성형 회로 부품(MID) 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the molded interconnect device market size is projected to expand from USD 2.17 billion in 2025 and USD 2.44 billion in 2026 to USD 4.37 billion by 2031, registering a CAGR of 12.32% between 2026 and 2031.

This report is Segmented by Process (Laser Direct Structuring, and More), Product Type (Antenna and Connectivity Modules, and More), End-Use Industry (Automotive, Consumer Electronics and Wearables, and More), Material (Liquid-Crystal Polymer, Polybutylene Terephthalate, and More), and Geography (North America, South America, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global Molded Interconnect Device Market Trends and Insights

Automotive shift to zonal E/E architecture driving 3-D antenna MID demand

Automakers are consolidating dozens of electronic control units into regional gateways, cutting vehicle wiring mass up to 40 %. Three-dimensional molded interconnect devices integrate GPS, cellular, and vehicle-to-everything antennas onto a single liquid-crystal-polymer carrier, eliminating coax cables and improving electromagnetic isolation between bands. Zonal architectures also shorten harness lengths, allowing antenna modules to mount behind the roof liner where ambient temperatures reach 125 °C for 15 years, a condition matched by molded interconnect devices that combine mechanical and radio-frequency functions in one injection-molded part. Continental, Volkswagen, and BMW programs now specify molded interconnect devices as standard, accelerating global pull-through.

Rapid adoption of LDS processing in 5 G smartphones

Smartphone OEMs increasingly employ laser direct structuring to place millimeter-wave antenna arrays on curved housings without rigid-flex or adhesive layers. A neodymium-doped laser activates copper-seed particles within liquid-crystal polymer, after which electroless plating forms lines with insertion loss below 0.5 dB/cm at 28 GHz. The method shaves USD 1.20-1.80 from the bill-of-materials and allows a single antenna to double as a structural rib, critical as flagship phones retail below USD 600 in India and Southeast Asia. China, South Korea, and Taiwan dominate short-term growth while Europe follows with foldable designs that need conformal radiators.

High Tooling Cost for Multi-Shot Moulds

Family molds with rotating cores and sequential gates cost USD 50,000-150,000 and require 6-12 weeks lead time. At volumes below 10,000 parts annually, amortization adds USD 4.00-6.00 per unit, rendering molded interconnect devices uncompetitive versus hand-assembled rigid-flex circuits in aerospace and specialty medical runs. Western labor rates, often USD 75-120 per hour for mold finishing, magnify near-term adoption hurdles.

Other drivers and restraints analyzed in the detailed report include:

1. Miniaturization requirements in hearing aids and implantables
2. EV-Battery Pack Sensors Needing 150 °C Plastics
3. Limited Global Capacity for LDS Polymer Compounds

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Laser direct structuring commanded 47.21% of the 2025 revenue, underscoring its critical role in antenna miniaturization across smartphones and cars. This technology enables precise and efficient designs, meeting the growing demand for compact and high-performance devices. Two-shot molding fills niches requiring dissimilar resins and environmental sealing, offering versatility for various applications. Meanwhile, film-insert methods are gaining traction for decorative interior panels, particularly in the automotive and consumer electronics industries. Additive aerosol-jet and inkjet printing promise sub-10 µm lines without plating, presenting opportunities for intricate designs, although throughput currently lags behind mass-production benchmarks.

The molded interconnect device market continues to invest in LDS beam-steering and automated optical inspection upgrades, which have significantly improved first-pass yield to beyond 95%. These advancements enhance production efficiency and reduce waste. Meanwhile, additive approaches are increasingly attracting wearables and aerospace prototypes, where rapid iteration and customization outweigh unit cost concerns. As printhead speeds improve, these emerging technologies are expected to capture double-digit market share in molded interconnect devices by the late forecast window, reflecting their growing importance in the market.

Antenna and connectivity modules generated 41.37% of the 2025 revenue, reflecting the high demand driven by mobile devices and telematics applications. Structural electronics panels, although currently a smaller segment, are projected to grow at a compound annual growth rate (CAGR) of 12.96%. This growth is fueled by the increasing adoption of capacitive smart surfaces, which are replacing traditional mechanical buttons, reducing wire counts, and enabling the development of curved console designs.

Lighting components are leveraging molded interconnect devices to integrate LED arrays, optics, and heat sinks into single polycarbonate carriers. This integration has significantly reduced assembly times by more than 50%, making it a preferred choice for manufacturers. Sensors and switches continue to hold a substantial market share, particularly in applications such as tire-pressure monitoring systems, inertial measurement units, and brushless motor commutation. Molded interconnect devices in these applications provide robust shielding for delicate electronics, protecting them from electromagnetic interference and moisture, thereby enhancing their reliability and lifespan.

Geography Analysis

Asia-Pacific accounted for 38.92% of 2025 revenue, driven by China's USD 27.95 billion printed-circuit-board base and its dense network of smartphone assemblers. Japan contributed USD 11.53 billion in 2024 board revenue, with flexible substrates at 51.3%, and companies such as Ibiden applying molded interconnect devices in radar modules. South Korea followed with USD 7.86 billion in 2024 board output as Samsung Electro-Mechanics expanded its multi-layer HDI lines.

South America is the fastest-growing region, projected to grow at a 13.06% CAGR, thanks to Mexico's USD 766.45 million fourth-quarter 2025 investment in electrical-component plants that meet USMCA local-content mandates. Suppliers face a USD 2.5 billion retooling bill to upgrade from combustion-engine parts to electric-vehicle electronics, nudging regional uptake of LDS and two-shot molding cells.

North America and Europe each controlled roughly one-fifth of 2025 revenue, anchored by medical-device contract manufacturing and aerospace sensor modules that require ISO 13485 and AS9100 certification. Germany's labor-intensive mold finishing pushes tooling 40-50 % above Asia, yet functional-safety standards accelerate internal LDS line additions. The Middle East and Africa remain nascent, gravitating toward telecom and downhole sensors where long service life offsets higher polymer costs.

1. Molex LLC
2. TE Connectivity Ltd.
3. HARTING Technology Group
4. LPKF Laser & Electronics SE
5. TactoTek Oy
6. 2E mechatronic GmbH & Co. KG
7. Phillips-Medisize LLC
8. Omnetics Connector Corporation
9. iwis mechatronics GmbH
10. Cicor Group AG
11. Carclo Technical Plastics (division of Carclo plc)
12. SelectConnect Technologies LLC
13. Moulded Circuits Ltd.
14. Beta LAYOUT GmbH
15. Amphenol ICC (Amphe-Power) Division
16. Linxens Holding SAS
17. Zhejiang Zhaoyi Technology Co., Ltd.
18. Tritone Technologies Ltd.
19. Metalis Group SA
20. Advanced Interconnections Corp.
21. MacDermid Alpha Electronics Solutions
22. Murata Manufacturing Co., Ltd.
23. Sumitomo Electric Industries, Ltd.
24. Panasonic Holdings Corporation
25. HELLA GmbH & Co. KGaA

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Automotive Shift to Zonal E/E Architecture Driving 3-D Antenna MID Demand
  • 4.2.2 Rapid Adoption of LDS Processing in 5G Smartphones
  • 4.2.3 Miniaturisation Requirements in Hearing Aids and Implantables
  • 4.2.4 EV-Battery Pack Sensors Needing 150 °C Plastics
  • 4.2.5 Next-Gen Smart-Surface HMIs in Premium Vehicles
  • 4.2.6 Antenna-in-Package Integration for LEO Satellite User-Terminals
• 4.3 Market Restraints
  • 4.3.1 High Tooling Cost for Multi-Shot Moulds
  • 4.3.2 Limited Global Capacity for LDS Polymer Compounds
  • 4.3.3 Silver Price Volatility Impacting Metallisation Chemistries
  • 4.3.4 Reliability Gaps Above 180 °C for Aerospace Cabin Sensors
• 4.4 Industry Value-Chain Analysis
• 4.5 Technological Outlook
• 4.6 Regulatory Landscape
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Supplier Power
  • 4.8.3 Buyer Power
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Process
  • 5.1.1 Laser Direct Structuring (LDS)
  • 5.1.2 Two-Shot Injection Moulding
  • 5.1.3 Two-Component (2K) Selective Metallisation
  • 5.1.4 Film-Insert, In-Mould Electronics
  • 5.1.5 Additive and Other Emerging Processes
• 5.2 By Product Type
  • 5.2.1 Antenna and Connectivity Modules
  • 5.2.2 Sensors and Switches
  • 5.2.3 Lighting Components
  • 5.2.4 Structural Electronics Panels
  • 5.2.5 Other Product Type
• 5.3 By End-Use Industry
  • 5.3.1 Automotive
  • 5.3.2 Consumer Electronics and Wearables
  • 5.3.3 Healthcare and Medical Devices
  • 5.3.4 Industrial Automation
  • 5.3.5 Telecommunications Infrastructure
  • 5.3.6 Aerospace and Defence
  • 5.3.7 Other End-Use Industry
• 5.4 By Material
  • 5.4.1 Liquid-Crystal Polymer (LCP)
  • 5.4.2 Polybutylene Terephthalate (PBT)
  • 5.4.3 Polyamide (PA 6/6T)
  • 5.4.4 Polycarbonate (PC) and Blends
  • 5.4.5 Polyether Ether Ketone (PEEK)
  • 5.4.6 Other Material
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Russia
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 India
    • 5.5.3.4 South Korea
    • 5.5.3.5 Australia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Molex LLC
  • 6.4.2 TE Connectivity Ltd.
  • 6.4.3 HARTING Technology Group
  • 6.4.4 LPKF Laser & Electronics SE
  • 6.4.5 TactoTek Oy
  • 6.4.6 2E mechatronic GmbH & Co. KG
  • 6.4.7 Phillips-Medisize LLC
  • 6.4.8 Omnetics Connector Corporation
  • 6.4.9 iwis mechatronics GmbH
  • 6.4.10 Cicor Group AG
  • 6.4.11 Carclo Technical Plastics (division of Carclo plc)
  • 6.4.12 SelectConnect Technologies LLC
  • 6.4.13 Moulded Circuits Ltd.
  • 6.4.14 Beta LAYOUT GmbH
  • 6.4.15 Amphenol ICC (Amphe-Power) Division
  • 6.4.16 Linxens Holding SAS
  • 6.4.17 Zhejiang Zhaoyi Technology Co., Ltd.
  • 6.4.18 Tritone Technologies Ltd.
  • 6.4.19 Metalis Group SA
  • 6.4.20 Advanced Interconnections Corp.
  • 6.4.21 MacDermid Alpha Electronics Solutions
  • 6.4.22 Murata Manufacturing Co., Ltd.
  • 6.4.23 Sumitomo Electric Industries, Ltd.
  • 6.4.24 Panasonic Holdings Corporation
  • 6.4.25 HELLA GmbH & Co. KGaA

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment