300mm 실리콘 웨이퍼 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the 300mm silicon wafer market size is projected to be 9.19 billion square inches in 2025, 9.71 billion square inches in 2026, and reach 12.97 billion square inches by 2031, growing at a 5.96% CAGR from 2026 to 2031.

This report is Segmented by Semiconductor Device Type (Logic, Memory, Analog, Discrete and Power, and More), Wafer Type (Prime Polished, Epitaxial, Silicon-On-Insulator (SOI), and Specialty Silicon), End-User Application (Consumer Electronics, Industrial, Telecommunications, Automotive, and More), and Geography. The Market Forecasts are Provided in Terms of Shipment Area (Billion Square Inches).

Global 300mm Silicon Wafer Market Trends and Insights

Rising Demand For Advanced Node Logic And Memory Devices

Volume ramps at 2-nanometer and high-bandwidth memory lines elevate wafer starts because each node shrink adds reticle layers and tighter defect budgets. TSMC aims for late-2026 volume on its 2 nm platform, consuming 15% more wafer area per chip than 3 nm equivalents. Micron's HBM4 capacity remains fully booked through 2026, while SK Hynix scales 12-high HBM3E stacks that require 50% extra wafer surface versus conventional. Samsung targets 21,000 wafer starts per month at 2 nm by end-2026, and Intel pursues 18A qualification for external customers in mid-2026. Multi-year substrate agreements now dominate procurement, boosting incumbents' pricing leverage over fabless designers.

Expansion Of Foundry Capacities In Asia-Pacific

TSMC has earmarked USD 165 billion across Taiwan, the United States, and Japan, adding roughly 1.2 million monthly 300 mm starts by 2029. Samsung plans KRW 300 trillion (USD 230 billion) for South Korean megafabs through 2030. SMIC's Beijing line seeks 100,000 starts monthly at mature nodes despite tool controls. Europe's Dresden joint venture, backed by EUR 10 billion (USD 11.3 billion), brings 40,000 starts a month beginning 2027. Wafer suppliers co-locate near these hubs, as shown by Siltronic's EUR 2 billion (USD 2.26 billion) Singapore plant. Rising lead times of up to 18 months for epitaxial blanks reinforce capacity pre-commitment.

Escalating Capital Expenditure For 300 mm Fabs

A sub-3 nm greenfield facility now exceeds USD 15 billion, driven by EUV tool sets priced at USD 150 million to USD 200 million apiece. TSMC's Arizona budget rose from USD 40 billion to higher levels because of U.S. labor rates and permitting delays. Intel's Ohio project may need USD 100 billion through 2030, while CHIPS Act subsidies cover only single-digit percentages of total outlays. High capital intensity confines new entry to state-backed or vertically integrated firms, embedding oligopolistic market structure. Should AI demand falter, underutilization risks amplify balance-sheet stress for operators.

Other drivers and restraints analyzed in the detailed report include:

1. Proliferation Of AI, HPC And Data-Center Investments
2. Adoption Of Backside Power Delivery And 3D IC Packaging
3. Supply Chain Vulnerabilities In Polysilicon And Equipment

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Logic devices controlled 43.76% of shipments in 2025, and this share climbs as 2 nm gate-all-around transistors reach mass production. The 300mm silicon wafer market size allocated to logic is projected to grow fastest because each shrink raises reticle count and wafer starts per finished die. High-bandwidth memory boosts memory's surface share but logic still commands supply contracts that span several years, insulating leading foundries from spot shortages.

Memory held about 35% of 2025 shipments, with HBM variants consuming more area due to vertical stacking. Analog and mixed-signal devices represent roughly 12%, migrating from 200 mm for yield and cost benefits, while discrete power semiconductors at 6% shift to 300 mm to serve electric vehicles. Niche optoelectronics and MEMS together remain below 4% but gain momentum in automotive lidar and biometric sensors. The 300mm silicon wafer market therefore pivots around logic intensity, but broader diversification ensures balanced capacity utilization.

Geography Analysis

Asia-Pacific retained 79.67% of shipments in 2025, anchored by Taiwan's 3 million monthly starts and South Korea's memory leadership. The 300mm silicon wafer market size centered in this region is slated for a 6.06% CAGR through 2031, thanks to competitive electricity rates, dense supplier clusters, and committed public incentives. China's mature-node expansions lift its participation despite ongoing export controls. Japan re-emerges through Kumamoto and Rapidus programs backed by JPY 2 trillion (USD 13.0 billion) incentives.

North America contributed nearly 10% in 2025, with CHIPS Act funding accelerating builds in Arizona, Ohio, and Idaho. However, labor and permitting hurdles slow realization relative to Asia. Europe held roughly 7%, and seeks 20% of global semiconductor output by 2030 via EUR 43 billion (USD 48.6 billion) public-private financingU. Higher energy costs and regulatory diversity remain execution challenges.

South America and the Middle East and Africa together captured less than 3% in 2025. While capital projects in Saudi Arabia and the United Arab Emirates hint at nascent interest, the lack of established supplier ecosystems constrains near-term volume. Consequently, any supply disruption in Asia-Pacific reverberates globally, underscoring persistent regional concentration within the 300mm silicon wafer market.

1. SUMCO Corporation
2. Shin-Etsu Chemical Co., Ltd.
3. GlobalWafers Co., Ltd.
4. Siltronic AG
5. SK Siltron Co., Ltd.
6. Okmetic Oyj
7. WaferWorks Corporation
8. RS Technologies Co., Ltd.
9. ESWIN Materials Co., Ltd.
10. Topsil Semiconductor Materials A/S
11. LONGi Silicon Materials Corp.
12. Gritek Solar Silicon Industry Co., Ltd.
13. Poshing Silicon Co., Ltd.
14. LX Semicon Co., Ltd.
15. Panzhihua Dingxin Electronic Silicon Co., Ltd.
16. Jiangsu Zhongneng Silicon Technology Development Co., Ltd.
17. PV Crystalox Silicon GmbH

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Demand for Advanced Node Logic and Memory Devices
  • 4.2.2 Expansion of Foundry Capacities in Asia-Pacific
  • 4.2.3 Proliferation of AI, HPC, and Data-Center Investments
  • 4.2.4 Adoption of Backside Power Delivery and 3D IC Packaging
  • 4.2.5 Government Subsidies for Domestic Wafer Supply Chains
  • 4.2.6 Heterogeneous Integration Accelerating 300 mm Wafer Utilization
• 4.3 Market Restraints
  • 4.3.1 Escalating Capital Expenditure for 300 mm Fabs
  • 4.3.2 Supply Chain Vulnerabilities in Polysilicon and Equipment
  • 4.3.3 Technical Barriers to Transition Beyond 300 mm Diameter
  • 4.3.4 Energy-Intensive Manufacturing Raising Sustainability Concerns
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (SHIPMENT IN AREA)

• 5.1 By Semiconductor Device Type
  • 5.1.1 Logic
  • 5.1.2 Memory
  • 5.1.3 Analog
  • 5.1.4 Discrete and Power
  • 5.1.5 Other Semiconductor Device Types (Optoelectronics, Sensors, Micro)
• 5.2 By Wafer Type
  • 5.2.1 Prime
  • 5.2.2 Polished
  • 5.2.3 Epitaxial
  • 5.2.4 Silicon-on-Insulator (SOI)
  • 5.2.5 Specialty Silicon (High-Resistivity, Power, Sensor-Grade)
• 5.3 By End-user Application
  • 5.3.1 Consumer Electronics
    • 5.3.1.1 Mobile and Smartphones
    • 5.3.1.2 PCs and Servers
  • 5.3.2 Industrial
  • 5.3.3 Telecommunications
  • 5.3.4 Automotive
  • 5.3.5 Other End-user Applications
• 5.4 By Geography
  • 5.4.1 North America
    • 5.4.1.1 United States
    • 5.4.1.2 Canada
    • 5.4.1.3 Mexico
  • 5.4.2 Europe
    • 5.4.2.1 Germany
    • 5.4.2.2 United Kingdom
    • 5.4.2.3 France
    • 5.4.2.4 Rest of Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 India
    • 5.4.3.4 South Korea
    • 5.4.3.5 Taiwan
    • 5.4.3.6 Rest of Asia-Pacific
  • 5.4.4 South America
  • 5.4.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 SUMCO Corporation
  • 6.4.2 Shin-Etsu Chemical Co., Ltd.
  • 6.4.3 GlobalWafers Co., Ltd.
  • 6.4.4 Siltronic AG
  • 6.4.5 SK Siltron Co., Ltd.
  • 6.4.6 Okmetic Oyj
  • 6.4.7 WaferWorks Corporation
  • 6.4.8 RS Technologies Co., Ltd.
  • 6.4.9 ESWIN Materials Co., Ltd.
  • 6.4.10 Topsil Semiconductor Materials A/S
  • 6.4.11 LONGi Silicon Materials Corp.
  • 6.4.12 Gritek Solar Silicon Industry Co., Ltd.
  • 6.4.13 Poshing Silicon Co., Ltd.
  • 6.4.14 LX Semicon Co., Ltd.
  • 6.4.15 Panzhihua Dingxin Electronic Silicon Co., Ltd.
  • 6.4.16 Jiangsu Zhongneng Silicon Technology Development Co., Ltd.
  • 6.4.17 PV Crystalox Silicon GmbH

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment