DRAM 실리콘 웨이퍼 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the DRAM silicon wafer market size is projected to be USD 2.15 billion in 2025, USD 2.41 billion in 2026, and reach USD 3.34 billion by 2031, growing at a CAGR of 6.74% from 2026 to 2031.

This report is Segmented by Wafer Diameter (300mm [12-Inch], 200mm [8-Inch], and Less Than 150mm [6-Inch and Below]), Wafer Type (Polished Wafers, and Epitaxial [Epi] Wafers), DRAM Type (Standard DRAM, Mobile DRAM [LPDDR], Graphics DRAM [GDDR], Server DRAM, and Specialty and Automotive DRAM), and Geography (North America, Asia-Pacific, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global DRAM Silicon Wafer Market Trends and Insights

Rising Demand for HBM And Advanced DRAM Nodes

The DRAM silicon wafer market is being driven by stronger demand for HBM and advanced DRAM nodes, as these products require tighter process control, more consistent starting material, and dependable access to premium 300mm polished wafers across longer production runs. SEMI reported that global silicon wafer shipments rose 5.8% in 2025 to 12,973 MSI, with polished wafer demand linked to HBM and advanced epitaxial wafer demand linked to logic as the main volume drivers behind the recovery. That product split matters for substrate suppliers because advanced memory programs now absorb a larger share of qualified capacity, leaving less room for flexible allocation across standard DRAM lines. Korea JoongAng Daily reported in May 2026 that Samsung accelerated construction of its P6 chip plant in Pyeongtaek because demand showed no sign of easing, which reinforces the continued pull from advanced memory programs across the regional supply chain. In the DRAM silicon wafer market, this keeps customer attention fixed on the timely delivery of high-quality substrates rather than on nominal fab counts alone, because the qualified wafer pool remains the real constraint.

AI and Data Center Memory Expansion

The DRAM silicon wafer market is also benefiting from AI data center build-outs, which are lifting demand across both HBM products and large-capacity server memory, broadening the number of wafer-intensive memory programs moving through the supply chain. SEMI estimated that front-end equipment spending will reach USD 133 billion in 2026, while memory equipment spending alone will rise 13% in the same year, indicating how strongly capital is being directed toward advanced semiconductor capacity. This spending pattern matters because it shows that AI infrastructure is not pulling on only one memory product family, but instead reinforcing a larger investment cycle that spans wafer demand, tool demand, and qualification activity. The Semiconductor Industry Association stated that US chip companies purchase USD 13.5 billion in silicon wafers annually, and that this figure is expected to reach USD 18.3 billion by 2029, highlighting the growing economic weight of substrate availability for future semiconductor output. In the DRAM silicon wafer market, broader AI server deployment supports stronger order visibility across both standard polished wafers and more advanced substrate grades, as memory procurement is broadening rather than narrowing to a single device type.

Capital Intensity of 300mm Wafer Expansion

The DRAM silicon wafer market still faces a hard supply ceiling because 300mm expansion is expensive, takes years to ramp, and burdens suppliers with heavy depreciation before new lines contribute fully to earnings or cash generation. Siltronic said its new 300mm fab in Singapore added EUR 343 million (USD 388 million) to 2025 depreciation, pushing full-year EBIT to EUR -26 million (USD -29 million) even though revenue stayed flat, showing how long the payback cycle can be for new wafer capacity. SUMCO also reported a JPY 5.3 billion (USD 34 million) operating loss in Q1 2026, equivalent to, and tied that pressure mainly to higher depreciation from earlier capital spending rather than to a collapse in end demand. Suppliers therefore absorb years of costs before new output becomes commercially efficient, which slows the pace at which new investment can ease tightness in customer shipments, pricing, and contract allocation. For the DRAM silicon wafer market, capital intensity is a direct restraint because it limits fast supply response even when order visibility is strong, and buyers are willing to commit to longer agreements.

Other drivers and restraints analyzed in the detailed report include:

1. 300mm Migration for Memory-Intensive Substrates
2. Government Incentives for Domestic Wafer Supply Chains
3. Feedstock and High-Purity Polysilicon Dependency

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

The 300mm segment held 86.43% of the DRAM silicon wafer market share in 2025, making it the clear center of demand, investment planning, and customer qualification activity across the supply chain. It leads because advanced DRAM cells require tight lithography, strong yield control, and a mature process infrastructure, which are only economical at the 300mm scale for commercial production at leading nodes. SUMCO said 300mm wafer demand grew 9% in 2025 and pointed to continued momentum in advanced DRAM applications through 2026, which supports the view that the largest-diameter class is still gaining practical importance in current customer programs. SEMI reported that worldwide silicon wafer shipments increased 13.1% year over year in Q1 2026 to 3,275 MSI, with advanced memory and logic leading the recovery, and that aligns closely with the demand profile that favors 300mm substrate consumption.

Smaller diameters remain tied to specialty and legacy uses, so they do not compete at scale for advanced DRAM programs and do not materially alter where the main commercial value of the DRAM silicon wafer market is being created. Siltronic said customer inventories remained elevated outside AI-linked applications in early 2026, indicating weaker conditions for non-advanced wafer demand and underlining the widening gap between advanced and legacy-diameter economics. The company also closed its SD line for wafers up to 150mm in 2025, reinforcing that legacy diameter capacity is being retired rather than renewed as suppliers reshape their portfolios around more relevant substrate classes. In the DRAM silicon wafer market, wafer diameter now works as a clear proxy for node generation because 300mm aligns with advanced DRAM while smaller formats sit at the edge of the category and attract far less strategic investment.

Complete Report Scope:

• By Wafer Diameter
  • 300mm (12-inch)
  • 200mm (8-inch)
  • Less than 150mm (6-inch and below)
• By Wafer Type
  • Polished Wafers
  • Epitaxial (Epi) Wafers
• By DRAM Type
  • Standard DRAM
  • Mobile DRAM (LPDDR)
  • Graphics DRAM (GDDR)
  • Server DRAM
  • Specialty and Automotive DRAM
• By Geography
  • North America
  • Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • Rest of the World

Geography Analysis

Asia-Pacific held 78.64% of the DRAM silicon wafer market share in 2025, so the region remained the clear operating center of the category and the main corridor linking substrate supply with advanced memory fabrication. South Korea sits at the core of that position because Samsung Electronics and SK Hynix anchor the global base for advanced DRAM and HBM production, giving the country an outsized role in pulling qualified wafer supply through multi-year customer programs. Korea JoongAng Daily reported that Samsung's Pyeongtaek P5 and fast-tracked P6 complex are expected to reach a combined 600,000 wafers per month, pointing to another large increase in memory-linked substrate demand from the same geography. Japan strengthens the same corridor because Shin-Etsu Handotai and SUMCO together supply more than half of the global 300mm wafer volume, linking Japanese wafer output closely with South Korean memory production and keeping the region highly interdependent.

North America is projected to grow at 8.18% CAGR through 2031, making it the fastest-growing regional slice of the DRAM silicon wafer market and the clearest example of supply localization moving from policy into physical capacity. This shift is being driven by CHIPS Act support for local wafer supply, which had been largely absent at advanced commercial 300mm scale in the United States before the current investment cycle began. NIST said GlobalWafers America and MEMC LLC received up to USD 406 million in direct funding to support USD 4 billion in Texas and Missouri wafer investments, which gives the region a stronger foundation for domestic substrate sourcing. The Sherman, Texas project is positioned as the first advanced high-volume 300mm silicon wafer plant in the United States, which matters because it brings memory and logic customers closer to local starting material supply. The Semiconductor Industry Association's projection that US silicon wafer purchases will reach USD 18.3 billion by 2029 explains why domestic buyers are pushing for a broader and more resilient supply base.

Europe remains more concentrated around specialty-grade wafer production and process research than around new greenfield scale, which keeps it relevant to technology depth but less central to near-term capacity share gains in the DRAM silicon wafer market. Siltronic said its Singapore fab entered depreciation in August 2025 and that 2026 revenue would face pressure from exchange rates, the SD line closure, and inventory corrections outside the strongest AI-linked markets, which shows that European-linked suppliers are still balancing advanced growth with weaker legacy exposure. China is also trying to deepen regional self-sufficiency, with Nikkei Asia reporting a policy target for domestic chipmakers to source more than 70% of their silicon wafers from Chinese suppliers by the end of 2026, which supports local expansion plans even under pricing pressure. Across the DRAM silicon wafer market, geography is therefore shifting from a single Asia-led production corridor toward a broader but still highly concentrated map where domestic supply goals are rising faster than qualified new capacity.

1. Shin-Etsu Handotai Co., Ltd.
2. SUMCO Corporation
3. GlobalWafers Co., Ltd.
4. Siltronic AG
5. SK Siltron Co., Ltd.
6. Soitec S.A.
7. Okmetic Oyj
8. Wafer Works Corporation
9. RS Technologies Co., Ltd.
10. Topsil Semiconductor Materials A/S
11. Shanghai Simgui Technology Co., Ltd.
12. National Silicon Industry Group Co., Ltd.
13. GRINM Semiconductor Materials Co., Ltd.
14. Zhejiang Jinruihong Technology Co., Ltd.
15. Hangzhou Semiconductor Wafer Co., Ltd.
16. Zhonghuan Advanced Semiconductor Materials Co., Ltd.
17. FST Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Demand for HBM and Advanced DRAM Nodes
  • 4.2.2 AI and Data Center Memory Expansion
  • 4.2.3 300mm Migration for Memory-Intensive Substrates
  • 4.2.4 Government Incentives for Domestic Wafer Supply Chains
  • 4.2.5 Tight Process Control Requirements for DRAM Yield and Uniformity
  • 4.2.6 Supply Localization in Specialty Wafer Flows
• 4.3 Market Restraints
  • 4.3.1 Capital Intensity of 300mm Wafer Expansion
  • 4.3.2 Feedstock and High-Purity Polysilicon Dependency
  • 4.3.3 Qualification Risk and Long Customer Approval Cycles
  • 4.3.4 Supply Chain Volatility From Geopolitical Reallocation
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Bargaining Power of Suppliers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Industry Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Wafer Diameter
  • 5.1.1 300mm (12-inch)
  • 5.1.2 200mm (8-inch)
  • 5.1.3 Less than 150mm (6-inch and below)
• 5.2 By Wafer Type
  • 5.2.1 Polished Wafers
  • 5.2.2 Epitaxial (Epi) Wafers
• 5.3 By DRAM Type
  • 5.3.1 Standard DRAM
  • 5.3.2 Mobile DRAM (LPDDR)
  • 5.3.3 Graphics DRAM (GDDR)
  • 5.3.4 Server DRAM
  • 5.3.5 Specialty and Automotive DRAM
• 5.4 By Geography
  • 5.4.1 North America
  • 5.4.2 Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 South Korea
    • 5.4.3.4 Taiwan
    • 5.4.3.5 Rest of Asia-Pacific
  • 5.4.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Shin-Etsu Handotai Co., Ltd.
  • 6.4.2 SUMCO Corporation
  • 6.4.3 GlobalWafers Co., Ltd.
  • 6.4.4 Siltronic AG
  • 6.4.5 SK Siltron Co., Ltd.
  • 6.4.6 Soitec S.A.
  • 6.4.7 Okmetic Oyj
  • 6.4.8 Wafer Works Corporation
  • 6.4.9 RS Technologies Co., Ltd.
  • 6.4.10 Topsil Semiconductor Materials A/S
  • 6.4.11 Shanghai Simgui Technology Co., Ltd.
  • 6.4.12 National Silicon Industry Group Co., Ltd.
  • 6.4.13 GRINM Semiconductor Materials Co., Ltd.
  • 6.4.14 Zhejiang Jinruihong Technology Co., Ltd.
  • 6.4.15 Hangzhou Semiconductor Wafer Co., Ltd.
  • 6.4.16 Zhonghuan Advanced Semiconductor Materials Co., Ltd.
  • 6.4.17 FST Corporation

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment