GPU 냉각 솔루션 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the GPU cooling solutions market size is projected to expand from USD 9.80 billion in 2025 and USD 11.86 billion in 2026 to USD 35.60 billion by 2031, registering a CAGR of 24.59% between 2026 and 2031.

This report is Segmented by Cooling Technology (Air Cooling, Liquid Cooling, Immersion Cooling, and Hybrid Cooling), Cooling Level (Component-Level Cooling, and Server and Rack-Level Cooling), Deployment (Hyperscale and Cloud, Enterprise, Government and Research HPC, and More), GPU Power Density (Below 300W, 300W-700W, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global GPU Cooling Solutions Market Trends and Insights

Growing GPU Power Densities Requiring Advanced Thermal Management

NVIDIA's Blackwell Ultra pushes 1,400 W TDP per device, and the forthcoming Rubin series targets 1,950 W, eclipsing the 400 W ceiling long assumed for air-cooled heat sinks. Rack-level densities climbed from 15 kW in 2024 to projections above 240 kW by 2028, leaving retrofit windows razor-thin and turning liquid cooling from an option to a mandate. Microsoft's 750 W Maia 200 accelerator already relies on closed-loop plates to stay below 85 °C, a technical inflection likely to push air cooling into CPU-only or storage lanes by the decade's close.

Expansion of Hyperscale Data Centers with GPU-Accelerated Workloads

Meta's 4 million ft2 Hyperion campus in Louisiana and Microsoft's 1 GW Azure AI superfactory in Atlanta are purpose-built for liquid racks and will deliver a combined 1.3 GW of GPU capacity by 2028. Public programs mirror the trend, for instance, Canada's Sovereign Compute Initiative set aside CAD 2 billion (USD 1.48 billion) in 2025 with a mandate for liquid cooling, and the UK's DAWN upgrade achieved a 1.12 PUE through immersion cooling. These builds guarantee multi-year demand for coolant-distribution units, custom plates, and dielectric fluids.

High Capital Expenditure of Liquid and Immersion Cooling Infrastructure

Turnkey immersion systems typically cost between USD 800 and 1,200 per kW, which is approximately double the cost of air-cooled systems. Additionally, direct-to-chip cooling kits increase server pricing by 20% to 40%. Despite these higher upfront costs, the five-year total cost of ownership savings often exceed 15%. However, many mid-tier operators face challenges in accessing affordable financing options. This financial barrier delays the adoption of these advanced cooling solutions until more reliable payback models are established. As a result, the market's growth is hindered by the lack of widespread affordability and financing mechanisms.

Other drivers and restraints analyzed in the detailed report include:

1. Increasing Adoption of Liquid Cooling in HPC and AI Clusters
2. Government Energy Efficiency Regulations for Data Centers
3. Compatibility Issues with Legacy Server Racks and Facility Layouts

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Air cooling held 45.50% of the Graphics Processing Unit (GPU) cooling solutions market share in 2025 because it leverages existing facilities and carries lower upfront capital. This method remains a preferred choice for enterprises looking to optimize costs while utilizing existing infrastructure. However, the segment's growth lags behind the overall GPU cooling solutions market as immersion solutions gain traction. Immersion solutions are projected to grow at a 25.50% CAGR through 2031, driven by their ability to eliminate hot aisles and reduce the data center footprint by up to 60%. Submer's 2025 SmartPod rollout in India demonstrated these advantages effectively. Despite these benefits, challenges such as fluid-disposal regulations and the absence of unified dielectric standards continue to hinder widespread adoption, though ongoing R&D efforts aim to address these issues.

Rack-level cold plates are expanding fastest because they integrate neatly with Open Compute Project racks and consolidate plumbing into fewer hose assemblies, slashing installation time by 30%. These systems are increasingly favored for their efficiency and compatibility with modern data center designs. Hybrid designs, which use air cooling for CPUs and liquid cooling for GPUs, are also gaining traction. This approach appeals to enterprises that prefer a phased migration of workloads, balancing innovation with risk management. The adoption of such hybrid systems reflects a cautious yet progressive strategy among enterprises. As the market evolves, these solutions are expected to play a critical role in addressing the growing demand for efficient GPU cooling technologies.

Server and rack-level cooling accounted for 60.10% of the graphics processing unit (GPU) cooling solutions market in 2025 and is poised for a 26.10% CAGR, as operators increasingly favor modular coolant distribution units that align with Open Compute Project racks. These systems support rack-level deployment and help data center operators manage higher thermal loads more efficiently. Cost savings result from serving up to 40 servers per coolant distribution unit, reducing the need for extensive plumbing infrastructure and lowering ongoing maintenance overhead.

Component-level cold plates remain vital in deployments where sub-millisecond latency is paramount and precise device-level thermal control is required. Technologies such as Frore Systems' generatively designed plates for 1,950 W GPUs enable localized thermal optimization, helping extend hardware lifespan while supporting high-performance GPU operation, although they introduce higher per-node complexity. Long-term growth depends on IEEE interoperability standards scheduled for late 2026, which may support multi-vendor interchangeability for cold-plate interfaces and improve adoption across heterogeneous infrastructure environments.

Complete Report Scope:

• By Cooling Technology
  • Air Cooling
  • Liquid Cooling (Direct-to-Chip)
  • Immersion Cooling
  • Hybrid Cooling
• By Cooling Level
  • Component-Level Cooling
  • Server and Rack-Level Cooling
• By Deployment
  • Hyperscale and Cloud
  • Enterprise
  • Government and Research (HPC)
  • Edge
• By GPU Power Density
  • Below 300W
  • 300W - 700W
  • Above 700W
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • Middle East and Africa

Geography Analysis

Asia-Pacific retained 66.90% of global revenue in 2025, and its 28.20% CAGR through 2031 outstrips every other region, underscoring the region's leading role in GPU cooling solutions demand. National AI mandates in Japan, South Korea, and Singapore continue to fund domestic GPU clusters that must satisfy strict energy-efficiency targets, effectively making liquid cooling a preferred best practice for large-scale AI infrastructure. Japan's NTT pledged 1 GW of GPU capacity at Shinagawa using immersion cooling, while Singapore's 58 MW Nxera deployment validated PUE 1.25 operation in a humid tropical climate, demonstrating that advanced cooling systems can support high-density compute environments under challenging weather conditions.

North America ranks second by revenue, supported by hyperscale projects such as Meta Hyperion and Microsoft's Atlanta superfactory, which together are expected to add over 1.5 GW of GPU capacity before 2028. These projects continue to strengthen regional demand for high-performance cooling architectures capable of supporting dense AI and accelerated computing workloads. Government initiatives, including Canada's Sovereign Compute Initiative, add another layer of demand, but 24-week lead times for cold plates and pumps remain a supply-side constraint and may defer revenue recognition into late 2027.

Europe trails Asia-Pacific and North America but continues to gain momentum under Delegated Regulation 2024/1364, which sets a PUE ceiling of 1.5 by 2030 and pushes operators toward more efficient thermal management. Exascale programs such as EuroHPC's HammerHAI reinforce liquid cooling's role in next-generation high-performance computing infrastructure, while district-heating incentives in Germany allow operators to monetize waste heat and improve return on investment. The Middle East and Africa remain nascent, though sovereign AI projects in the United Arab Emirates and Saudi Arabia are planning purpose-built facilities for 2027 and beyond, indicating potential upside as regional AI infrastructure investment scales.

1. CoolIT Systems Inc.
2. Asetek A/S
3. Noctua GmbH
4. EKWB d.o.o.
5. Nvidia Corporation
6. Advanced Micro Devices, Inc.
7. Dell Technologies Inc.
8. Hewlett Packard Enterprise Company
9. Lenovo Group Limited
10. Super Micro Computer, Inc.
11. Corsair Gaming, Inc.
12. Arctic GmbH
13. ASUStek Computer Inc.
14. Giga-Byte Technology Co., Ltd.
15. Alphacool International GmbH
16. Phanteks Company B.V.
17. Thermaltake Technology Co., Ltd.
18. Fujitsu Limited
19. Inspur Systems Inc.
20. LiquidStack Inc.
21. Submer Technologies S.L.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing GPU Power Densities Requiring Advanced Thermal Management
  • 4.2.2 Expansion of Hyperscale Data Centers with GPU-Accelerated Workloads
  • 4.2.3 Increasing Adoption of Liquid Cooling in HPC and AI Clusters
  • 4.2.4 Government Energy Efficiency Regulations for Data Centers
  • 4.2.5 Emergence of Modular Immersion Cooling Pods for Edge Micro-DCs
  • 4.2.6 Integration of AI-Based Thermal Telemetry Driving Predictive Cooling Optimization
• 4.3 Market Restraints
  • 4.3.1 High Capital Expenditure of Liquid and Immersion Cooling Infrastructure
  • 4.3.2 Compatibility Issues with Legacy Server Racks and Facility Layouts
  • 4.3.3 Limited Industry Standards for Coolant Fluids
  • 4.3.4 Supply Chain Constraints for Advanced Cold Plates and Pump Components
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Cooling Technology
  • 5.1.1 Air Cooling
  • 5.1.2 Liquid Cooling (Direct-to-Chip)
  • 5.1.3 Immersion Cooling
  • 5.1.4 Hybrid Cooling
• 5.2 By Cooling Level
  • 5.2.1 Component-Level Cooling
  • 5.2.2 Server and Rack-Level Cooling
• 5.3 By Deployment
  • 5.3.1 Hyperscale and Cloud
  • 5.3.2 Enterprise
  • 5.3.3 Government and Research (HPC)
  • 5.3.4 Edge
• 5.4 By GPU Power Density
  • 5.4.1 Below 300W
  • 5.4.2 300W - 700W
  • 5.4.3 Above 700W
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 Southeast Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 CoolIT Systems Inc.
  • 6.4.2 Asetek A/S
  • 6.4.3 Noctua GmbH
  • 6.4.4 EKWB d.o.o.
  • 6.4.5 Nvidia Corporation
  • 6.4.6 Advanced Micro Devices, Inc.
  • 6.4.7 Dell Technologies Inc.
  • 6.4.8 Hewlett Packard Enterprise Company
  • 6.4.9 Lenovo Group Limited
  • 6.4.10 Super Micro Computer, Inc.
  • 6.4.11 Corsair Gaming, Inc.
  • 6.4.12 Arctic GmbH
  • 6.4.13 ASUStek Computer Inc.
  • 6.4.14 Giga-Byte Technology Co., Ltd.
  • 6.4.15 Alphacool International GmbH
  • 6.4.16 Phanteks Company B.V.
  • 6.4.17 Thermaltake Technology Co., Ltd.
  • 6.4.18 Fujitsu Limited
  • 6.4.19 Inspur Systems Inc.
  • 6.4.20 LiquidStack Inc.
  • 6.4.21 Submer Technologies S.L.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment