북미의 GPU 냉각 솔루션 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the north america gPU cooling solutions market size is projected to expand from USD 2.25 billion in 2025 and USD 2.70 billion in 2026 to USD 7.80 billion by 2031, registering a CAGR of 23.59% between 2026 to 2031.

This report is Segmented by Cooling Technology (Air Cooling, Liquid Cooling (Direct-To-Chip), Immersion Cooling, and Hybrid Cooling), Cooling Level (Component-Level Cooling and Server / Rack-Level Cooling), Deployment (Hyperscale-Cloud, Edge, and More), GPU Power Density (Below 300W, 300W - 700W, and Above 700W), and Country. The Market Forecasts are Provided in Terms of Value (USD).

North America GPU Cooling Solutions Market Trends and Insights

Surge In GPU Workloads For Generative AI And Large Language Models

The strongest demand trigger in the North America GPU cooling solutions market is the move from traditional cloud workloads to AI factory deployments built around high-density accelerators. NVIDIA Blackwell Ultra raises thermal design power to around 2,000 W per GPU, compared with around 700 W for the earlier A100 generation, which pushes many legacy air-cooled layouts beyond their practical operating range. That shift matters because operators are no longer cooling short training bursts alone; they are preparing for sustained inference activity that keeps thermal stress high for far longer periods. A 2025 study on H100 systems found that liquid-cooled nodes delivered around 17% higher TFLOPS per GPU under sustained load than comparable air-cooled systems, which shows that thermal design is now tied directly to usable compute output. In the North America GPU cooling solutions market, cooling decisions are increasingly being made alongside GPU procurement because thermal architecture now affects throughput, reliability, and power efficiency at the same time.

Growing Adoption Of Liquid Cooling To Reduce Data Center PUE

Liquid cooling has moved from an efficiency upgrade to a design requirement for facilities that intend to support current AI platforms at commercial scale. NVIDIA stated in 2025 that its Blackwell platform can improve water efficiency by more than 300x in liquid-cooled deployments, which reinforces why operators are treating liquid systems as part of core infrastructure planning rather than optional optimization. Vertiv also reported that its reference architecture for the NVIDIA GB300 NVL72 platform reduced annual energy consumption by 25% and lowered the power footprint by 30%, which gives buyers a clearer operating case for large-scale deployment. These gains are changing colocation economics because facilities that can prove lower power overhead and better thermal control are better positioned in hyperscaler and enterprise procurement cycles. The North America GPU cooling solutions market is therefore being pulled forward by the combined effect of denser racks, tighter energy targets, and buyer preference for cooling systems that improve both uptime and facility efficiency.

High Upfront Capex For Immersion Cooling Retrofits

Immersion cooling still faces a clear adoption barrier in retrofit settings because older halls were not built for the floor loading, piping layout, and service model these systems demand. That challenge is most visible in enterprise and colocation sites where operators need to add AI capacity without shutting down the broader facility. A loaded immersion configuration can also require structural reinforcement, which pushes the retrofit decision closer to a major building project rather than a simple equipment swap. This is why the North America GPU cooling solutions market shows faster immersion uptake in greenfield hyperscale builds than in legacy enterprise environments. Direct-to-chip systems often become the preferred first step because they offer a lower-disruption path into liquid cooling while still supporting higher GPU density.

Other drivers and restraints analyzed in the detailed report include:

1. Increased Preference For Modular, Scalable Cooling Architectures
2. Advances In Heat Pipe And Vapor Chamber Technologies
3. Supply Chain Volatility In Coolant Fluids And Pump Components

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Air cooling retained a 47.90% share of the North America GPU cooling solutions market size in 2025, supported by the large installed base of enterprise and colocation facilities that were not originally designed for liquid infrastructure. That position reflects existing capacity more than new design preference, because the North America GPU cooling solutions market is now being built around far denser GPU clusters than earlier halls could support. Once racks move into current high-density AI configurations, the physical limit of air cooling becomes much harder to manage without large power and space penalties. This is why most new hyperscale AI deployments now start with liquid-ready or fully liquid-cooled plans instead of treating liquid systems as a later upgrade.

Direct-to-chip liquid cooling has consolidated its position as the main deployment path for current high-density GPU systems because it balances thermal performance with manageable facility change. Product launches across the vendor base show that supply-side readiness has moved well beyond pilot status in the North America GPU cooling solutions market. Vertiv published a validated reference architecture for the NVIDIA GB300 NVL72 platform in 2025, and Supermicro expanded its liquid-cooled portfolio around NVIDIA Blackwell systems, which together point to a clear commercial shift toward liquid-first infrastructure. Immersion cooling is still the fastest-growing at 24.12% technology category because frontier AI clusters are moving beyond 100 kW per rack and need more aggressive heat removal strategies. Hybrid designs also remain relevant in the North America GPU cooling solutions industry because many operators must support mixed GPU generations and varied thermal profiles within the same hall.

Server and rack-level cooling held 59.35% of the North America GPU cooling solutions market share in 2025 and is also the fastest-growing cooling level through 2031. That dual position shows how buyers now treat the rack, rather than the individual component, as the main thermal and procurement unit for AI infrastructure. The North America GPU cooling solutions market is reinforcing this shift because GPU packages, memory, and interconnects are being designed as one tightly linked thermal zone. DCX reflected that direction in January 2026 when it introduced its 8 MW Facility Distribution Unit for warm-water cooling in next-generation NVIDIA deployments, replacing multiple smaller legacy CDUs with a centralized design.

Component-level cooling still matters because each server node needs tighter thermal control as power density rises inside standard footprints. In March 2026, ZutaCore said its OmniTherm cold plate enabled waterless two-phase cooling for NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs in a single-slot PCIe form factor, which shows that precision cooling remains a commercial differentiator. Accelsius added to that trend in May 2026 with the NeuCool IR150, a rack-level solution that combines a two-phase CDU, 42U of rack space, and integrated manifolds in a single enclosure supporting up to 150 kW. The boundary between component and rack-level cooling is therefore becoming less rigid because suppliers increasingly package both functions into one deployable system. This is one of the clearer signs that the North America GPU cooling solutions industry is moving toward integrated thermal platforms rather than isolated cooling parts.

List of Companies Covered in this Report:

1. NVIDIA Corporation
2. Advanced Micro Devices, Inc.
3. Intel Corporation
4. Super Micro Computer, Inc.
5. Cisco Systems, Inc.
6. Dell Technologies Inc.
7. Hewlett Packard Enterprise Company
8. Lenovo Group Limited
9. ASUSTeK Computer Inc.
10. Giga-Byte Technology Co., Ltd.
11. Cooler Master Technology Inc.
12. EKWB d.o.o.
13. Noctua GmbH
14. Arctic GmbH
15. Asetek A/S
16. Fujitsu Limited
17. ZutaCore, Inc.
18. Vertiv Holdings Co.
19. Rittal GmbH and Co. KG
20. Schneider Electric SE

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surge in GPU Workloads for Generative AI and Large Language Models
  • 4.2.2 Growing Adoption of Liquid Cooling to Reduce Data Center PUE
  • 4.2.3 Increased Preference for Modular, Scalable Cooling Architectures
  • 4.2.4 Advances in Heat Pipe and Vapor Chamber Technologies
  • 4.2.5 Data Center Sustainability Mandates and Carbon-Neutral Targets
  • 4.2.6 Government Incentives for Edge Data Centers in Rural Areas
• 4.3 Market Restraints
  • 4.3.1 High Upfront Capex for Immersion Cooling Retrofits
  • 4.3.2 Supply Chain Volatility in Coolant Fluids and Pump Components
  • 4.3.3 Skill Gap in Designing and Maintaining Liquid-Cooled Racks
  • 4.3.4 Reliability Concerns Around Dielectric Fluid Contamination
• 4.4 Impact of Macroeconomic Factors on the Market
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Cooling Technology
  • 5.1.1 Air Cooling
  • 5.1.2 Liquid Cooling (Direct-to-Chip)
  • 5.1.3 Immersion Cooling
  • 5.1.4 Hybrid Cooling
• 5.2 By Cooling Level
  • 5.2.1 Component-Level Cooling
  • 5.2.2 Server / Rack-Level Cooling
• 5.3 By Deployment
  • 5.3.1 Hyperscale / Cloud
  • 5.3.2 Enterprise
  • 5.3.3 Government and Research (HPC)
  • 5.3.4 Edge
• 5.4 By GPU Power Density
  • 5.4.1 Below 300W
  • 5.4.2 300W - 700W
  • 5.4.3 Above 700W
• 5.5 By Country
  • 5.5.1 United States
  • 5.5.2 Canada
  • 5.5.3 Mexico

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 NVIDIA Corporation
  • 6.4.2 Advanced Micro Devices, Inc.
  • 6.4.3 Intel Corporation
  • 6.4.4 Super Micro Computer, Inc.
  • 6.4.5 Cisco Systems, Inc.
  • 6.4.6 Dell Technologies Inc.
  • 6.4.7 Hewlett Packard Enterprise Company
  • 6.4.8 Lenovo Group Limited
  • 6.4.9 ASUSTeK Computer Inc.
  • 6.4.10 Giga-Byte Technology Co., Ltd.
  • 6.4.11 Cooler Master Technology Inc.
  • 6.4.12 EKWB d.o.o.
  • 6.4.13 Noctua GmbH
  • 6.4.14 Arctic GmbH
  • 6.4.15 Asetek A/S
  • 6.4.16 Fujitsu Limited
  • 6.4.17 ZutaCore, Inc.
  • 6.4.18 Vertiv Holdings Co.
  • 6.4.19 Rittal GmbH and Co. KG
  • 6.4.20 Schneider Electric SE

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment