아시아태평양의 백색 LED 패키지 시장 : 시장 점유율 분석, 산업 동향 및 통계 데이터, 성장 예측(2026-2031년)

According to Mordor Intelligence, the asia-Pacific white LED package market size is expected to grow from USD 5.01 billion in 2025 to USD 5.21 billion in 2026 and is forecast to reach USD 6.62 billion by 2031 at a 4.9% CAGR over 2026-2031.

This report is Segmented by Package Architecture (SMD, COB, CSP, and Flip-Chip LED Packages), Power Class (Low Power, Mid Power, and High Power), Application (General Lighting, Automotive Lighting, Display and Backlighting, and Specialty), and Country (China, Japan, India, Southeast Asia, and the Rest of Asia-Pacific). The Market Forecasts are Provided in Terms of Value (USD).

Asia-Pacific White LED Package Market Trends and Insights

Surging Mini And Micro-LED Backlighting Demand In Smart TVs

Premium television brands introduced RGB mini-LED sets at the January 2026 Consumer Electronics Show, demonstrating zone counts as high as 43,000 and peak brightness above 4,000 nits. Eliminating quantum-dot films trims the bill of materials by 15% once die yields stabilize, redirecting savings toward higher-value chip-scale packages. Guangdong and Jiangsu panel assemblers are installing placement tools with sub-5 µm accuracy to manage the tighter pitch, favoring LED suppliers that co-locate back-end assembly within 50 km of module plants. As sub-100 µm die enters volume production, the Asia-Pacific white LED package market migrates from commodity SMD to high-power wafer-level CSP capable of dissipating 3 W mm-2. The trend lifts luminance requirements, driving upstream demand for advanced phosphor blends that maintain color-point stability at elevated current densities.

Aggressive SSL Incentive Programs Across Southeast Asia

Thailand extended double corporate-tax deductions for LED retrofits through 2028, Indonesia preserved its 30% national energy-savings target, and Vietnam plans an Asian Development Bank-backed efficiency framework. These incentives compress lighting payback periods to below 18 months, catalyzing public-sector procurement that prioritizes efficacy over color rendering or lifetime. As municipal buyers standardize on 100 lm/W thresholds, mid-power SMD suppliers face accelerated commoditization. The Asia-Pacific white LED package market therefore sees a volume swell in entry-level devices even as value pools migrate to premium automotive and display niches. Policy momentum is strongest in the commercial high-bay and roadway categories, locking in a multi-year demand base for 2835- and 3030-footprint footprints fabricated in Thai and Vietnamese export-processing zones.

Persistent IP Litigation Over Flip-Chip Architectures

Everlight Electronics lodged patent claims against Lumileds and Seoul Semiconductor in February 2026, citing infringement of U.S. Patent 7,554,126 covering direct-bond flip-chip methods. Injunction risk and escalating legal expenses deter tier-two assemblers from investing in flip-chip tooling, consolidating capacity among vertically integrated giants. OEMs now negotiate indemnification clauses that add 3-5% to contract prices, tempering adoption velocity even where thermal benefits are clear. The Asia-Pacific white LED package market thus experiences a short-term drag on high-power CSP penetration, although incumbent suppliers leverage the dispute to justify premium pricing on authenticated packages.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Build-Out Of EV Charging-Station Lighting Networks
2. Cost Downsizing Via Wafer-Level CSP Adoption
3. Thermal Management Challenges Above 3 W Power Class

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Surface-mount device packages captured 58.48% of the Asia-Pacific white LED package market share in 2025, reflecting entrenched adoption in retrofit bulbs and tubes. Wafer-level CSP formats are expanding at a 5.49% CAGR and, by 2031, are expected to shoulder a sizeable portion of automotive headlamp and premium display orders. The Asia-Pacific white LED package market size tied to CSP technology is projected to rise steadily as OEMs seek smaller footprints, higher drive currents, and lower thermal resistance. Margin pressure, however, remains acute in SMD lines where Shenzhen and Dongguan contract factories quote assembly at USD 0.02 per device, undercutting legacy brands by 40%.

High-bay and stadium operators still favor chip-on-board arrays for punchy lumen outputs, while flip-chip packages dominate premium automotive daytime running lamps despite pending litigation. Over the forecast horizon, economics favor CSP lines once monthly volumes top 10 million units, pulling SMD incumbents into retrofit niches or prompting technology upgrades. Suppliers with fan-out expertise gain leverage as television panel makers compress product cycles and demand co-located assembly to meet just-in-time inventory goals. Consequently, the Asia-Pacific white LED package market aligns capital spending with wafer-level processes that promise both cost and performance advantages.

