아시아태평양의 GPU 냉각 솔루션 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the asia-Pacific gPU cooling solutions market size is expected to grow from USD 5.39 billion in 2025 to USD 6.68 billion in 2026 and is forecast to reach USD 22.60 billion by 2031 at 27.59% CAGR over 2026-2031.

This report is Segmented by Cooling Technology (Air Cooling, Liquid Cooling (Direct-To-Chip), Immersion Cooling, and Hybrid Cooling), Cooling Level (Component-Level Cooling and Server / Rack-Level Cooling), Deployment (Hyperscale-Cloud, Enterprise, and Edge), GPU Power Density (Below 300W, 300W - 700W, and Above 700W), and Country. The Market Forecasts are Provided in Terms of Value (USD).

Asia-Pacific GPU Cooling Solutions Market Trends and Insights

Data-Center Energy Efficiency Mandates By Asia-Pacific Governments

The Asia-Pacific GPU cooling solutions market is also benefiting from policy frameworks that turn energy efficiency from a preference into a design requirement. China's green data center framework under GB/T 44989-2024 and related energy efficiency rules is tightening the operating envelope for large data facilities, especially those that support dense compute deployments. Japan's fiscal 2026 zero-emission data center commercialization program and its broader subsidy support for decarbonized facilities are reducing the payback period for advanced cooling investments. South Korea's AI Data Center Special Act, cleared in May 2026, signaled that sovereign AI infrastructure will move forward with faster procurement and more direct policy support for high-density facilities. In practical terms, these frameworks favor cooling systems that can support lower PUE targets in GPU-heavy halls where legacy air designs struggle. For the Asia-Pacific GPU cooling solutions market, this means regulatory compliance is now reinforcing the same technology shift that GPU power density has already set in motion.

Proliferation Of Liquid-Cooled High-Density Edge Micro-Data Centers

A second layer of demand is coming from compact AI facilities that sit outside the hyperscale model and closer to end-use workloads. Preferred Networks, Internet Initiative Japan, and JAIST brought AImod into operation in Japan with a direct liquid cooling design, a 7:3 water-to-air ratio, a design PUE of 1.1, and a WUE of 0, which makes it an important reference point for dense urban AI infrastructure. That type of architecture is relevant because many edge and modular sites cannot absorb the space, water, or mechanical plant footprint associated with larger conventional cooling systems. NHN Cloud's 7,656-GPU cluster in Seoul also showed that liquid cooling can support dense deployment while improving energy performance compared with conventional air-cooled setups. As inference workloads move closer to factories, telecom sites, transport nodes, and city-edge facilities, the need for compact liquid cooling becomes more visible across Japan, South Korea, Singapore, and selected Southeast Asian markets. The Asia-Pacific GPU cooling solutions market is therefore widening beyond hyperscale campuses, which gives rack-integrated cooling vendors and compact CDU suppliers a broader customer base.

Supply-Chain Volatility For Coolant Fluids

The second major restraint is the tight and changing supply chain for specialty cooling fluids used in immersion deployments. The draft highlighted that dielectric fluid sourcing remains concentrated and import-dependent across much of the Asia-Pacific, which exposes operators to lead-time risk and qualification delays when supply conditions tighten. Regulatory pressure on PFAS-linked chemistries and the exit of 3M's Novec line have added another layer of uncertainty for operators that need long-life fluid choices across multiple sites. In response, regional players have started to build local alternatives, including the May 2026 partnership between S-Oil and GST in South Korea to develop an immersion cooling solution around domestically linked fluid and equipment capabilities. That is a useful first step, but regional capacity is still early relative to the expected rise in AI cluster deployment. In the Asia-Pacific GPU cooling solutions market, this keeps direct-to-chip systems attractive because they avoid part of the fluid dependency that still slows broader immersion adoption.

Other drivers and restraints analyzed in the detailed report include:

1. Tax Incentives For Green IT Infrastructure In China And Japan
2. Rising GPU Thermal Design Power In AI Workloads
3. High Capital Expenditure Of Immersion Cooling Retrofits

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Air cooling held 49.15% of the Asia-Pacific GPU cooling solutions market size in 2025, which kept it as the largest cooling technology segment, while immersion cooling is projected to expand at a 24.12% CAGR through 2031. That position came from the region's large installed base of enterprise, public sector, and consumer GPU systems that were built around airflow-heavy thermal management and have not yet crossed the threshold for full liquid adoption. The Asia-Pacific GPU cooling solutions market still has meaningful air-cooled volume in gaming, workstation, and lower-density server environments, particularly where budgets or facility limitations delay major upgrades. At the same time, immersion cooling is the fastest-growing technology segment through 2031 because the newest AI hardware is pushing heat density beyond the comfortable operating range of traditional air designs.

Direct-to-chip liquid cooling is gaining ground as the most practical bridge between installed infrastructure and next-generation GPU power envelopes. It can often be introduced into existing server designs with less disruption than immersion, which makes it attractive for enterprise, colocation, and public sector buyers that need to support newer accelerators without rebuilding entire halls. Hybrid cooling is also gaining traction in dense urban deployments, especially where operators want liquid cooling for high-heat components and residual air support for the rest of the system. Japan's AImod facility is a useful signal because it showed how a water-air hybrid model can achieve strong efficiency results in a compact AI deployment. Across the Asia-Pacific GPU cooling solutions industry, the technology mix is shifting toward liquid-based designs, but the transition path still differs by facility age, workload intensity, and available capital.

Server-rack-level cooling accounted for 61.25% share of the Asia-Pacific GPU cooling solutions market size in 2025, and it is also the fastest-growing cooling level over the forecast period. That combination reflects a clear architectural change in AI data centers, where the rack is now treated as a unified thermal and power domain rather than a collection of separate components. The Asia-Pacific GPU cooling solutions market is moving in this direction because integrated GPU systems are now deployed in tightly linked clusters with shared coolant routing, common monitoring, and coordinated fail-safe controls. Rack-level cooling, therefore, carries more value in AI factories and sovereign compute sites than isolated component-level solutions.

Component-level cooling still matters in consumer gaming, workstation systems, and lower-scale professional environments where thermal management remains card-specific, and the deployment unit is much smaller. Vendors based in Taiwan and China continue to benefit from that volume base, especially in aftermarket and prosumer channels. Even so, the revenue mix is migrating upward toward rack-scale platforms because dense AI clusters now require thermal management that is coordinated across the whole system. NHN Cloud's liquid-cooled cluster in Seoul illustrated the operational case for this model, with rack-level management tied to pressure, flow, and temperature monitoring across a very large GPU environment. That shift gives rack-level vendors stronger pricing power and keeps R&D focused on distribution units, manifold systems, and coordinated rack cooling controls.

List of Companies Covered in this Report:

1. Cooler Master Technology Inc.
2. Deepcool Industries Co., Ltd.
3. Asetek A/S
4. Noctua GmbH
5. EKWB d.o.o.
6. Alphacool International GmbH
7. Thermaltake Technology Co., Ltd.
8. Corsair Gaming Inc.
9. Gigabyte Technology Co., Ltd.
10. Micro-Star International Co., Ltd.
11. ASUSTeK Computer Inc.
12. ZALMAN Tech Co., Ltd.
13. Arctic GmbH
14. NZXT, Inc.
15. Phanteks B.V.
16. SilverStone Technology Co., Ltd.
17. Aquacomputer GmbH and Co. KG
18. Bykski Technology Co., Ltd.
19. Bitspower International Co., Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising GPU Thermal Design Power in AI Workloads
  • 4.2.2 Data-Center Energy Efficiency Mandates by Asia-Pacific Governments
  • 4.2.3 Proliferation of Liquid-Cooled High-Density Edge Micro-Data Centers
  • 4.2.4 Tax Incentives for Green IT Infrastructure in China and Japan
  • 4.2.5 Vertical Integration of Hyperscalers into Direct-to-Chip Cooling Hardware
  • 4.2.6 Emergence of Immersion-Ready GPU Reference Designs from Semiconductor OEMs
• 4.3 Market Restraints
  • 4.3.1 High Capital Expenditure of Immersion Cooling Retrofits
  • 4.3.2 Supply-Chain Volatility for Coolant Fluids
  • 4.3.3 Limited Skilled Workforce for Liquid Loop Commissioning
  • 4.3.4 Lack of Common Open Standards Across Cooling Technologies
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Suppliers
  • 4.7.3 Bargaining Power of Buyers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Competitive Rivalry
• 4.8 Impact of Macroeconomic Factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Cooling Technology
  • 5.1.1 Air Cooling
  • 5.1.2 Liquid Cooling (Direct-to-Chip)
  • 5.1.3 Immersion Cooling
  • 5.1.4 Hybrid Cooling
• 5.2 By Cooling Level
  • 5.2.1 Component-Level Cooling
  • 5.2.2 Server / Rack-Level Cooling
• 5.3 By Deployment
  • 5.3.1 Hyperscale / Cloud
  • 5.3.2 Enterprise
  • 5.3.3 Government and Research (HPC)
  • 5.3.4 Edge
• 5.4 By GPU Power Density
  • 5.4.1 Below 300W
  • 5.4.2 300W - 700W
  • 5.4.3 Above 700W
• 5.5 By Country
  • 5.5.1 China
  • 5.5.2 Japan
  • 5.5.3 South Korea
  • 5.5.4 India
  • 5.5.5 Southeast Asia
  • 5.5.6 Rest of Asia-Pacific

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Cooler Master Technology Inc.
  • 6.4.2 Deepcool Industries Co., Ltd.
  • 6.4.3 Asetek A/S
  • 6.4.4 Noctua GmbH
  • 6.4.5 EKWB d.o.o.
  • 6.4.6 Alphacool International GmbH
  • 6.4.7 Thermaltake Technology Co., Ltd.
  • 6.4.8 Corsair Gaming Inc.
  • 6.4.9 Gigabyte Technology Co., Ltd.
  • 6.4.10 Micro-Star International Co., Ltd.
  • 6.4.11 ASUSTeK Computer Inc.
  • 6.4.12 ZALMAN Tech Co., Ltd.
  • 6.4.13 Arctic GmbH
  • 6.4.14 NZXT, Inc.
  • 6.4.15 Phanteks B.V.
  • 6.4.16 SilverStone Technology Co., Ltd.
  • 6.4.17 Aquacomputer GmbH and Co. KG
  • 6.4.18 Bykski Technology Co., Ltd.
  • 6.4.19 Bitspower International Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment