global MID value chain. Comprehensive market engineering integrated data from diverse sources and proprietary datasets, employing data triangulation for accurate market breakdown and forecasting.

Market insights are presented through analytical narratives, charts, and graphics, enabling efficient comprehension of global MID market dynamics. Key players profiled include TE Connectivity, LPKF Laser and Electronics, Lanxess, and Multiple Dimensions AG, among others.

This report equips industry experts with critical insights into market trends, regulatory landscapes, and competitive dynamics. It highlights growth opportunities driven by miniaturization trends, automotive advancements, and medical device innovations, while addressing challenges related to skilled labor shortages. The rigorous methodology, blending primary and secondary data, ensures reliable findings, enabling stakeholders to navigate regulatory complexities, competitive pressures, and investment priorities in a market poised for growth through technological innovation and expanding applications.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation

By Process

• Laser Direct Structuring
• 2-shot molding
• Film Techniques

By Product Type

• Antennae and Connectivity Modules
• Sensors
• Connectors and Switches
• Lighting
• Others

By Application

• Telecommunication
• Consumer Electronics
• Automotive
• Medical Devices
• Others

By Geography

• North America
• United States
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• United Kingdom
• Germany
• France
• Italy
• Others
• Middle East & Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• Japan
• China
• India
• South Korea
• Taiwan
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study
• 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. MOLDED INTERCONNECT DEVICES MARKET BY PROCESS

• 5.1. Introduction
• 5.2. Laser Direct Structuring
• 5.3. 2-shot molding
• 5.4. Film Techniques

6. MOLDED INTERCONNECT DEVICES MARKET BY PRODUCT TYPE

• 6.1. Introduction
• 6.2. Antennae and Connectivity Modules
• 6.3. Sensors
• 6.4. Connectors and Switches
• 6.5. Lighting
• 6.6. Others

7. MOLDED INTERCONNECT DEVICES MARKET BY APPLICATION

• 7.1. Introduction
• 7.2. Telecommunication
• 7.3. Consumer Electronics
• 7.4. Automotive
• 7.5. Medical Devices
• 7.6. Others
• 7.7. Manufacturers
• 7.8. Others

8. MOLDED INTERCONNECT DEVICES MARKET BY GEOGRAPHY

• 8.1. Introduction
• 8.2. North America
  • 8.2.1. By Process
  • 8.2.2. By Product Type
  • 8.2.3. By Application
  • 8.2.4. By Country
    • 8.2.4.1. United States
    • 8.2.4.2. Canada
    • 8.2.4.3. Mexico
• 8.3. South America
  • 8.3.1. By Process
  • 8.3.2. By Product Type
  • 8.3.3. By Application
  • 8.3.4. By Country
    • 8.3.4.1. Brazil
    • 8.3.4.2. Argentina
    • 8.3.4.3. Others
• 8.4. Europe
  • 8.4.1. By Process
  • 8.4.2. By Product Type
  • 8.4.3. By Application
  • 8.4.4. By Country
    • 8.4.4.1. United Kingdom
    • 8.4.4.2. Germany
    • 8.4.4.3. France
    • 8.4.4.4. Italy
    • 8.4.4.5. Others
• 8.5. Middle East & Africa
  • 8.5.1. By Process
  • 8.5.2. By Product Type
  • 8.5.3. By Application
  • 8.5.4. By Country
    • 8.5.4.1. Saudi Arabia
    • 8.5.4.2. UAE
    • 8.5.4.3. Others
• 8.6. Asia Pacific
  • 8.6.1. By Process
  • 8.6.2. By Product Type
  • 8.6.3. By Application
  • 8.6.4. By Country
    • 8.6.4.1. Japan
    • 8.6.4.2. China
    • 8.6.4.3. India
    • 8.6.4.4. South Korea
    • 8.6.4.5. Taiwan
    • 8.6.4.6. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 9.1. Major Players and Strategy Analysis
• 9.2. Market Share Analysis
• 9.3. Mergers, Acquisitions, Agreements, and Collaborations
• 9.4. Competitive Dashboard

10. COMPANY PROFILES

• 10.1. TE Connectivity Ltd.
• 10.2. LPFK Laser and Electronics AG
• 10.3. Molex, LLC
• 10.4. MID Solutions GmbH
• 10.5. Lanxess AG
• 10.6. MacDermid, Inc.
• 10.7. RTP Company
• 10.8. Smart Plastic Products (S2P)
• 10.9. Harting Technology Group
• 10.10. Cicor Management AG
• 10.11. Amphenol Corporation

11. RESEARCH METHODOLOGY