List of Companies Covered in this Report:

1. Nichia Corporation
2. Samsung Electronics Co. Ltd. (Samsung LED)
3. Seoul Semiconductor Co. Ltd.
4. Everlight Electronics Co. Ltd.
5. Lumileds Holding B.V.
6. Hongli Zhihui Group Co. Ltd.
7. LG Innotek Co. Ltd.
8. San'an Optoelectronics Co. Ltd.
9. NationStar Optoelectronics Co. Ltd.
10. CreeLED, Inc.
11. Refond Optoelectronics Co. Ltd.
12. Osram GmbH (ams-Osram)
13. Edison Opto Corporation
14. Dominant Opto Technologies Sdn. Bhd.
15. Lextar Electronics Corporation
16. Toyoda Gosei Co. Ltd.
17. Sharp Corporation
18. Rohm Semiconductor
19. MLS Co. Ltd. (Forest Lighting)
20. Shenzhen Jufei Optoelectronics Co. Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surging Mini- and Micro-LED Backlighting Demand in Smart TVs
  • 4.2.2 Aggressive SSL Incentive Programs Across Southeast Asia
  • 4.2.3 Rapid Build-out of EV Charging-Station Lighting Networks
  • 4.2.4 Cost Downsizing via Wafer-Level CSP Adoption
  • 4.2.5 Proliferation of UV-Free Health-Oriented Lighting in Japan
  • 4.2.6 Mandatory Energy-Efficiency Labelling in India and China
• 4.3 Market Restraints
  • 4.3.1 Persistent IP Litigation Over Flip-Chip Architectures
  • 4.3.2 Thermal Management Challenges Above 3 W Power Class
  • 4.3.3 Supply Tightness of High CRI Phosphors
  • 4.3.4 Rising Mini-LED Die Cost Due to Sapphire Substrate Inflation
• 4.4 Industry Supply-Chain Analysis
• 4.5 Technological Outlook
• 4.6 Regulatory Landscape
• 4.7 Impact of Macroeconomic Factors
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Package Architecture
  • 5.1.1 SMD (Surface Mount Device)
  • 5.1.2 COB (Chip-on-Board)
  • 5.1.3 CSP (Chip Scale Package)
  • 5.1.4 Flip-Chip LED Packages
• 5.2 By Power Class
  • 5.2.1 Low Power (Less than 0.5 W)
  • 5.2.2 Mid Power (0.5 -1 W)
  • 5.2.3 High Power (More than 1 W)
• 5.3 By Application
  • 5.3.1 General Lighting
  • 5.3.2 Automotive Lighting
  • 5.3.3 Display and Backlighting
  • 5.3.4 Specialty / Niche
• 5.4 By Country
  • 5.4.1 China
  • 5.4.2 Japan
  • 5.4.3 India
  • 5.4.4 Southeast Asia
  • 5.4.5 Rest of Asia-Pacific

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Nichia Corporation
  • 6.4.2 Samsung Electronics Co. Ltd. (Samsung LED)
  • 6.4.3 Seoul Semiconductor Co. Ltd.
  • 6.4.4 Everlight Electronics Co. Ltd.
  • 6.4.5 Lumileds Holding B.V.
  • 6.4.6 Hongli Zhihui Group Co. Ltd.
  • 6.4.7 LG Innotek Co. Ltd.
  • 6.4.8 San'an Optoelectronics Co. Ltd.
  • 6.4.9 NationStar Optoelectronics Co. Ltd.
  • 6.4.10 CreeLED, Inc.
  • 6.4.11 Refond Optoelectronics Co. Ltd.
  • 6.4.12 Osram GmbH (ams-Osram)
  • 6.4.13 Edison Opto Corporation
  • 6.4.14 Dominant Opto Technologies Sdn. Bhd.
  • 6.4.15 Lextar Electronics Corporation
  • 6.4.16 Toyoda Gosei Co. Ltd.
  • 6.4.17 Sharp Corporation
  • 6.4.18 Rohm Semiconductor
  • 6.4.19 MLS Co. Ltd. (Forest Lighting)
  • 6.4.20 Shenzhen Jufei Optoelectronics Co. Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment