시장보고서
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MID(성형회로부품) 시장 규모, 점유율, 동향 분석 보고서 : 디바이스별, 제품별, 최종 용도별, 지역별, 부문 예측(2025-2033년)

Molded Interconnect Device Market Size, Share & Trends Analysis Report By Device (Laser Direct Structuring (LDS), Two-Shot Molding), By Product (Sensor Housings, Connectors & Switches), By End Use, By Region, And Segment Forecasts, 2025 - 2033

발행일: | 리서치사: Grand View Research | 페이지 정보: 영문 120 Pages | 배송안내 : 2-10일 (영업일 기준)

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

MID(성형회로부품) 시장 요약

세계의 MID(성형회로부품) 시장 규모는 2024년에 21억 3,560만 달러로 평가되었고, 2033년까지 65억 2,200만 달러에 이를 것으로 예측되고 있습니다.

2025년부터 2033년까지 연평균 복합 성장률(CAGR) 13.3%를 나타낼 전망입니다. MID(성형회로부품) 시장은 급속히 확대되고 있습니다.

컴팩트하고 다기능 전자 부품에 대한 수요가 높아지고 있습니다. 특히 자동차, 항공우주, 소비자용 전자기기 분야에서의 성장이 현저합니다. 첨단 제조 기술을 통해 플라스틱 기판에서보다 복잡한 3D 회로를 실현할 수 있습니다. 선진재료의 활용이 MID(성형회로부품) 시장에 점점 영향을 미치고 있습니다. 각사는 고성능 수지의 통합에 주력해, 디바이스 기능성의 향상을 도모하고 있습니다. 이러한 재료는 복잡한 용도에서 내열성과 소형화 설계를 가능하게 합니다. 자동차 및 ICT 분야가 이러한 차세대 MID 수요를 견인하고 있습니다. 전략적 인수로 기업은 특허 기술에 대한 액세스를 획득하고 제품 포트폴리오를 확대하고 있습니다. 재료 혁신은 MID 솔루션의 성장과 확장성을 지원합니다. 각 회사는 MID 제품을 강화하기 위해 이러한 노력을 적극적으로 추진하고 있습니다. 예를 들어, 2025년 2월에는 일본의 화학 제조업체인 스미토모화학이, 모빌리티 및 ICT 용도용 제품·기술 포트폴리오의 확충을 목적으로, Syensqo사의 LCP 순수 수지 사업을 인수했습니다. Syensqo사의 특허 기술을 활용하여 차세대 자동차용 MID공급을 목표로 하고 있습니다. 이에 따라 커넥티드카 및 자율주행차용 생산 확대를 지원함과 동시에 향후 자동차 전자기기에서 LCP의 역할을 강화해 나갈 것입니다.

소형화·컴팩트화의 동향이 진행되는 전자기기의 동향에는 MID 기술이 제공할 수 있는 선진적인 상호 접속 솔루션이 필수적입니다. MID는 전자 부품의 공간 효율화와 집적화를 실현합니다. 자동차, 소비자용 전자기기, 의료기기 등의 산업에서는 고성능이면서 경량인 부품이 요구되고 있습니다. 경량 소재로 만들어진 MID는 성능 기준을 유지하면서 이러한 요구를 충족합니다.

맞춤형 전자 부품에 대한 수요가 증가함에 따라 MID는 특정 용도 요구 사항을 충족하는 맞춤 설계를 유연하게 실현합니다. 프로토타입 및 소량 생산에서 MID를 채택하는 것이 쉬워졌고, 기업은 상당한 선행 투자 없이 혁신적인 설계를 실험할 수 있게 되었습니다.

정부의 이니셔티브는 MID(성형회로부품) 산업에 큰 영향을 미칠 수 있습니다. 예를 들어 2024년 2월, 인도 정부는 디지털 인디어 퓨처 랩을 디지털 인디어 퓨처 랩 정상 회담 2024에서 발표하여 인도가 기술 소비자로부터 차세대 전자 기기 개발의 리더로 진화하고 있다고 강조했습니다. 본 서밋에서는 NXP 세미컨덕터스나 퀄컴 테크놀로지스사 등과의 사이에 22건의 각서(MoU)가 발표되어 인공지능(AI), 사물인터넷(IoT), 양자컴퓨팅 등 중요 분야에서의 혁신과 협업을 통해 인도의 전자시스템 설계·제조(ESDM) 섹터 강화 이러한 노력은 기술 발전을 가속화하고 혁신적인 MID 솔루션 개발과 관련된 비용 장벽 감소에 기여할 수 있습니다.

자주 묻는 질문

  • MID(성형회로부품) 시장 규모는 어떻게 예측되나요?
  • MID(성형회로부품) 시장의 주요 성장 요인은 무엇인가요?
  • MID 기술이 제공하는 이점은 무엇인가요?
  • MID 시장에서 맞춤형 전자 부품에 대한 수요는 어떻게 변화하고 있나요?
  • MID 시장에 대한 정부의 이니셔티브는 어떤 영향을 미치고 있나요?
  • MID 시장에서 주요 기업들은 어떤 전략을 추진하고 있나요?

목차

제1장 조사 방법과 범위

제2장 주요 요약

제3장 MID(성형회로부품) 시장의 변수, 동향 및 범위

  • 시장 도입/계통 전망
  • 업계 밸류체인 분석
  • 시장 역학
    • 시장 성장 촉진요인 분석
    • 시장 성장 억제요인 분석
    • 업계의 기회
    • 업계의 과제
  • MID(성형회로부품) 시장 분석 툴
    • Porter's Five Forces 분석
    • PESTEL 분석

제4장 MID(성형회로부품) 시장 : 디바이스의 추정 및 동향 분석

  • 부문 대시보드
  • MID(성형회로부품) 시장 : 디바이스의 변동 분석(2024년 및 2033년)
  • 레이저 직접 구조화(LDS)
  • 투샷 성형
  • 기타

제5장 MID(성형회로부품) 시장 : 제품의 추정 및 동향 분석

  • 부문 대시보드
  • 성형 상호 연결 장치 시장 : 제품 변동 분석(2024년 및 2033년)
  • 센서 하우징
  • 안테나
  • 커넥터 및 스위치
  • 조명
  • 기타

제6장 MID(성형회로부품) 시장 : 최종 용도의 추정 및 동향 분석

  • 부문 대시보드
  • 성형 상호 연결 장치 시장 : 최종 용도의 변동 분석(2024년 및 2033년)
  • 헬스케어
  • 자동차
  • 소비자 일렉트로닉스
  • 통신
  • 항공우주 및 방위
  • 기타

제7장 MID(성형회로부품) 시장 : 지역의 추정 및 동향 분석

  • MID(성형회로 부품) 시장 점유율(지역별, 2024년 및 2033년), 단위 : 백만 달러
  • 북미
    • 디바이스별(2021-2033년)
    • 제품별(2021-2033년)
    • 최종 용도별(2021-2033년)
    • 미국
    • 캐나다
    • 멕시코
  • 유럽
    • 디바이스별(2021-2033년)
    • 제품별(2021-2033년)
    • 최종 용도별(2021-2033년)
    • 영국
    • 독일
    • 프랑스
  • 아시아태평양
    • 디바이스별(2021-2033년)
    • 제품별(2021-2033년)
    • 최종 용도별(2021-2033년)
    • 중국
    • 일본
    • 인도
    • 한국
    • 호주
  • 라틴아메리카
    • 디바이스별(2021-2033년)
    • 제품별(2021-2033년)
    • 최종 용도별(2021-2033년)
    • 브라질
  • 중동 및 아프리카
    • 디바이스별(2021-2033년)
    • 제품별(2021-2033년)
    • 최종 용도별(2021-2033년)
    • 사우디아라비아(KSA)
    • 아랍에미리트(UAE)
    • 남아프리카

제8장 경쟁 구도

  • 주요 시장 진출기업에 의한 최근의 동향과 영향 분석
  • 기업 분류
  • 기업의 시장 포지셔닝
  • 기업의 시장 점유율 분석
  • 기업 히트맵 분석
  • 전략 매핑
    • 확대
    • 합병과 인수
    • 파트너십 및 협업
    • 신제품 발매
    • 연구개발
  • 기업 프로파일
    • TE Connectivity
    • KYOCERA AVX Components Corporation
    • LPKF
    • Molex
    • Amphenol Corporation
    • Taoglas
    • HARTING Technology Group
    • Sumitomo Electric Industries, Ltd.
    • MID Solutions GmbH
    • TEPROSA
KTH 25.12.11

Molded Interconnect Device Market Summary

The global molded interconnect device market size was estimated at USD 2,135.6 million in 2024 and is projected to reach USD 6,522.0 million by 2033, growing at a CAGR of 13.3% from 2025 to 2033. The molded interconnect device (mid) market is expanding rapidly.

Demand is rising for compact and multifunctional electronic components. Growth is especially strong in automotive, aerospace, and consumer electronics. Advanced manufacturing technologies are enabling more complex 3D circuitry on plastic substrates. The use of advanced materials is increasingly influencing the Molded Interconnect Device (MID) market. Companies are focusing on integrating high-performance resins to improve device functionality. These materials enable heat resistance and miniaturized designs for complex applications. Automotive and ICT sectors are driving demand for such next-generation MIDs. Strategic acquisitions help firms access patented technologies and expand their product portfolios. Material innovation is supporting the growth and scalability of MID solutions. Companies are actively pursuing these initiatives to strengthen their MID offerings. For instance, in February 2025, Sumitomo Chemical, a chemical company in Japan, acquired Syensqo's LCP neat resin business to expand its product and technology portfolio for mobility and ICT applications. Using Syensqo's patents and technology, the company aims to supply next-generation automotive MIDs, supporting scalable production for connected and autonomous vehicles and reinforcing LCP's role in future automotive electronics.

The trend towards smaller, more compact electronic devices necessitates advanced interconnect solutions that MID technology can provide. MIDs allow for more efficient use of space and integration of electronic components. Industries such as automotive, consumer electronics, and medical devices require high-performance yet lightweight components. MIDs, made from lightweight materials, meet these needs while maintaining performance standards.

The demand for customized electronic components is growing, and MIDs offer the flexibility to create bespoke designs that meet specific application requirements. MIDs are becoming more accessible for prototyping and low-volume production, allowing companies to experiment with innovative designs without significant upfront investment.

Government initiatives can have a significant positive impact on the molded interconnect device industry. For instance, in February 2024, the Indian government launched the "Digital India FutureLABS" at the Digital India FutureLABS Summit 2024, emphasizing India's progress from a technology consumer to a leader in developing next-generation electronics. The summit featured the announcement of 22 Memorandums of Understanding (MoUs) with companies like NXP Semiconductors and Qualcomm Technologies, Inc., aiming to strengthen India's Electronics System Design and Manufacturing (ESDM) sector through innovation and collaboration in key areas such as Artificial Intelligence (AI), the Internet of Things (IoT), and quantum computing. Such initiatives can accelerate technological advancements and reduce the cost barriers associated with developing innovative MID solutions.

Global Molded Interconnect Device Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2025 to 2033. For this study, Grand View Research has segmented the global molded interconnect device market report based on device, product, end use, and region.

  • Device Outlook (Revenue, USD Million, 2021 - 2033)
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Others
  • Product Outlook (Revenue, USD Million, 2021 - 2033)
  • Sensor Housings
  • Antennas
  • Connectors & Switches
  • Lighting
  • Others
  • End Use Outlook (Revenue, USD Million, 2021 - 2033)
  • Healthcare
  • Automotive
  • Consumer Electronics
  • Telecommunication
  • Aerospace and Defense
  • Others
  • Regional Outlook (Revenue, USD Million, 2021 - 2033)
  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
  • Asia Pacific
    • India
    • China
    • Japan
    • South Korea
    • Australia
  • Latin America
    • Brazil
  • Middle East and Africa (MEA)
    • Kingdom of Saudi Arabia (KSA)
    • UAE
    • South Africa

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation and Scope
  • 1.2. Market Definitions
  • 1.3. Research Methodology
    • 1.3.1. Information Procurement
    • 1.3.2. Information or Data Analysis
    • 1.3.3. Market Formulation & Data Visualization
    • 1.3.4. Data Validation & Publishing
  • 1.4. Research Scope and Assumptions
    • 1.4.1. List of Data Sources

Chapter 2. Executive Summary

  • 2.1. Market Outlook
  • 2.2. Segment Outlook
  • 2.3. Competitive Insights

Chapter 3. Molded Interconnect Device Market Variables, Trends, & Scope

  • 3.1. Market Introduction/Lineage Outlook
  • 3.2. Industry Value Chain Analysis
  • 3.3. Market Dynamics
    • 3.3.1. Market Drivers Analysis
    • 3.3.2. Market Restraints Analysis
    • 3.3.3. Industry Opportunities
    • 3.3.4. Industry Challenges
  • 3.4. Molded Interconnect Device Market Analysis Tools
    • 3.4.1. Porter's Analysis
      • 3.4.1.1. Bargaining power of the suppliers
      • 3.4.1.2. Bargaining power of the buyers
      • 3.4.1.3. Threats of substitution
      • 3.4.1.4. Threats from new entrants
      • 3.4.1.5. Competitive rivalry
    • 3.4.2. PESTEL Analysis
      • 3.4.2.1. Political landscape
      • 3.4.2.2. Economic and Social landscape
      • 3.4.2.3. Technological landscape
      • 3.4.2.4. Environmental landscape
      • 3.4.2.5. Legal landscape

Chapter 4. Molded Interconnect Device Market: Device Estimates & Trend Analysis

  • 4.1. Segment Dashboard
  • 4.2. Molded Interconnect Device Market: Device Movement Analysis, 2024 & 2033 (USD Million)
  • 4.3. Laser Direct Structuring (LDS)
    • 4.3.1. Laser Direct Structuring (LDS) Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. Two-Shot Molding
    • 4.4.1. Two-Shot Molding Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.5. Others
    • 4.5.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Molded Interconnect Device Market: Product Estimates & Trend Analysis

  • 5.1. Segment Dashboard
  • 5.2. Molded Interconnect Device Market: Product Movement Analysis, 2024 & 2033 (USD Million)
  • 5.3. Sensor Housings
    • 5.3.1. Sensor Housings Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Antennas
    • 5.4.1. Antennas Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Connectors & Switches
    • 5.5.1. Connectors & Switches Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. Lighting
    • 5.6.1. Lighting Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. Others
    • 5.7.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Molded Interconnect Device Market: End Use Estimates & Trend Analysis

  • 6.1. Segment Dashboard
  • 6.2. Molded Interconnect Device Market: End Use Movement Analysis, 2024 & 2033 (USD Million)
  • 6.3. Healthcare
    • 6.3.1. Healthcare Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Automotive
    • 6.4.1. Automotive Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Consumer Electronics
    • 6.5.1. Consumer Electronics Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Telecommunication
    • 6.6.1. Telecommunication Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.7. Aerospace and Defense
    • 6.7.1. Aerospace and Defense Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.8. Others
    • 6.8.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Molded Interconnect Device Market: Regional Estimates & Trend Analysis

  • 7.1. Molded Interconnect Device Market Share, By Region, 2024 & 2033, USD Million
  • 7.2. North America
    • 7.2.1. North America Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.2.2. North America Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
    • 7.2.3. North America Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
    • 7.2.4. North America Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.2.5. U.S.
      • 7.2.5.1. U.S. Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.2.5.2. U.S. Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.2.5.3. U.S. Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.2.5.4. U.S. Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.2.6. Canada
      • 7.2.6.1. Canada Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.2.6.2. Canada Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.2.6.3. Canada Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.2.6.4. Canada Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.2.7. Mexico
      • 7.2.7.1. Mexico Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.2.7.2. Mexico Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.2.7.3. Mexico Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.2.7.4. Mexico Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
  • 7.3. Europe
    • 7.3.1. Europe Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.3.2. Europe Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
    • 7.3.3. Europe Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
    • 7.3.4. Europe Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.3.5. UK
      • 7.3.5.1. UK Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.3.5.2. UK Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.3.5.3. UK Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.3.5.4. UK Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.3.6. Germany
      • 7.3.6.1. Germany Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.3.6.2. Germany Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.3.6.3. Germany Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.3.6.4. Germany Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.3.7. France
      • 7.3.7.1. France Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.3.7.2. France Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.3.7.3. France Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.3.7.4. France Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
  • 7.4. Asia Pacific
    • 7.4.1. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.4.2. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
    • 7.4.3. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
    • 7.4.4. Asia Pacific Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.4.5. China
      • 7.4.5.1. China Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.4.5.2. China Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.4.5.3. China Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.4.5.4. China Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.4.6. Japan
      • 7.4.6.1. Japan Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.4.6.2. Japan Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.4.6.3. Japan Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.4.6.4. Japan Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.4.7. India
      • 7.4.7.1. India Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.4.7.2. India Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.4.7.3. India Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.4.7.4. India Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.4.8. South Korea
      • 7.4.8.1. South Korea Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.4.8.2. South Korea Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.4.8.3. South Korea Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.4.8.4. South Korea Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.4.9. Australia
      • 7.4.9.1. Australia Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.4.9.2. Australia Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.4.9.3. Australia Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.4.9.4. Australia Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
  • 7.5. Latin America
    • 7.5.1. Latin America Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.5.2. Latin America Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
    • 7.5.3. Latin America Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
    • 7.5.4. Latin America Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.5.5. Brazil
      • 7.5.5.1. Brazil Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.5.5.2. Brazil Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.5.5.3. Brazil Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.5.5.4. Brazil Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
  • 7.6. Middle East and Africa
    • 7.6.1. Middle East & Africa Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 7.6.2. Middle East & Africa (MEA) Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
    • 7.6.3. Middle East & Africa (MEA) Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
    • 7.6.4. Middle East & Africa (MEA) Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.6.5. Kingdom of Saudi Arabia (KSA)
      • 7.6.5.1. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.6.5.2. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.6.5.3. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.6.5.4. Kingdom of Saudi Arabia (KSA) Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.6.6. UAE
      • 7.6.6.1. UAE Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.6.6.2. UAE Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.6.6.3. UAE Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.6.6.4. UAE Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)
    • 7.6.7. South Africa
      • 7.6.7.1. South Africa Molded Interconnect Device Market Estimates and Forecasts, 2021 - 2033 (USD Million)
      • 7.6.7.2. South Africa Molded Interconnect Device Market Estimates and Forecasts, by Device, 2021 - 2033 (USD Million)
      • 7.6.7.3. South Africa Molded Interconnect Device Market Estimates and Forecasts, by Product, 2021 - 2033 (USD Million)
      • 7.6.7.4. South Africa Molded Interconnect Device Market Estimates and Forecasts, by End Use, 2021 - 2033 (USD Million)

Chapter 8. Competitive Landscape

  • 8.1. Recent Developments & Impact Analysis by Key Market Participants
  • 8.2. Company Categorization
  • 8.3. Company Market Positioning
  • 8.4. Company Market Share Analysis
  • 8.5. Company Heat Map Analysis
  • 8.6. Strategy Mapping
    • 8.6.1. Expansion
    • 8.6.2. Mergers & Acquisition
    • 8.6.3. Partnerships & Collaborations
    • 8.6.4. New Product Launches
    • 8.6.5. Research And Development
  • 8.7. Company Profiles
    • 8.7.1. TE Connectivity
      • 8.7.1.1. Participant's Overview
      • 8.7.1.2. Financial Performance
      • 8.7.1.3. Product Benchmarking
      • 8.7.1.4. Recent Developments
    • 8.7.2. KYOCERA AVX Components Corporation
      • 8.7.2.1. Participant's Overview
      • 8.7.2.2. Financial Performance
      • 8.7.2.3. Product Benchmarking
      • 8.7.2.4. Recent Developments
    • 8.7.3. LPKF
      • 8.7.3.1. Participant's Overview
      • 8.7.3.2. Financial Performance
      • 8.7.3.3. Product Benchmarking
      • 8.7.3.4. Recent Developments
    • 8.7.4. Molex
      • 8.7.4.1. Participant's Overview
      • 8.7.4.2. Financial Performance
      • 8.7.4.3. Product Benchmarking
      • 8.7.4.4. Recent Developments
    • 8.7.5. Amphenol Corporation
      • 8.7.5.1. Participant's Overview
      • 8.7.5.2. Financial Performance
      • 8.7.5.3. Product Benchmarking
      • 8.7.5.4. Recent Developments
    • 8.7.6. Taoglas
      • 8.7.6.1. Participant's Overview
      • 8.7.6.2. Financial Performance
      • 8.7.6.3. Product Benchmarking
      • 8.7.6.4. Recent Developments
    • 8.7.7. HARTING Technology Group
      • 8.7.7.1. Participant's Overview
      • 8.7.7.2. Financial Performance
      • 8.7.7.3. Product Benchmarking
      • 8.7.7.4. Recent Developments
    • 8.7.8. Sumitomo Electric Industries, Ltd.
      • 8.7.8.1. Participant's Overview
      • 8.7.8.2. Financial Performance
      • 8.7.8.3. Product Benchmarking
      • 8.7.8.4. Recent Developments
    • 8.7.9. MID Solutions GmbH
      • 8.7.9.1. Participant's Overview
      • 8.7.9.2. Financial Performance
      • 8.7.9.3. Product Benchmarking
      • 8.7.9.4. Recent Developments
    • 8.7.10. TEPROSA
      • 8.7.10.1. Participant's Overview
      • 8.7.10.2. Financial Performance
      • 8.7.10.3. Product Benchmarking
      • 8.7.10.4. Recent Developments
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