북미의 GPU 액체 냉각 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the North America GPU liquid cooling market size is projected to expand from USD 1.59 billion in 2025 and USD 1.90 billion in 2026 to USD 5.90 billion by 2031, registering a CAGR of 25.37% between 2026 to 2031.

This report is Segmented by Cooling Type (Single-Phase, and Two-Phase), Cooling Level (Component-Level, and Server/Rack-Level), Deployment (Hyperscale/Cloud, Enterprise, Government and Research (HPC), and Edge AI), GPU Power Density (Below 300W, 300W-700W, and Above 700W), and Geography (United States, Canada, and Mexico). The Market Forecasts are Provided in Terms of Value (USD).

North America GPU Liquid Cooling Market Trends and Insights

Growing Adoption Of High-Density GPUs In Data Centers

GPU thermal design power has moved into a range where liquid cooling is now a structural requirement for the North America GPU liquid cooling market, not a premium feature. NVIDIA stated that the H100 SXM5 operated at 700W, which already placed dense AI nodes near the practical ceiling for air cooling in many facilities. Microsoft stated in April 2026 that the GB200 NVL72 rack-scale system draws around 120kW at full load and that the Vera Rubin NVL72 platform has no air-cooled configuration, which confirms that future high-end GPU systems are being designed around liquid cooling from the outset. NVIDIA also highlighted DOE-backed COOLERCHIPS work aimed at lowering cost and improving efficiency versus traditional air-cooled designs, which shows that public-sector validation is moving in the same direction as vendor roadmaps. This means operators that already built liquid-ready facilities for earlier GPU generations are now in a better position to absorb Blackwell and post-Blackwell systems, and that advantage is accelerating procurement across the North America GPU liquid cooling market in 2026.

Acceleration Of AI Training Requiring Advanced Thermal Management

Large AI training clusters place GPUs under sustained full-load conditions for long periods, and that makes thermal stability a reliability issue as much as an energy issue for the North America GPU liquid cooling market. Amazon stated in 2025 that its custom direct-to-chip closed-loop liquid cooling system moved from prototype to production in 11 months, raised compute power by 12%, and cut energy use by up to 46% against earlier air-cooled designs.Amazon also stated that the system circulates coolant in a sealed loop without increasing net water consumption, which directly addresses water sensitivity in many U.S. locations. Microsoft stated in April 2026 that it had deployed hundreds of thousands of liquid-cooled NVIDIA Grace Blackwell GPUs across Azure in under one year and had become the first hyperscale provider to power NVIDIA Vera Rubin NVL72 systems. Supermicro stated in May 2025 that its DLC-2 platform can reduce data center power use by up to 40% and lower the total cost of ownership by up to 20%, which shows the supply chain is now matching hyperscale demand with deployable commercial systems.

High Initial Capital Expenditure For Liquid Cooling Infrastructure

Upfront project cost still slows parts of the North America GPU liquid cooling market, especially where operators must retrofit older buildings instead of designing for liquid from the start. Liquid cooling requires added equipment such as coolant distribution units, manifolds, piping, cold plates, and control systems, and those layers make first-pass budgets heavier than comparable air-cooled programs. Open Compute Project guidance for modular thermal control systems also shows that CDU design needs a capacity margin for redundancy and future density growth, which can increase infrastructure scope before operators even reach full utilization. Schneider Electric stated in January 2026 that reference designs for NVIDIA GB300 NVL72 systems already support up to 142kW per rack, which illustrates the scale of thermal infrastructure now being planned into high-end AI deployments. Vendors are responding with modular and scalable CDU platforms, but the need to commit capital early still slows adoption among enterprises and public-sector buyers, which tempers the pace of the North America GPU liquid cooling market outside hyperscale environments.

Other drivers and restraints analyzed in the detailed report include:

1. Energy-Efficiency Mandates Driving Liquid Cooling Adoption
2. Rising Carbon-Neutral Commitments By Hyperscalers
3. Limited Industry Standards For Two-Phase Coolants

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Hyperscale and cloud deployments captured 64.19% of the North America GPU liquid cooling market share in 2025, which reflects the spending power and build pace of the largest cloud operators. Amazon stated in 2025 that it developed a custom direct-to-chip closed-loop liquid cooling design that increased compute power by 12% and cut energy use by up to 46%, which shows why hyperscale operators are standardizing around liquid systems instead of treating them as experimental. Microsoft stated in April 2026 that it had already deployed hundreds of thousands of liquid-cooled Grace Blackwell GPUs across Azure, which confirms that cloud-scale implementation is now happening at commercial speed. These deployments shape the wider North America GPU liquid cooling market because supplier roadmaps, validation work, and facility design choices often follow hyperscale demand first. The North America GPU liquid cooling industry is therefore still being led by buyers that can move entire fleets toward a liquid-first standard.

Enterprise is projected to grow at a 27.89% CAGR through 2031, making it the fastest-growing deployment segment as procurement barriers begin to ease. The main shift is that liquid cooling is no longer viewed only as a hyperscale solution, because proven performance data from cloud deployments has started to reduce perceived execution risk for private operators. Government and research buyers are also getting clearer signals from DOE-backed cooling efforts that support next-generation modular thermal systems and better efficiency than legacy air-cooled setups. Edge AI remains the smallest deployment group, but GRC stated in November 2025 that its ICEraQ Nano system was built specifically for smaller data rooms and communications closets, which shows that the North America GPU liquid cooling market is beginning to extend beyond core campuses into distributed inference locations.

Component-level cooling held 56.27% share in 2025 and remained the largest cooling level in the North America GPU liquid cooling market because cold-plate direct-to-chip designs match the heat profile of modern GPUs and CPUs with far greater precision than room-level airflow management. This approach keeps cooling focused on the devices that generate most of the heat, which improves thermal control without forcing the entire room into a higher-cost cooling model. Frore Systems stated in May 2026 that lowering GPU temperature by 8°C below the thermal limit can help sustain compute throughput, which explains why chip-level thermal stability is directly tied to performance value. That direct link between temperature and usable performance has helped component-level solutions retain leadership even as rack power keeps climbing. The North America GPU liquid cooling market still depends heavily on these cold-plate architectures because they offer the clearest path for both greenfield and retrofit programs.

Server and rack-level cooling is projected to expand at a 28.23% CAGR, which makes it the fastest-growing cooling level as AI systems move toward denser rack-scale integration. Microsoft stated in April 2026 that NVIDIA Vera Rubin NVL72 is designed as a fully liquid-cooled platform with no air-cooled option, which supports the shift from individual component decisions to larger rack-level thermal design choices. LiquidStack stated in May 2026 that its GigaModular CDU platform supports deployments up to 14MW, which reflects how vendors are building for whole-system and multi-rack thermal management rather than single-node optimization alone. CoolIT Systems stated in February 2026 that its manufacturing and engineering work supports AI chips above 4,000W and server racks above 500kW, which signals that higher-capacity fluid management is moving to the center of product design. Open Compute Project guidance reinforces that CDU systems need scalability and redundancy, so rack-level procurement is becoming more strategic across the North America GPU liquid cooling market.

Complete Report Scope:

• By Cooling Type
  • Single-Phase Liquid Cooling
  • Two-Phase Liquid Cooling
• By Cooling Level
  • Component-Level Cooling
  • Server / Rack-Level Cooling
• By Deployment
  • Hyperscale / Cloud
  • Enterprise
  • Government & Research (HPC)
  • Edge AI
• By GPU Power Density
  • Below 300W
  • 300W - 700W
  • Above 700W
• By Geography
  • North America
  • United States
  • Canada
  • Mexico

List of Companies Covered in this Report:

1. CoolIT Systems Inc.
2. Asetek Inc.
3. GRC (Green Revolution Cooling)
4. LiquidStack Inc.
5. Submer Technologies S.L.
6. Iceotope Technologies Ltd.
7. Motivair Corporation
8. Chilldyne Inc.
9. Midas Green Technologies LLC
10. Asperitas BV
11. Rittal GmbH and Co. KG
12. Schneider Electric SE
13. Vertiv Group Corp.
14. Advanced Cooling Solutions LLC
15. Cooler Master Technology Inc.
16. EKWB d.o.o.
17. Corsair Gaming Inc.
18. Noctua GmbH
19. Alphacool International GmbH
20. Thermaltake Technology Co. Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing Adoption of High-Density GPUs in Data Centers
  • 4.2.2 Acceleration of AI Training Requiring Advanced Thermal Management
  • 4.2.3 Energy-Efficiency Mandates Driving Liquid Cooling Adoption
  • 4.2.4 Rising Carbon-Neutral Commitments by Hyperscalers
  • 4.2.5 Availability of Utility Incentives for Water-Saving Cooling Solutions
  • 4.2.6 Emergence of GPU-Powered Edge Micro Data Centers
• 4.3 Market Restraints
  • 4.3.1 High Initial Capital Expenditure for Liquid Cooling Infrastructure
  • 4.3.2 Limited Industry Standards for Two-Phase Coolants
  • 4.3.3 Skill Gap in Liquid Cooling Maintenance Workforce
  • 4.3.4 Perceived Risk of Coolant Leakage in Mission-Critical Servers
• 4.4 Industry Value Chain Analysis
• 4.5 Impact of Macroeconomic Factors on the Market
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Cooling Type
  • 5.1.1 Single-Phase Liquid Cooling
  • 5.1.2 Two-Phase Liquid Cooling
• 5.2 By Cooling Level
  • 5.2.1 Component-Level Cooling
  • 5.2.2 Server / Rack-Level Cooling
• 5.3 By Deployment
  • 5.3.1 Hyperscale / Cloud
  • 5.3.2 Enterprise
  • 5.3.3 Government & Research (HPC)
  • 5.3.4 Edge AI
• 5.4 By GPU Power Density
  • 5.4.1 Below 300W
  • 5.4.2 300W - 700W
  • 5.4.3 Above 700W
• 5.5 By Geography
  • 5.5.1 North America
  • 5.5.2 United States
  • 5.5.3 Canada
  • 5.5.4 Mexico

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (Each profile includes: Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 CoolIT Systems Inc.
  • 6.4.2 Asetek Inc.
  • 6.4.3 GRC (Green Revolution Cooling)
  • 6.4.4 LiquidStack Inc.
  • 6.4.5 Submer Technologies S.L.
  • 6.4.6 Iceotope Technologies Ltd.
  • 6.4.7 Motivair Corporation
  • 6.4.8 Chilldyne Inc.
  • 6.4.9 Midas Green Technologies LLC
  • 6.4.10 Asperitas BV
  • 6.4.11 Rittal GmbH and Co. KG
  • 6.4.12 Schneider Electric SE
  • 6.4.13 Vertiv Group Corp.
  • 6.4.14 Advanced Cooling Solutions LLC
  • 6.4.15 Cooler Master Technology Inc.
  • 6.4.16 EKWB d.o.o.
  • 6.4.17 Corsair Gaming Inc.
  • 6.4.18 Noctua GmbH
  • 6.4.19 Alphacool International GmbH
  • 6.4.20 Thermaltake Technology Co. Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment