동남아시아의 NOR 플래시 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the south east asia NOR flash market size is expected to grow from USD 90.82 million in 2025 to USD 96.28 million in 2026 and is forecast to reach USD 128.90 million by 2031 at 6.01% CAGR over 2026-2031.

This report is Segmented by NOR Flash Type (Serial, and Parallel), Interface (SPI Single/Dual, and More), Density (2 Megabit and Less, and More), Voltage (3V Class, 1. 8V, and More), End-User Application (Communication, and More), Process Technology Node (65 Nm, 45 Nm, and More), and Packaging Type (WLCSP/CSP, and More). The Market Forecasts are Provided in Terms of Value (USD) and Volume (Units).

South East Asia NOR Flash Market Trends and Insights

Government-Led Incentives Driving Expansion In Electronics Manufacturing

Government policy has become one of the clearest near-term demand supports for the Southeast Asia NOR Flash Memory market because incentive programs are drawing more assembly, packaging, and electronics manufacturing projects into the region. Vietnam's Circular 33/2025/TT-BKHCN set four eligibility criteria for tax relief for electronics manufacturers, including the use of Vietnam-designed or manufactured semiconductors and at least 30% domestic supply-chain participation, which encourages more localized component sourcing around chip-based products. The Johor-Singapore Special Economic Zone launched in January 2025 and offers a 5% corporate tax rate for qualifying electronics and semiconductor operations for up to 15 years, which improves the case for suppliers that want to stay close to OEM design and assembly centers. Thailand's national semiconductor roadmap targets more than 230,000 highly skilled personnel over a 25-year period, showing that the country is treating semiconductor capability as a long-cycle industrial priority rather than a short policy window. Malaysia's New Incentive Framework became operational on March 1, 2026, and reshaped manufacturing support around electronics, semiconductor packaging, and precision engineering, which broadens the base of plants that consume code storage and boot memory. As these frameworks shorten location decisions for Tier-1 OEMs, they increase the installed base of electronics production lines that generate direct and repeat NOR Flash demand.

Formation And Growth Of Automotive Electronics Clusters In The Region

Automotive electronics clusters are driving the Southeast Asia NOR Flash Memory market higher, as every move toward smart cockpits, ADAS, EV power management, and OTA software increases demand for reliable firmware storage. Multi-Code Electronics and Huizhou Foryou General Electronics signed a manufacturing and development agreement in September 2025 to localize cockpit domain controllers and connected-vehicle technology across ASEAN, with MCE investing RM150 million to RM200 million (USD 34 million to USD 45 million) near Perodua's manufacturing hub. VinFast reached more than 60% EV localization in 2025 and is targeting 84% by 2026, implying increased procurement of automotive-grade memory for ECUs and battery management systems. Malaysia also has a structural advantage because its semiconductor export base and automotive development agenda are converging under national policies supported by the Malaysia Automotive, Robotics and IoT Institute. In practice, this means more vehicle programs in the region are moving from basic memory needs toward safety-qualified devices with stronger reliability and retention requirements. That shift raises entry barriers, concentrates approved vendor lists, and supports higher-value content in the Southeast Asia NOR Flash Memory market.

Heavy Dependence On Foundries Located Outside South East Asia

The biggest structural constraint on the South East Asia NOR Flash Memory market is that the region consumes large volumes of NOR Flash but does not control the wafer fabrication base that produces it. South East Asia still faces a persistent fab gap, with chipmaking concentrated in China and Taiwan even as the region tries to build a deeper semiconductor ecosystem. Earlier allocation shifts in China toward mature logic node expansion have already put pressure on NOR Flash output, tightening supply for assemblers in countries such as Vietnam and Malaysia. U.S.-Taiwan trade and investment commitments announced in January 2026 directed USD 250 billion in Taiwanese semiconductor investment toward the United States, reinforcing the view that new upstream fab capacity is not moving to Southeast Asia at scale. Because the qualified supplier base in NOR Flash is narrow, local manufacturers cannot easily diversify when allocation is tight. This leaves the Southeast Asia NOR Flash Memory market exposed to geopolitical shocks and supplier prioritization decisions for most of the forecast period.

Other drivers and restraints analyzed in the detailed report include:

1. Rising Trend Of Outsourcing In Wearable And Point-Of-Care Device Manufacturing
2. Accelerated Deployment Of 5G And Fiber-To-The-Home Network Infrastructure
3. Intensified Margin Pressures From Cost-Competitive Chinese Vendors

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Serial NOR Flash accounted for 62.1% of revenue in 2025, representing 62.1% of the South East Asia NOR Flash market share that year. It also posted the fastest projected CAGR among type segments at 7.5% for 2026-2031, showing that leadership is being reinforced rather than eroded. The segment aligns with the regional manufacturing base because SPI connectivity, lower pin counts, and compact board requirements match the microcontroller-heavy designs used in consumer electronics, communications equipment, and a broad range of industrial products. Execute-in-place capability also reduces the need for shadow RAM, which keeps bill-of-materials pressure under control in a region where cost discipline shapes product architecture. In 2026, Winbond continues to extend its higher-density serial NOR and automotive-grade product roadmap, with faster interfaces and low-power form factors that align with this demand pattern.

The practical outcome is that serial NOR serves both high-volume consumer platforms and newer edge devices without forcing major design changes across the Southeast Asia NOR Flash Memory market. Wearables, Wi-Fi modules, IoT endpoints, and smart appliances all benefit from the segment's space efficiency and standardized controller compatibility. That is why the Southeast Asia NOR Flash Memory industry continues to treat serial NOR as the default option for most new designs unless a specific bandwidth or legacy system condition points elsewhere. Parallel NOR Flash still has a role, but it is mostly tied to older industrial controllers, automotive displays, and boot-intensive systems where a wider bus remains operationally useful. Automotive-grade parallel offerings from Infineon and Winbond preserved a protected niche in 2024 for ECUs and infotainment platforms that still require that architecture. Even so, the long-term direction of the Southeast Asia NOR Flash Memory market remains clearly aligned with serial products, as most new regional assembly programs prioritize compact layouts, lower pin count, and easier platform reuse.

Quad SPI held the largest interface revenue share at 44.8% in 2025, reflecting its wide installation base across mainstream electronics assembly. Octal and xSPI are forecast to grow at the fastest CAGR of 7.7% from 2026 to 2031, indicating a steady shift in performance requirements as processors and vehicle systems demand higher read bandwidth. This split captures the current shape of the South East Asia NOR Flash market, where legacy volume and forward-looking design wins are moving at different speeds. Quad SPI remains deeply embedded because many existing microcontroller platforms already support it, and the installed base across communications modules and consumer products is large. That gives it continued volume strength even as engineering teams prepare for faster standards.

Octal and xSPI are gaining ground as real-time code execution becomes more common in automotive processors, AI-capable controllers, and higher-performance embedded systems in the Southeast Asia NOR Flash Memory market. Infineon's SEMPER portfolio supports Octal SPI and HYPERBUS with endurance and retention characteristics optimized for industrial and automotive use, demonstrating that interface upgrades are already aligned with demanding applications. STMicroelectronics also supports XSPI 8-bit and 16-bit configurations in its newer STM32N-series devices, confirming that controller ecosystems are now being built with xSPI readiness in mind. Single and dual SPI channels still matter in low-cost Bluetooth modules, IoT sensors, and entry wearables, especially in cost-sensitive markets such as Vietnam and Indonesia. Yet the direction of platform design is clear, and the South East Asia NOR Flash Memory market will increasingly reward suppliers that can support both the large Quad SPI base and the migration path toward Octal and xSPI.

The more than 32 to 64 megabit category held 27.7% of revenue in 2025, making it the largest density tier in the regional market. This band aligns closely with the firmware needs of mainstream Wi-Fi chips, Bluetooth SoCs, smart meters, and many low-to-mid-tier wearables, which explains its volume advantage in core assembly hubs. It also benefits from broad product catalogs and shorter procurement lead times, which matter for manufacturers running lean inventories. In that sense, the segment captures a large part of the installed base that has kept the Southeast Asia NOR Flash Memory market stable across consumer and communications demand cycles. It is the tier most closely tied to everyday electronics output rather than to specialized high-end applications.

At the top end, the greater than 256 megabit segment is projected to grow at a 7.3% CAGR from 2026 to 2031, which makes it the fastest-growing density range. AI-driven server demand is a major reason, because a GB200-based rack requires far more NOR Flash devices than a conventional rack and has begun to reallocate resources toward higher-capacity parts. Macronix stated that sampling of 3D NOR Flash devices is planned for the second half of 2026, with mass production targeted for 2027, which signals a direct industry response to density limits in traditional 2D NOR structures. Intermediate ranges from 8 megabit to 32 megabit remain important for IoT and portable diagnostics, while 128 megabit to 256 megabit supports network equipment, secure access devices, and vehicle subsystems. This produces a layered demand pattern in the South East Asia NOR Flash Memory market where no single density family can serve every growth pocket. It also means suppliers that span mainstream and high-capacity nodes are better placed to capture demand as purchasing shifts between consumer cycles, infrastructure build-outs, and AI-led allocation pressure.

Complete Report Scope:

• By Type (Value, Volume)
  • Serial NOR Flash
  • Parallel NOR Flash
• By Interface (Value)
  • SPI Single / Dual
  • Quad SPI
  • Octal and xSPI
• By Density (Value)
  • 2 Megabit and Less
  • More than 2 to 4 Megabit
  • More than 4 to 8 Megabit
  • More than 8 to 16 Megabit
  • More than 16 to 32 Megabit
  • More than 32 to 64 Megabit
  • More than 64 to 128 Megabit
  • More than 128 to 256 Megabit
  • More than 256 Megabit
• By Voltage (Value)
  • 3 V Class
  • 1.8 V Class
  • Wide-Voltage (1.65 V - 3.6 V)
  • Others - 1.2 V Class and Similar Sub-1.8 V (2.5 V, 5 V, etc.)
• By End-user Application (Value, Volume)
  • Consumer Electronics
  • Communication
  • Automotive
  • Industrial
  • Other End-user Applications
• By Process Technology Node (Value)
  • 90 nm and More
  • 65 nm
  • 55 nm (including 58 nm)
  • 45 nm
  • 28 nm and Below
• By Packaging Type (Value)
  • WLCSP / CSP
  • QFN / SOIC
  • BGA / FBGA
  • Other Packaging Types
• By Geography (Value, Volume)
  • Vietnam
  • Indonesia
  • Philippines
  • Thailand
  • Malaysia

List of Companies Covered in this Report:

1. Winbond Electronics Corporation
2. Macronix International Co. Ltd.
3. GigaDevice Semiconductor Inc.
4. Infineon Technologies AG
5. Micron Technology Inc.
6. Integrated Silicon Solution Inc.
7. Microchip Technology Inc.
8. Renesas Electronics Corporation
9. Elite Semiconductor Microelectronics Technology Inc.
10. Puya Semiconductor (Shanghai) Co. Ltd.
11. Samsung Semiconductor
12. Alliance Memory
13. AMIC Technology Corporation (NEW)
14. AP Memory Technology Co. Ltd. (NEW)
15. Yangtze Memory Technologies Co. Ltd. (YMTC)

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Government-Led Incentives Driving Expansion in Electronics Manufacturing
  • 4.2.2 Formation and Growth of Automotive Electronics Clusters in the Region
  • 4.2.3 Rising Trend of Outsourcing in Wearable and Point-of-Care Device Manufacturing
  • 4.2.4 Accelerated Deployment of 5G and Fiber-to-the-Home Network Infrastructure
  • 4.2.5 Supply-Chain Re-shoring Initiatives by Global Tier-1 OEMs
  • 4.2.6 Surging Demand for NOR Flash in Edge AI Microcontrollers
• 4.3 Market Restraints
  • 4.3.1 Heavy Dependence on Foundries Located Outside South East Asia
  • 4.3.2 Intensified Margin Pressures from Cost-Competitive Chinese Vendors
  • 4.3.3 Increased Adoption of Emerging Alternative Non-Volatile Memory Technologies
  • 4.3.4 Chronic Skilled-Labour Gaps in Sub-20 nm Lithography
• 4.4 Industry Value Chain Analysis
• 4.5 Impact of Macroeconomic Factors on the Market
• 4.6 Regulatory and Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitute Products
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Pricing Analysis
• 4.9 Investment Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE, VOLUME)

• 5.1 By Type (Value, Volume)
  • 5.1.1 Serial NOR Flash
  • 5.1.2 Parallel NOR Flash
• 5.2 By Interface (Value)
  • 5.2.1 SPI Single / Dual
  • 5.2.2 Quad SPI
  • 5.2.3 Octal and xSPI
• 5.3 By Density (Value)
  • 5.3.1 2 Megabit and Less
  • 5.3.2 More than 2 to 4 Megabit
  • 5.3.3 More than 4 to 8 Megabit
  • 5.3.4 More than 8 to 16 Megabit
  • 5.3.5 More than 16 to 32 Megabit
  • 5.3.6 More than 32 to 64 Megabit
  • 5.3.7 More than 64 to 128 Megabit
  • 5.3.8 More than 128 to 256 Megabit
  • 5.3.9 More than 256 Megabit
• 5.4 By Voltage (Value)
  • 5.4.1 3 V Class
  • 5.4.2 1.8 V Class
  • 5.4.3 Wide-Voltage (1.65 V - 3.6 V)
  • 5.4.4 Others - 1.2 V Class and Similar Sub-1.8 V (2.5 V, 5 V, etc.)
• 5.5 By End-user Application (Value, Volume)
  • 5.5.1 Consumer Electronics
  • 5.5.2 Communication
  • 5.5.3 Automotive
  • 5.5.4 Industrial
  • 5.5.5 Other End-user Applications
• 5.6 By Process Technology Node (Value)
  • 5.6.1 90 nm and More
  • 5.6.2 65 nm
  • 5.6.3 55 nm (including 58 nm)
  • 5.6.4 45 nm
  • 5.6.5 28 nm and Below
• 5.7 By Packaging Type (Value)
  • 5.7.1 WLCSP / CSP
  • 5.7.2 QFN / SOIC
  • 5.7.3 BGA / FBGA
  • 5.7.4 Other Packaging Types
• 5.8 By Geography (Value, Volume)
  • 5.8.1 Vietnam
  • 5.8.2 Indonesia
  • 5.8.3 Philippines
  • 5.8.4 Thailand
  • 5.8.5 Malaysia

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Winbond Electronics Corporation
  • 6.4.2 Macronix International Co. Ltd.
  • 6.4.3 GigaDevice Semiconductor Inc.
  • 6.4.4 Infineon Technologies AG
  • 6.4.5 Micron Technology Inc.
  • 6.4.6 Integrated Silicon Solution Inc.
  • 6.4.7 Microchip Technology Inc.
  • 6.4.8 Renesas Electronics Corporation
  • 6.4.9 Elite Semiconductor Microelectronics Technology Inc.
  • 6.4.10 Puya Semiconductor (Shanghai) Co. Ltd.
  • 6.4.11 Samsung Semiconductor
  • 6.4.12 Alliance Memory
  • 6.4.13 AMIC Technology Corporation (NEW)
  • 6.4.14 AP Memory Technology Co. Ltd. (NEW)
  • 6.4.15 Yangtze Memory Technologies Co. Ltd. (YMTC)

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet Need Analysis