성형 회로 부품 시장 - 세계 산업 규모, 점유율, 동향, 기회, 예측 : 프로세스별, 용도별, 지역별 및 경쟁(2021-2031년)

The Global Molded Interconnect Device Market is projected to expand from USD 9.94 Billion in 2025 to USD 21.62 Billion by 2031, registering a CAGR of 13.83%. Molded Interconnect Devices (MIDs) utilize injection-molded thermoplastics to embed electronic circuit traces, seamlessly merging mechanical and electrical functionalities into a single unit. This market is primarily fueled by the growing necessity for miniaturization within the electronics sector and the drive to minimize assembly stages, which concurrently reduces production costs and bolsters reliability. Industries such as automotive and medical technology are increasingly adopting these devices to achieve space optimization and functional integration. As evidence of the robust ecosystem supporting this field, the Research Association 3-D MID e.V. reported in 2024 that its specialized industrial network included 87 members, comprising various manufacturers and research institutes committed to furthering MID technology.

However, a major obstacle hindering broader market growth is the substantial upfront capital required for specialized injection molding tools and laser structuring machinery. This significant financial threshold often renders the technology economically impractical for low-volume production compared to conventional printed circuit board assemblies. Consequently, the adoption of MIDs is generally constrained to high-volume manufacturing environments where economies of scale can be effectively leveraged to offset the initial investment costs.

Market Driver

The surging growth of automotive electronics and electric vehicle architectures acts as a primary catalyst for the molded interconnect device market. Manufacturers are increasingly adopting this technology to embed circuits directly into structural parts, significantly lowering vehicle weight and removing the need for cumbersome cabling in tight interiors. This integration is vital for housing the intricate sensor arrays and control systems essential to modern electric mobility without sacrificing spatial efficiency. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales hit nearly 14 million in 2023, generating immense demand for these integrated assemblies. The industrial magnitude of this sector is further highlighted by LPKF Laser & Electronics SE, which reported a consolidated revenue of EUR 124.3 million for the 2024 fiscal year, reflecting the heavy capital investment in the necessary laser structuring systems.

Furthermore, the rapid rollout of 5G telecommunications infrastructure stimulates market growth by demanding antenna designs that standard printed circuit boards cannot support. Molded interconnects facilitate the creation of three-dimensional antenna structures directly on the internal shells of smartphones and base stations, enhancing signal quality across various frequencies without enlarging the device. This capability is crucial for handling the multiple-input multiple-output configurations required by next-generation networks while preserving the compact designs consumers expect. As noted in the 'Ericsson Mobility Report' from June 2024, global 5G subscriptions surged by 160 million in the first quarter of 2024 alone, totaling 1.7 billion, which places increasing pressure on component makers to supply these advanced connectivity solutions.

Market Challenge

A major impediment to the growth of the Molded Interconnect Device market is the substantial upfront investment needed for specialized manufacturing infrastructure. Companies are required to allocate significant capital for precision injection molding machinery and laser direct structuring tools before production can even begin. This heavy financial burden creates a high break-even point, making the technology economically inefficient for low-to-medium volume production runs. As a result, adoption is largely confined to mass-market industries such as automotive and medical electronics, thereby excluding smaller businesses and lower-volume applications that cannot justify the initial costs through economies of scale.

The capital-intensive nature of this technology is further demonstrated by the immense financial resources necessary for its development. According to the Research Association 3-D MID e.V., the cumulative funding for research projects managed by the association reached approximately 176 million euros in 2024. This level of investment highlights the high entry barriers and financial complexity associated with the sector, directly restricting the market's capacity to penetrate cost-sensitive areas where traditional printed circuit boards continue to be the more financially viable alternative.

Market Trends

The rise of bio-compatible interconnects is transforming the market for smart medical implants, propelled by the urgent requirement for miniaturization in patient-care devices. Manufacturers are increasingly utilizing molded interconnect devices to embed intricate circuitry directly into the casings of hearing aids, neuromodulation systems, and smart drug delivery units while maintaining biocompatibility. This strategy maximizes internal space and boosts device reliability by minimizing the number of distinct components needed within tightly constrained form factors. Underscoring the strong industrial momentum in this healthcare segment, Cicor Group reported in its 'Half Year Report 2025' from July 2025 that it achieved net sales of CHF 280.7 million, fueled by persistent demand in its core medical technology and industrial sectors.

Simultaneously, the advent of Additively Manufactured Electronics (AME) is revolutionizing rapid prototyping by eliminating the steep initial costs tied to conventional injection molding tooling. This manufacturing breakthrough permits engineers to print dielectric structures and conductive traces concurrently, allowing for the creation of complex 3D circuits in a matter of hours instead of weeks. By removing the financial hurdle of costly tooling for low-volume production, AME speeds up design iteration cycles and supports the agile development of tailored electronic components. Highlighting the swift commercial expansion of this digital production technology, Nano Dimension announced in September 2025 that its second-quarter revenue climbed to USD 25.8 million, marking a 72.4% increase compared to the same period the prior year.

Key Market Players

• Molex LLC
• TE Connectivity Ltd.
• Amphenol Corporation
• HARTING Technology Group
• KYOCERA AVX Components Corporation
• LPKF Laser & Electronics AG
• MID Solutions GmbH
• TEPROSA
• Taoglas
• RTP Company

Report Scope

In this report, the Global Molded Interconnect Device Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Molded Interconnect Device Market, By Process

• Laser Direct Structuring
• Two-Shot Molding

Molded Interconnect Device Market, By Application

• Automotive
• Consumer Products
• Healthcare
• Industrial
• Military & Aerospace
• Telecommunication
• Others

Molded Interconnect Device Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Molded Interconnect Device Market.

Available Customizations:

Global Molded Interconnect Device Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Molded Interconnect Device Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Process (Laser Direct Structuring, Two-Shot Molding)
  • 5.2.2. By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication, Others)
  • 5.2.3. By Region
  • 5.2.4. By Company (2025)
• 5.3. Market Map

6. North America Molded Interconnect Device Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Process
  • 6.2.2. By Application
  • 6.2.3. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Molded Interconnect Device Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Process
      • 6.3.1.2.2. By Application
  • 6.3.2. Canada Molded Interconnect Device Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Process
      • 6.3.2.2.2. By Application
  • 6.3.3. Mexico Molded Interconnect Device Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Process
      • 6.3.3.2.2. By Application

7. Europe Molded Interconnect Device Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Process
  • 7.2.2. By Application
  • 7.2.3. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Molded Interconnect Device Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Process
      • 7.3.1.2.2. By Application
  • 7.3.2. France Molded Interconnect Device Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Process
      • 7.3.2.2.2. By Application
  • 7.3.3. United Kingdom Molded Interconnect Device Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Process
      • 7.3.3.2.2. By Application
  • 7.3.4. Italy Molded Interconnect Device Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Process
      • 7.3.4.2.2. By Application
  • 7.3.5. Spain Molded Interconnect Device Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Process
      • 7.3.5.2.2. By Application

8. Asia Pacific Molded Interconnect Device Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Process
  • 8.2.2. By Application
  • 8.2.3. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Molded Interconnect Device Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Process
      • 8.3.1.2.2. By Application
  • 8.3.2. India Molded Interconnect Device Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Process
      • 8.3.2.2.2. By Application
  • 8.3.3. Japan Molded Interconnect Device Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Process
      • 8.3.3.2.2. By Application
  • 8.3.4. South Korea Molded Interconnect Device Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Process
      • 8.3.4.2.2. By Application
  • 8.3.5. Australia Molded Interconnect Device Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Process
      • 8.3.5.2.2. By Application

9. Middle East & Africa Molded Interconnect Device Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Process
  • 9.2.2. By Application
  • 9.2.3. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Molded Interconnect Device Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Process
      • 9.3.1.2.2. By Application
  • 9.3.2. UAE Molded Interconnect Device Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Process
      • 9.3.2.2.2. By Application
  • 9.3.3. South Africa Molded Interconnect Device Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Process
      • 9.3.3.2.2. By Application

10. South America Molded Interconnect Device Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Process
  • 10.2.2. By Application
  • 10.2.3. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Molded Interconnect Device Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Process
      • 10.3.1.2.2. By Application
  • 10.3.2. Colombia Molded Interconnect Device Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Process
      • 10.3.2.2.2. By Application
  • 10.3.3. Argentina Molded Interconnect Device Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Process
      • 10.3.3.2.2. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Molded Interconnect Device Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Molex LLC
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. TE Connectivity Ltd.
• 15.3. Amphenol Corporation
• 15.4. HARTING Technology Group
• 15.5. KYOCERA AVX Components Corporation
• 15.6. LPKF Laser & Electronics AG
• 15.7. MID Solutions GmbH
• 15.8. TEPROSA
• 15.9. Taoglas
• 15.10. RTP Company

16. Strategic Recommendations

17. About Us & Disclaimer